Abstract: Method of welding two hollow ceramic half-components containing an organic binder whereby each half-component is first loaded into a die, the jointing planes of the two half-components are then brought into contact by bringing together the two dies, working pressure is thereafter applied to one of the half-components in a direction perpendicular to the jointing planes and vibration is simultaneously applied to the other half-component in a direction parallel to the jointing planes to effect the welding of the two half-components by interpenetration. The two dies are then separated and the joined monobloc component is removed and sintered without altering the component's monolithic quality.