Abstract: Various methods and systems are provided for an electroacoustic module (EAM) for a probe. In one example, the EAM may be formed of a microelectromechanical systems (MEMS) wafer bonded to a complementary metal-oxide semiconductor (CMOS) wafer and having a front side formed of a surface of the MEMS wafer. The surface of the MEMS wafer may include an active area of capacitive micromachined ultrasound transducer (CMUT) cells and input/output (I/O) regions of output contacts arranged adjacent to the active area.

Abstract: Various methods and systems are provided for an electro-acoustic module for a transducer probe. In one example, the electro-acoustic module may include an acoustic stack and at least one application-specific integrated circuit (ASIC) electrically coupled to the acoustic stack by an interconnect having a fan-out architecture. The electro-acoustic module may have an active aperture substantially equal to an overall size of the electro-acoustic module in at least one or an azimuth and an elevation direction.

Abstract: A barrel for an electrically-controllable variable focal length lens in a button-battery type housing includes a hollow isolating cylindrical tube with an inner diameter substantially equal to that of the lens housing, with one or bumps extending radially towards the inside of the tube and forming bearing surfaces for the lens periphery in a same radial plane. First metallizations extend on at least one of the bearing surfaces and therefrom into first channels formed in the internal wall of the tube towards at least one end of the tube, and second metallizations, each of which forms a contact area on the internal surface of the tube to bear against the lateral surface of the lens and extends towards at least one end of the cylinder.

Abstract: A semiconductor package includes a flat metal leadframe including spaced apart portions, at least some of which constitute electrical connection leads. A filling material fills the spaces that separate the spaced apart portions of the leadframe to form a plate before fastening an integrated circuit chip to the front of the leadframe. Electrical connections are made between the chip and the electrical connection leads. The chip is then encapsulated on the front of the leadframe using a formed or attached encapsulant.

Abstract: A semiconductor packaging unit mounts onto a board by solder joints. The unit includes, disposed along one axis, a semiconductor component having on a rear face protruding electrical connection lugs designed to be soldered onto the board and an external cage surrounding the component and having a rear edge designed to be soldered onto the board and a front part through which a front part of the component passes. The component and the cage are designed to axially slide with respect to one another in such a manner as to be brought into their soldering position with respect to the board and having complementary holding parts coming into contact and designed to hold them with respect to one another when they are axially removed from the soldering position and to free them with respect to one another when they are at the soldering position.

Abstract: A semiconductor packaging unit mounts onto a board by solder joints. The unit includes, disposed along one axis, a semiconductor component having on a rear face protruding electrical connection lugs designed to be soldered onto the board and an external cage surrounding the component and having a rear edge designed to be soldered onto the board and a front part through which a front part of the component passes. The component and the cage are designed to axially slide with respect to one another in such a manner as to be brought into their soldering position with respect to the board and having complementary holding parts coming into contact and designed to hold them with respect to one another when they are axially removed from the soldering position and to free them with respect to one another when they are at the soldering position.

Abstract: A barrel for an electrically-controllable variable focal length lens in a button-battery type housing includes a hollow isolating cylindrical tube with an inner diameter substantially equal to that of the lens housing, with one or bumps extending radially towards the inside of the tube and forming bearing surfaces for the lens periphery in a same radial plane. First metallizations extend on at least one of the bearing surfaces and therefrom into first channels formed in the internal wall of the tube towards at least one end of the tube, and second metallizations, each of which forms a contact area on the internal surface of the tube to bear against the lateral surface of the lens and extends towards at least one end of the cylinder.

Abstract: The leadframe has a perforation to form, between a central platform and a peripheral part located a certain distance apart, radiating elongate leads. The leadframe has, on its rear face that comes into contact with a bearing surface of a mold, at least one recess and a groove for connecting this recess to the perforation.

Abstract: A semiconductor package includes a flat metal leadframe including spaced apart portions, at least some of which constitute electrical connection leads. A filling material fills the spaces that separate the spaced apart portions of the leadframe to form a plate before fastening an integrated circuit chip to the front of the leadframe. Electrical connections are made between the chip and the electrical connection leads. The chip is then encapsulated on the front of the leadframe using a formed or attached encapsulant.

Abstract: A semiconductor package is provided that includes a flat leadframe having front and rear faces. The leadframe includes a central platform and elongate electrical connection leads distributed around this platform. Electrical connection wires connect the chip to the front face of the leads, and encapsulation means encapsulates the chip such that the rear face of the leadframe is visible. The electrical connection leads include an inner end part and an outer end part, the rear faces of the inner and outer end parts lie in the plane of the rear face of the leadframe, and the inner and outer end parts are connected by a branch whose rear face is set back with respect to the plane of the rear face of the leadframe so as to define a rear recess. The electrical connection wires are connected to the leads on the front face of their inner end part.

Abstract: The leadframe has a perforation to form, between a central platform and a peripheral part located a certain distance apart, radiating elongate leads. The leadframe has, on its rear face that comes into contact with a bearing surface of a mold, at least one recess and a groove for connecting this recess to the perforation.

Abstract: A semiconductor package is provided that includes a flat leadframe having front and rear faces. The leadframe includes a central platform and elongate electrical connection leads distributed around this platform. Electrical connection wires connect the chip to the front face of the leads, and encapsulation means encapsulates the chip such that the rear face of the leadframe is visible. The electrical connection leads include an inner end part and an outer end part, the rear faces of the inner and outer end parts lie in the plane of the rear face of the leadframe, and the inner and outer end parts are connected by a branch whose rear face is set back with respect to the plane of the rear face of the leadframe so as to define a rear recess. The electrical connection wires are connected to the leads on the front face of their inner end part.