Patents by Inventor Jean-Luc Erb
Jean-Luc Erb has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250062091Abstract: Circuits and methods for increasing the long-term reliability and performance of phase change material (PCM) switches. To overcome the effects of electromigration damage of the resistive heater(s) of a PCM switch and of the PCM itself, and thus improve long-term performance and reliability, embodiments apply an AC control pulse of equal power to a conventional DC control pulse. An embodiment encompasses a PCM switch, including a PCM region including first and second signal ports configured to be coupled to a signal source; a resistive heater adjacent the PCM region and including first and second heater control signal ports; and a source of AC control pulses coupled to the first and second heater control signal ports, the AC control pulses having a first power profile to transform the PCM region into a low resistance state and a second power profile to transform the PCM region into a high resistance state.Type: ApplicationFiled: August 18, 2023Publication date: February 20, 2025Inventors: Jean-Luc Erb, Bryan Lee Hash, Jeffrey A. Dykstra
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Patent number: 12231107Abstract: Circuits and methods that provide wider bandwidth and smaller IM inductances for phase change material (PCM) based RF switch networks. The present invention recognizes that it is beneficial to consider the total high parasitic capacitance to ground of the various PCM switches in an RF switch network as constituting two or more separate capacitive contributions. This leads to several “split capacitance” concepts, including signal-path splitting, switch-block splitting, stacked-switch splitting, and splitting parasitic capacitances due to layout discontinuities, in which compensating impedance matching inductances are inserted between additive capacitances.Type: GrantFiled: June 21, 2023Date of Patent: February 18, 2025Assignee: Murata Manufacturing Co., Ltd.Inventor: Jean-Luc Erb
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Publication number: 20250022775Abstract: Three-dimensional (3-D) integrated circuit structures and circuits that enable high performance FET switch arrays while consuming less planar area than conventional 2-D IC dies. In one embodiment, an integrated FET switch circuit includes a first wafer/die including a first set of groups of FET cells, and a second wafer/die joined to the first wafer/die through hybrid bonding interconnects and including a second set of groups of FET cells, wherein a first side drain bus of each group in the first wafer/die is connected through the hybrid bonding interconnects to a second side source bus of a first corresponding group in the second wafer/die; and wherein a second side source bus of each group in the first wafer/die is connected through the hybrid bonding interconnects to a first side drain bus of a second corresponding group in the second wafer/die.Type: ApplicationFiled: September 13, 2024Publication date: January 16, 2025Inventors: Shishir RAY, Sinan GOKTEPELI, Eric S. SHAPIRO, Simon Edward WILLARD, Kouassi Sebastien KOUASSI, Kazuhiko SHIBATA, Jean-Luc ERB, Jeffrey A. DYKSTRA
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Publication number: 20240007074Abstract: Circuits and methods that provide wider bandwidth and smaller IM inductances for phase change material (PCM) based RF switch networks. The present invention recognizes that it is beneficial to consider the total high parasitic capacitance to ground of the various PCM switches in an RF switch network as constituting two or more separate capacitive contributions. This leads to several “split capacitance” concepts, including signal-path splitting, switch-block splitting, stacked-switch splitting, and splitting parasitic capacitances due to layout discontinuities, in which compensating impedance matching inductances are inserted between additive capacitances.Type: ApplicationFiled: June 21, 2023Publication date: January 4, 2024Inventor: Jean-Luc Erb
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Patent number: 11716067Abstract: Circuits and methods that provide wider bandwidth and smaller IM inductances for phase change material (PCM) based RF switch networks. The present invention recognizes that it is beneficial to consider the total high parasitic capacitance to ground of the various PCM switches in an RF switch network as constituting two or more separate capacitive contributions. This leads to several “split capacitance” concepts, including signal-path splitting, switch-block splitting, stacked-switch splitting, and splitting parasitic capacitances due to layout discontinuities, in which compensating impedance matching inductances are inserted between additive capacitances.Type: GrantFiled: September 23, 2021Date of Patent: August 1, 2023Assignee: pSemi CorporationInventor: Jean-Luc Erb
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Publication number: 20230090893Abstract: Circuits and methods that provide wider bandwidth and smaller IM inductances for phase change material (PCM) based RF switch networks. The present invention recognizes that it is beneficial to consider the total high parasitic capacitance to ground of the various PCM switches in an RF switch network as constituting two or more separate capacitive contributions. This leads to several “split capacitance” concepts, including signal-path splitting, switch-block splitting, stacked-switch splitting, and splitting parasitic capacitances due to layout discontinuities, in which compensating impedance matching inductances are inserted between additive capacitances.Type: ApplicationFiled: September 23, 2021Publication date: March 23, 2023Inventor: Jean-Luc Erb
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Patent number: 8680952Abstract: There is provided an improved bandpass filter having multiple passbands, and in one embodiment, two independent passbands are provided by a single filter. Embodiments of the present invention support communication architectures with several frequency bands without requiring one signal path per band, thus realizing improvements in size, cost, and weight. One aspect of the invention utilizes strongly overcoupled resonators to achieve multiple passband response, and in various embodiments, single-ended or differential mode inputs and outputs are accommodated.Type: GrantFiled: December 30, 2008Date of Patent: March 25, 2014Assignee: TDK CorporationInventor: Jean-Luc Erb
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Patent number: 8620250Abstract: A filter may be constructed from multiple acoustic elements in parallel. A filtering method may comprise passing a signal to be filtered through such parallel acoustic elements. Such filtering may be applicable to communication devices.Type: GrantFiled: October 27, 2011Date of Patent: December 31, 2013Assignee: Hollinworth Fund, L.L.C.Inventor: Jean-Luc Erb
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Patent number: 8576024Abstract: A device includes a plurality of electrode actuated acoustic resonators coupled to form complementary paths to operate as a filter. Each acoustic resonator has an electrical input and an electrical output that contributes to a static capacitance. A compensation impedance is coupled to at least one of the paths to reduce adverse effects from the static capacitances of the acoustic resonators.Type: GrantFiled: November 19, 2010Date of Patent: November 5, 2013Assignee: Hollinworth Fund, L.L.C.Inventors: Jean-Luc Erb, Maha Achour
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Publication number: 20120108167Abstract: A filter may be constructed from multiple acoustic elements in parallel. A filtering method may comprise passing a signal to be filtered through such parallel acoustic elements. Such filtering may be applicable to communication devices.Type: ApplicationFiled: October 27, 2011Publication date: May 3, 2012Applicant: HOLLINWORTH FUND, L.L.C.Inventor: Jean-Luc Erb
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Publication number: 20110193656Abstract: A device includes a plurality of electrode actuated acoustic resonators coupled to form complementary paths to operate as a filter. Each acoustic resonator has an electrical input and an electrical output that contributes to a static capacitance. A compensation impedance is coupled to at least one of the paths to reduce adverse effects from the static capacitances of the acoustic resonators.Type: ApplicationFiled: November 19, 2010Publication date: August 11, 2011Applicant: RAYSPAN CORPORATIONInventors: Jean-Luc Erb, Maha Achour
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Publication number: 20100164651Abstract: There is provided an improved bandpass filter having multiple passbands, and in one embodiment, two independent passbands are provided by a single filter. Embodiments of the present invention support communication architectures with several frequency bands without requiring one signal path per band, thus realizing improvements in size, cost, and weight. One aspect of the invention utilizes strongly overcoupled resonators to achieve multiple passband response, and in various embodiments, single-ended or differential mode inputs and outputs are accommodated.Type: ApplicationFiled: December 30, 2008Publication date: July 1, 2010Inventor: Jean-Luc Erb
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Patent number: 7307494Abstract: One aspect of the invention provides a signal separating device comprising a first and a second circuit branch connected to an antenna port, the first circuit branch comprising a filter for passing signals in a first frequency band, and the second circuit branch comprising a filter for passing signals in a second frequency band. The first and second circuit branches being arranged so that a respective reactive impedance is presented to the antenna port in both said first and said second frequency bands. The device further comprises an impedance matching circuit at the antenna port arranged to substantially to cancel out the respective reactive impedances. In the preferred embodiment, each circuit branch presents a respective shunt capacitance to the antenna port when out-of-band and the matching circuit comprises a shunt inductor at the antenna port.Type: GrantFiled: March 25, 2005Date of Patent: December 11, 2007Assignee: TDK CorporationInventor: Jean-Luc Erb
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Patent number: 7250828Abstract: A distributed backwards-wave balun comprising first and second pairs of coupled transmission line sections having one line section of the first coupled pair connected in series with one line section of the second coupled pair. A differential port is connected across the outer ends of the series-connected line sections and a single-ended port is connected to the inner end of the other line section of one of the coupled pairs. The balun includes an inductive load, connected in parallel with the differential port, in which the electrical length of the coupled line sections is less than one quarter of the wavelength of the centre frequency of the operating band of the balun.Type: GrantFiled: March 16, 2005Date of Patent: July 31, 2007Assignee: TDK CorporationInventor: Jean-Luc Erb
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Publication number: 20060208824Abstract: A distributed backwards-wave balun comprising first and second pairs of coupled transmission line sections 10A, 10B and 12A, 12B having one line section 10A of the first coupled pair connected in series with one line section 12A of the second coupled pair. A differential port 14 is connected across the outer ends of the series-connected line sections 10A, 12A and a single-ended port 16 is connected to the inner end of the other line section 12B of one of the coupled pairs. The balun includes an inductive load 40, connected in parallel with the differential port 14, whereby the electrical length of the coupled line sections 10A, 10B and 12A, 12B is less than one quarter of the wavelength of the centre frequency of the operating band of the balun.Type: ApplicationFiled: March 16, 2005Publication date: September 21, 2006Applicant: TDK CORPORATIONInventor: Jean-Luc Erb
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Publication number: 20050219010Abstract: One aspect of the invention provides a signal separating device comprising a first and a second circuit branch connected to an antenna port, the first circuit branch comprising a filter for passing signals in a first frequency band, and the second circuit branch comprising a filter for passing signals in a second frequency band. The first and second circuit branches being arranged so that a respective reactive impedance is presented to the antenna port in both said first and said second frequency bands. The device further comprises an impedance matching circuit at the antenna port arranged to substantially to cancel out the respective reactive impedances. In the preferred embodiment, each circuit branch presents a respective shunt capacitance to the antenna port when out-of-band and the matching circuit comprises a shunt inductor at the antenna port.Type: ApplicationFiled: March 25, 2005Publication date: October 6, 2005Applicant: TDK CorporationInventor: Jean-Luc Erb