Abstract: A method for fabricating an optoelectronic component includes at least one photodiode, the steps of the method making it possible to move the electric carrier collection field to the layer least sensitive to radiation, thus reducing the influence of irradiation on the dark current.

Abstract: A device for detecting infrared radiation, includes at least one pixel having an axis in a direction Z, the pixel comprising a first absorbent planar structure comprising at least one semiconductor layer. The composition of the materials used to produce the at least one layer of the first absorbent planar structure is chosen such that: the first absorbent planar structure has an effective valence band formed by a plurality of energy levels. Each energy level is occupied by one of: a first type of positive charge carrier, called heavy holes, having a first effective mass; or a second type of positive charge carrier, called light holes, having a second effective mass strictly less than the first effective mass. The maximum energy level of the effective valence band is occupied by light holes along the axis of the pixel.

Abstract: A device for detecting infrared radiation includes at least one pixel comprising: a first superlattice composed of the repetition of an elementary group comprising: a first layer having a first bandgap and a first conduction-band minimum; at least a second layer having a second bandgap and a second conduction-band minimum strictly lower than the first conduction-band minimum; a third layer having a third bandgap narrower than the first and second bandgaps and a third conduction-band minimum strictly lower than the second conduction-band minimum. The elementary group is produced in a first stacking configuration in the following order: the second layer, the third layer, the second layer, then the first layer; or in a second stacking configuration such that the third layer is confined between the first and second layers.

Abstract: A radiation detector includes a stack of layers along a direction Z, the stack comprising: an absorbent layer, a first contact layer, an assembly consisting of at least one intermediate layer, referred to as an intermediate assembly, an upper layer, the first contact layer and the upper layer having a plurality of detection zones and separation zones, a detection zone corresponding to a pixel of the detector, a passivation layer made from a dielectric material, arranged on the upper layer and having openings at the level of the detection zones of the upper layer, the semiconductor layers of the stack being compounds based on elements of groups IIIA and VA of the periodic table of the elements, the second material comprising the VA element antimony and the third material not comprising the VA element antimony.

Abstract: A hybrid optical and/or electronic system includes a first planar structure having a first functionality and made of at least one first material, and a second planar structure having a second functionality and made of at least one second material different from the first material, the first and second planar structures being assembled by an assembly layer, at least one of the planar structures being disposed on a rigid substrate, the system comprising at least one active zone used for implementing the functionalities, and at least one neutral zone not used to implement the functionalities and disposed at the periphery of the active zone, the system also comprising recesses made in at least one neutral zone of the planar structure which is not disposed on the rigid substrate and is referred to as hollowed-out planar structure.

Abstract: A process for fabricating a hybrid optical detector, includes the steps of: assembling, via an assembly layer, on the one hand an absorbing structure and on the other hand a read-out circuit, locally etching, through the absorbing structure, the assembly layer and the read-out circuit up to the contacts, so as to form electrical via-holes, depositing a protective layer on the walls of the via-holes, producing a doped region of a second doping type different from the first doping type by diffusing a dopant into the absorbing structure through the protective layer, the region extending annularly around the via-holes so as to form a diode, depositing a metallization layer on the walls of the via-holes allowing the doped region to be electrically connected to the contact.

Abstract: An optical detector that is sensitive in at least two infrared wavelength ranges: first spectral band and second spectral band; and having a set of pixels, comprising: an absorbent structure disposed on a lower face of a substrate and comprising a stack of at least one absorbent layer made of semi-conductor material; the detector further comprising a plurality of dielectric resonators on the upper surface of said substrate forming an upper surface metasurface, the metasurface configured to diffuse, deflect and focus in the pixels of the detector in a resonant manner, when illuminated by the incident light, a first beam having at least one first wavelength included in the first spectral band and a second beam having at least one second wavelength included in the second band, the metasurface also being configured so that said first and second beams are focused on different pixels of the detector.

Abstract: An optical detector that is sensitive in at least two infrared wavelength ranges: first spectral band and second spectral band; and having a set of pixels, comprising: an absorbent structure disposed on a lower face of a substrate and comprising a stack of at least one absorbent layer made of semi-conductor material; the detector further comprising a plurality of dielectric resonators on the upper surface of said substrate forming an upper surface metasurface, the metasurface configured to diffuse, deflect and focus in the pixels of the detector in a resonant manner, when illuminated by the incident light, a first beam having at least one first wavelength included in the first spectral band and a second beam having at least one second wavelength included in the second band, the metasurface also being configured so that said first and second beams are focused on different pixels of the detector.

Abstract: The invention relates to a radiation detector element (10) comprising a stack (15) of layers superimposed in a stacking direction (Z), the stack (15) having a first face (25) and a second face (30) and comprising a radiation-absorbing layer (35) consisting of a first semiconductor material (M1) having a first band gap value and at least one barrier layer (40) consisting of a second semiconductor material (M2) having a second band gap value, the second band gap value being strictly higher than the first band gap value. The second face (30) has at least one strip (105) defined in the stacking direction (Z) by the barrier layer (40), the strip (105) consisting of the second semiconductor material (M2) and having a doping of the first type and a free carrier density higher than or equal to 1.1017 cm?3.

Abstract: Disclosed is a photodetector which includes, in series along a stacking direction: a first layer forming a substrate of a first semiconductor material; a second layer forming a photoabsorbent layer of a second semiconductor material having a second gap; a third layer forming a barrier layer of a third semiconductor material; and a fourth layer forming a window layer of a fourth semiconductor material, the first material, the third material and the fourth material each having a gap larger than the second gap, the fourth material being n-doped or non-doped and the third material being non-doped or lightly p-doped when the second material is n-doped, and the fourth material being p-doped or non-doped and the third material being non-doped or lightly n-doped when the second material is p-doped.

Abstract: A process for fabricating a hybrid optical detector, includes the steps of: assembling, via an assembly layer, on the one hand an absorbing structure and on the other hand a read-out circuit, locally etching, through the absorbing structure, the assembly layer and the read-out circuit up to the contacts, so as to form electrical via-holes, depositing a protective layer on the walls of the via-holes, producing a doped region of a second doping type different from the first doping type by diffusing a dopant into the absorbing structure through the protective layer, the region extending annularly around the via-holes so as to form a diode, depositing a metallization layer on the walls of the via-holes allowing the doped region to be electrically connected to the contact.

Abstract: A hybrid optical and/or electronic system includes a first planar structure having a first functionality and made of at least one first material, and a second planar structure having a second functionality and made of at least one second material different from the first material, the first and second planar structures being assembled by an assembly layer, at least one of the planar structures being disposed on a rigid substrate, the system comprising at least one active zone used for implementing the functionalities, and at least one neutral zone not used to implement the functionalities and disposed at the periphery of the active zone, the system also comprising recesses made in at least one neutral zone of the planar structure which is not disposed on the rigid substrate and is referred to as hollowed-out planar structure.

Abstract: The invention relates to a radiation detector comprising a stack of superimposed layers successively comprising: an absorbent layer configured to absorb the radiation and made from a first semiconductor material, a screen charges layer made from a semiconductor material having a second bandgap value, a transition layer made from a semiconductor material having a third bandgap value, and a transition layer made from a semiconductor material having a third bandgap value, the absorbent layer and the screen charges layer having a doping of a first type, the first window layer having a doping of a second type, a dopant density of the window layer being greater than the dopant density of the transition layer.

Abstract: The invention relates to a method for manufacturing a photodetector able to operate for the photodetection of infrared electromagnetic waves, comprising a stack of thin layers placed on top of one another. The method includes obtaining a first assembly (E1) of stacked layers, forming a detection assembly, comprising a first substrate layer, a photoabsorbent layer, a barrier layer and at least one contact layer, and a second assembly (E2) of stacked layers forming a reading circuit, comprising at least one second substrate layer and a multiplexing layer. The first and second assemblies are glued between the contact layer of the first assembly and the multiplexing layer of the second assembly. Etching through the second assembly makes it possible to obtain a plurality of interconnect vias, then p or n doping of zones of the first contact layer of the first assembly through the interconnect vias.

Abstract: Disclosed is a radiation detector element including a stack of layers superimposed in a stacking direction, the stack having a first face and a second face and including a radiation-absorbing layer consisting of a first semiconductor material having a first band gap value and at least one barrier layer consisting of a second semiconductor material having a second band gap value, the second band gap value being strictly greater than the first band gap value. The stack further delimits a primary hole traversing each of the layers of the stack, the primary hole receiving at least part of a primary electrode. The barrier layer includes a first conducting zone having a free carrier density greater than or equal to 1.1017/cm?3.

Abstract: The invention relates to a radiation detector comprising a stack of superimposed layers successively comprising: an absorbent layer configured to absorb the radiation and made from a first semiconductor material, a screen charges layer made from a semiconductor material having a second bandgap value, a transition layer made from a semiconductor material having a third bandgap value, and a transition layer made from a semiconductor material having a third bandgap value, the absorbent layer and the screen charges layer having a doping of a first type, the first window layer having a doping of a second type, a dopant density of the window layer being greater than the dopant density of the transition layer.

Abstract: The invention relates to a method for manufacturing a photodetector able to operate for the photodetection of infrared electromagnetic waves, comprising a stack of thin layers placed on top of one another. The method includes obtaining a first assembly (E1) of stacked layers, forming a detection assembly, comprising a first substrate layer, a photoabsorbent layer, a barrier layer and at least one contact layer, and a second assembly (E2) of stacked layers forming a reading circuit, comprising at least one second substrate layer and a multiplexing layer. The first and second assemblies are glued between the contact layer of the first assembly and the multiplexing layer of the second assembly. Etching through the second assembly makes it possible to obtain a plurality of interconnect vias, then p or n doping of zones of the first contact layer of the first assembly through the interconnect, vias.

Abstract: Disclosed is a radiation detector element including a stack of layers superimposed in a stacking direction, the stack having a first face and a second face and including a radiation-absorbing layer consisting of a first semiconductor material having a first band gap value and at least one barrier layer consisting of a second semiconductor material having a second band gap value, the second band gap value being strictly greater than the first band gap value. The stack further delimits a primary hole traversing each of the layers of the stack, the primary hole receiving at least part of a primary electrode. The barrier layer includes a first conducting zone having a free carrier density greater than or equal to 1.1017/cm?3.

Abstract: The invention relates to a radiation detector element (10) comprising a stack (15) of layers superimposed in a stacking direction (Z), the stack (15) having a first face (25) and a second face (30) and comprising a radiation-absorbing layer (35) consisting of a first semiconductor material (M1) having a first band gap value and at least one barrier layer (40) consisting of a second semiconductor material (M2) having a second band gap value, the second band gap value being strictly higher than the first band gap value. The second face (30) has at least one strip (105) defined in the stacking direction (Z) by the barrier layer (40), the strip (105) consisting of the second semiconductor material (M2) and having a doping of the first type and a free carrier density higher than or equal to 1.1017 cm?3.

Abstract: Disclosed is a photodetector which includes, in series along a stacking direction: a first layer forming a substrate of a first semiconductor material; a second layer forming a photoabsorbent layer of a second semiconductor material having a second gap; a third layer forming a barrier layer of a third semiconductor material; and a fourth layer forming a window layer of a fourth semiconductor material, the first material, the third material and the fourth material each having a gap larger than the second gap, the fourth material being n-doped or non-doped and the third material being non-doped or lightly p-doped when the second material is n-doped, and the fourth material being p-doped or non-doped and the third material being non-doped or lightly n-doped when the second material is p-doped.