Abstract: A method and apparatus for reducing the pressure in an enclosure are provided. The method includes at least one primary pump on the outlet side and one secondary pump on the inlet side connected in series in the flow path of the pumped gases and driven in the same rotation direction by a first electric motor and a second electric motor, respectively, controlled by an electronic control module for modifying the speeds of the two electric motors independently, and includes at least one step, during reducing the pressure in the enclosure, of progressively increasing the rotation speed of the secondary pump in accordance with a rotation speed variation law of the secondary pump and at the same time progressively reducing the rotation speed of the primary pump in accordance with a rotation speed variation law of the primary pump.

Abstract: A transport pod (1) of the invention for a mask or a semiconductor wafer (2) comprises a leakproof peripheral wall (3) surrounding an inside space (4) receiving the mask or the semiconductor wafer (2). Thermally conductive support means (11) hold the mask or the semiconductor wafer (2). A cold plate (7) thermally coupled to a cold source (8) generates a temperature gradient facing the main face (6) of the mask or the semiconductor wafer (2) that is to be protected against particulate pollution. The cold plate (7) is held by connection means (7b) including thermal insulation means (7c). An on-board energy source (9) powers the cold source (8). This significantly reduces deposition of polluting particles on the main face (6) of the mask or the semiconductor wafer (2).

Abstract: Apparatus of the invention for transporting substrates (3) comprises a mini-environment enclosure (1) that is movable and that can be coupled to a conditioning station (22). The mini-environment enclosure (1) includes a micropump (12) whose inlet is connected to an inside cavity (2) that is to contain the substrate (3) to be transported. An energy supply (16) is also provided in the mini-environment enclosure (1) to power the micropump (12). The mini-environment enclosure (1) comprises a peripheral shell (4) open to two opposite main faces (5, 6), and including a closable side opening (7). A first main wall (8) is fitted to close the first main face (5) in leaktight manner. A second main wall (9) is fitted and secured to close the second main face (6) in leaktight manner. The first and second main walls are disposed in planes parallel to the plane containing the substrate.

Abstract: A method and apparatus for reducing the pressure in an enclosure are provided. The method includes at least one primary pump on the outlet side and one secondary pump on the inlet side connected in series in the flow path of the pumped gases and driven in the same rotation direction by a first electric motor and a second electric motor, respectively, controlled by an electronic control module for modifying the speeds of the two electric motors independently, and includes at least one step, during reducing the pressure in the enclosure, of progressively increasing the rotation speed of the secondary pump in accordance with a rotation speed variation law of the secondary pump and at the same time progressively reducing the rotation speed of the primary pump in accordance with a rotation speed variation law of the primary pump.

Abstract: A vacuum pump of the invention comprises, in a common pump body (100): molecular drag pump stages (5) in series with regenerative pump stages (9). The molecular drag pump stages (5) comprise a molecular drag rotor (5a) including a blind axial cavity (5c) open towards the downstream end, and the motor (7) is housed at least in part in said blind axial cavity (5c). The drive shaft (8) is coupled via its upstream end (8a) to the molecular drag rotor (5a), and it is coupled via its downstream portion (8b) to the regenerative rotor (9a). The motor (7) is secured to the central segment of the drive shaft (8). This provides a universal pump of small size, enabling pumping to be performed from 1000 mbar down to 10?8 mbar, and suitable for being placed in the vicinity of a vacuum chamber.

Abstract: A vacuum pumping device of the invention comprises a motor (1) driving a multi-stage dry mechanical pump (2) in which the stages (5, 6, 7, 8) are connected successively in parallel and then in series in a plurality of successive configurations, each of which is selected to optimize the pumping speed in the current pressure range. This makes it possible to lower pressure inside an enclosure (100) quickly while reducing the volume of the pump and the energy consumed by the pump by about 40% compared with a traditional pump having a speed that is sufficient to obtain the same rapidity of pumping.

Abstract: The EUV radiation source of the invention comprises an irradiation chamber (1) containing an irradiation zone (3) into which a stream of radiation-generator material is generated such as a flow of xenon propagating along a direction (II—II) extending transversely relative to an optical axis (I—I). The irradiation zone (3) is in the proximity of a diaphragm (4) oriented on the optical axis (I—I) and putting the irradiation chamber (1) into communication with a transmission chamber (2). Power laser beams (5, 6) strike the stream of radiation-generator material in the irradiation zone (3) and produce EUV radiation which propagates through the diaphragm (4) and which is conditioned in the transmission chamber (2) by elliptical mirrors (13). Differential pumps (11, 12) maintain a pressure P2 in the transmission chamber (2) that is well below the pressure P1 in the irradiation chamber (1).

Abstract: A transport pod (1) of the invention for a mask or a semiconductor wafer (2) comprises a leakproof peripheral wall (3) surrounding an inside space (4) receiving the mask or the semiconductor wafer (2). Thermally conductive support means (11) hold the mask or the semiconductor wafer (2). A cold plate (7) thermally coupled to a cold source (8) generates a temperature gradient facing the main face (6) of the mask or the semiconductor wafer (2) that is to be protected against particulate pollution. The cold plate (7) is held by connection means (7b) including thermal insulation means (7c). An on-board energy source (9) powers the cold source (8). This significantly reduces deposition of polluting particles on the main face (6) of the mask or the semiconductor wafer (2).

Abstract: Apparatus of the invention for transporting substrates (3) comprises a mini-environment enclosure (1) that is movable and that can be coupled to a conditioning station (22). The mini-environment enclosure (1) includes a micropump (12) whose inlet is connected to an inside cavity (2) that is to contain the substrate (3) to be transported. An energy supply (16) is also provided in the mini-environment enclosure (1) to power the micropump (12). The mini-environment enclosure (1) comprises a peripheral shell (4) open to two opposite main faces (5, 6), and including a closable side opening (7). A first main wall (8) is fitted to close the first main face (5) in leaktight manner. A second main wall (9) is fitted and secured to close the second main face (6) in leaktight manner. The first and second main walls are disposed in planes parallel to the plane containing the substrate.

Abstract: The EUV radiation source of the invention comprises an irradiation chamber (1) containing an irradiation zone (3) into which a stream of radiation-generator material is generated such as a flow of xenon propagating along a direction (II-II) extending transversely relative to an optical axis (I-I). The irradiation zone (3) is in the proximity of a diaphragm (4) oriented on the optical axis (I-I) and putting the irradiation chamber (1) into communication with a transmission chamber (2). Power laser beams (5, 6) strike the stream of radiation-generator material in the irradiation zone (3) and produce EUV radiation which propagates through the diaphragm (4) and which is conditioned in the transmission chamber (2) by elliptical mirrors (13). Differential pumps (11, 12) maintain a pressure P2 in the transmission chamber (2) that is well below the pressure P1 in the irradiation chamber (1).

Abstract: A vacuum pump of the invention comprises, in a common pump body (100): molecular drag pump stages (5) in series with regenerative pump stages (9). The molecular drag pump stages (5) comprise a molecular drag rotor (5a) including a blind axial cavity (5c) open towards the downstream end, and the motor (7) is housed at least in part in said blind axial cavity (5c). The drive shaft (8) is coupled via its upstream end (8a) to the molecular drag rotor (5a), and it is coupled via its downstream portion (8b) to the regenerative rotor (9a). The motor (7) is secured to the central segment of the drive shaft (8). This provides a universal pump of small size, enabling pumping to be performed from 1000 mbar down to 10?8 mbar, and suitable for being placed in the vicinity of a vacuum chamber.

Abstract: The invention concerns a pumping unit wherein the vacuum pump (100) is driven by a motor (3, 4) comprised in a common monobloc housing forming motor housing (5) and oil pan (18) containing a gear assembly (17) for coupling two parallel pump rotors (14). To complement the sealing conditions provided by a dynamic seal (6), the motor stator (4) consists of an electric coil embedded in an oil-tight and gas-tight resin, thereby not requiring other more expensive and bulky sealing means, reducing production cost and enhancing the pumping unit dependability.

Abstract: The invention concerns a pumping unit wherein the vacuum pump (100) is driven by a motor (3, 4) comprised in a common monobloc housing forming motor housing (5) and oil pan (18) containing a gear assembly (17) for coupling two parallel pump rotors (14). To complement the sealing conditions provided by a dynamic seal (6), the motor stator (4) consists of an electric coil embedded in an oil-tight and gas-tight resin, thereby not requiring other more expensive and bulky sealing means, reducing production cost and enhancing the pumping unit dependability.