Patents by Inventor Jean-Lucien MAZEAU

Jean-Lucien MAZEAU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device for heating and cooling by a printed circuit for regenerating electronic components subjected to radiation
    Patent number: 10791619
    Abstract: A thermal conditioning device for an electronic component mounted in a package positioned on a multilayer printed circuit board comprises: at least one active component arranged on the printed circuit board, and suitable for producing or absorbing thermal energy, at least one heat transfer surface internal to the printed circuit board, located under the package, a device for transferring the thermal energy between the active component or components and the heat transfer surface, at least one metallic element linking the heat transfer surface to the package situated on the multilayer printed circuit board. A printed circuit board comprising such a thermal conditioning device for an electronic component, and associated heating and cooling methods are also provided.
    Type: Grant
    Filed: April 11, 2016
    Date of Patent: September 29, 2020
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Jean-Marc Armani, Jean-Lucien Mazeau
  • DEVICE FOR HEATING AND COOLING BY A PRINTED CIRCUIT FOR REGENERATING ELECTRONIC COMPONENTS SUBJECTED TO RADIATION
    Publication number: 20180092198
    Abstract: A thermal conditioning device for an electronic component mounted in a package positioned on a multilayer printed circuit board comprises: at least one active component arranged on the printed circuit board, and suitable for producing or absorbing thermal energy, at least one heat transfer surface internal to the printed circuit board, located under the package, a device for transferring the thermal energy between the active component or components and the heat transfer surface, at least one metallic element linking the heat transfer surface to the package situated on the multilayer printed circuit board. A printed circuit board comprising such a thermal conditioning device for an electronic component, and associated heating and cooling methods are also provided.
    Type: Application
    Filed: April 11, 2016
    Publication date: March 29, 2018
    Inventors: Jean-Marc ARMANI, Jean-Lucien MAZEAU