Abstract: A method of metallizing a ceramic substrate includes depositing a barrier layer onto the substrate, depositing a tie layer onto the barrier layer, and depositing a metal layer onto the tie layer to metallize the substrate. The barrier layer may include an oxygen rich material, a nitrogen rich material, or a carbon rich material.

Abstract: A medical device includes a hybrid circuitry assembly and a core circuitry support structure. The core circuitry support structure includes a frame defining a cavity configured to receive at least a portion of the hybrid circuitry assembly. An outer surface of the frame is shaped to correspond to an inside surface of a core assembly housing configured to enclose the hybrid circuitry assembly and the core circuitry support structure.

Abstract: Embodiments of the present disclosure relate to implantable medical devices (IMDs). In an exemplary embodiment, an IMD comprises: a housing including a plurality of feedthroughs extending through the housing, a first electrode, a second electrode, and a biocompatible circuit board disposed around an outer surface of the housing. The biocompatible circuit board comprising a plurality of traces, wherein a first trace of the plurality of traces is coupled to the first electrode and a first feedthrough of the plurality of feedthroughs, and a second trace of the plurality of traces is coupled to the first electrode and a second feedthrough of the plurality of feedthroughs.

Abstract: An implantable medical device comprises a hermetically sealed housing including at least a first window configured for wireless transfer of an external power signal therethrough, an antenna disposed within the housing at a position such that the antenna can receive the external power signal through the window, and circuitry disposed within the housing and operatively coupled to the antenna.

Abstract: Various aspects of the present disclosure are directed toward apparatuses, systems, and methods for supporting components of an implantable medical device. The apparatuses, systems, and methods may include a first electrode and a second electrode and a scaffold assembly configured to support the first electrode and the second electrode.

Abstract: A medical device including a hybrid circuitry assembly, a core assembly housing having an inside surface, and a tag/getter assembly. The core assembly housing to enclose the hybrid circuitry assembly, and the tag/getter assembly to be situated adjacent the inside surface of the core assembly housing. The tag/getter assembly including an identification tag and a hydrogen getter.

Abstract: Various aspects of the present disclosure are directed toward apparatuses, systems, and methods for supporting components of an implantable medical device. The apparatuses, systems, and methods may include a first electrode and a second electrode and a scaffold assembly configured to support the first electrode and the second electrode.

Abstract: A medical device includes a hybrid circuitry assembly and a core circuitry support structure. The core circuitry support structure includes a frame defining a cavity configured to receive at least a portion of the hybrid circuitry assembly. An outer surface of the frame is shaped to correspond to an inside surface of a core assembly housing configured to enclose the hybrid circuitry assembly and the core circuitry support structure.

Abstract: Embodiments herein relate to implantable medical devices including a welded joint with reduced residual stress. In a first aspect, an implantable medical device is included having a power subunit comprising a first biocompatible electrically conductive shell, an anode disposed therein, a cathode disposed therein, and a lid. The implantable medical device can further include an electronics control subunit comprising a second biocompatible electrically conductive shell, and a control circuit disposed therein. Both of the first and second biocompatible electrically conductive shells can include first and second opposed wide sides, first and second opposed narrow sides, and four rounded corners. The first shell can be welded to the lid around a perimeter thereof forming a weld line. The weld line can have a weld line terminus and the weld line terminus can be positioned on a narrow side or a rounded corner. Other embodiments are also included herein.

Abstract: A medical device includes a hybrid circuitry assembly and a core circuitry support structure. The core circuitry support structure includes a frame defining a cavity configured to receive at least a portion of the hybrid circuitry assembly. An outer surface of the frame is shaped to correspond to an inside surface of a core assembly housing configured to enclose the hybrid circuitry assembly and the core circuitry support structure.

Abstract: An implantable medical device includes a housing with an outer surface that defines a first end and a second end opposite the first end, a battery assembly positioned within the housing between the first end and the second end, a first electrode positioned at or near the first end, a second electrode positioned at or near the second end, integrated circuitry positioned between the first end and the second end and electrically coupled to the first electrode, and an antenna communicatively coupled to the integrated circuitry and configured to wirelessly send and receive data to and from a receiver positioned externally to the implantable medical device.

Abstract: An implantable medical device (IMD) includes a core assembly having a housing with circuitry disposed therein. The IMD also includes an integrated electrode/antenna assembly. The integrated electrode/antenna assembly includes an electrode component and an antenna component.

Abstract: Embodiments of the present disclosure relate to implantable medical device (IMD) enclosures. In an exemplary embodiment, an IMD comprises: a housing comprising an open end and a header defining a cavity and comprising at least one conduit through a wall of the header, wherein the header is formed from a non-conductive material. Further, the IMD comprises a coupling member comprising a flange, wherein the flange is configured to be received by the open end of the housing and wherein the flange and the open end of the housing at least partially overlap along an axial direction of the IMD when the flange is received by the open end. Additionally, the IMD comprises an electrode arranged on an outer surface of the header and a feedthrough coupled to the electrode and extending through the conduit of the header, wherein the feedthrough is configured to be coupled to internal circuitry housed within the IMD. Further, the IMD comprises a ring forming a hermetic seal between the coupling member and the header.

Abstract: Various aspects of the present disclosure are directed toward apparatuses, systems, and methods that include a housing having a proximal portion including a proximal opening, distal portion including a distal opening, and an intermediate portion sized to contain a medical device; and an inserter having at least a portion comprising a greater width than at least one other portion of the inserter.

Abstract: Aspects of the present disclosure are directed toward apparatuses, systems, and methods that may comprise a medical device having a header, a core assembly, and a scaffold assembly. The scaffold assembly may be configured to interface with the core assembly and position and support one or more circuit component relative to one or more other circuit components.

Abstract: Implantable medical devices including interconnections having strain-relief structure. The interconnections can take the form of flexible circuits. Strain relief gaps and shapes are integrated in the interconnections to relieve forces in each of three dimensions. In some examples, the region of an interconnection which couples with a component of the implantable medical device is separated by a strain relief gap from a connection to a second component and/or a location where the flex bends around a corner.

Abstract: Embodiments of the present disclosure relate to implantable medical devices (IMDs). In an exemplary embodiment, an IMD comprises a power source and a housing enclosing the power source. The housing comprises a first side and a second side extending along a longitudinal axis between a first end and a second end, wherein the first side is opposite the second side and the first end is opposite the second end, and wherein a first distance between the first and second ends is greater than a second distance the first and second sides. The IMD further comprises a printed circuit board arranged on the first side of the base and conductively coupled to the power source. The IMD also comprises a non-conductive enclosure arranged over the printed circuit board and hermetically sealing the printed circuit board, the non-conductive enclosure comprising an outer surface.

Abstract: Embodiments of the present disclosure relate to implantable medical devices (IMDs). In an exemplary embodiment, an IMD comprises: a housing including a plurality of feedthroughs extending through the housing, a first electrode, a second electrode, and a biocompatible circuit board disposed around an outer surface of the housing. The biocompatible circuit board comprising a plurality of traces, wherein a first trace of the plurality of traces is coupled to the first electrode and a first feedthrough of the plurality of feedthroughs, and a second trace of the plurality of traces is coupled to the first electrode and a second feedthrough of the plurality of feedthroughs.

Abstract: Embodiments of the present disclosure relate to implantable medical devices. According to an exemplary embodiment, a method for forming an electrode on an implantable medical device (IMD), comprises forming a nonconductive body comprising a well having a bottom surface and at least one side surface extending from the bottom surface. The method further comprises forming a conduit through the bottom surface and inserting the nonconductive body into an opening in an external surface of the IMD. The method also comprises depositing conductive material into the well and coupling the conductive material to a circuit of the IMD via the conduit through the bottom surface of the well.

Abstract: A medical device includes a hybrid circuitry assembly and a core circuitry support structure. The core circuitry support structure includes a frame defining a cavity configured to receive at least a portion of the hybrid circuitry assembly. An outer surface of the frame is shaped to correspond to an inside surface of a core assembly housing configured to enclose the hybrid circuitry assembly and the core circuitry support structure.