Abstract: A system is disclosed. The system includes a first optical transceiver having a first set of transmitters and a first set of receivers and a second optical transceiver having a second set of transmitters coupled anti-symmetrically to the first set of receivers of the first optical transceiver and a second set of receivers coupled anti-symmetrically to the first set of transmitters of the first optical transceiver.

Abstract: A connector module is provided that includes a longitudinal body adapted for installation in a computer equipment rack capable of housing a plurality of server units positioned in a stack configuration. The longitudinal body has a plurality of data connectors mounted along an outer surface. Each data connector is located at a different location along the outer surface of the longitudinal body and is adapted to receive a signal source introduced from a front side of the outer surface. The connector module includes a collection of signal paths coupled to the plurality of data connectors. Signal paths are positioned toward a backside of the outer surface. The longitudinal body is adapted for installation in a transverse orientation relative to the plurality of server units in the stack configuration such that each data connector is positioned in proximity to a connector mounted on a corresponding one of the server units.

Abstract: An optical sub-assembly (OSA) apparatus for use in an optical transmission system comprises a housing, a plurality of TO-can packaged optical devices, and a plurality of wavelength selective filters. Each of the plurality of TO-can packaged optical devices is sensitive to optical signal of one of a plurality of wavelengths. Each of the plurality of wavelength selective filters is capable of directing an optical signal of the one of the plurality of wavelengths in a pre-determined direction. The OSA apparatus can be used as one of an optical signal receiving apparatus and an optical signal transmitting apparatus.

Abstract: A data transmission assembly includes a first connection terminal coupled to a processing unit and a second connection terminal coupled to a random access memory (RAM) resource. The data transmission assembly also includes a first electrical/optical (EO) signal converter and a second EO signal converter. The first EO signal converter is coupled to the first connection terminal and the second EO signal converter is coupled to the second connection terminal. The data transmission assembly also includes an optical signal propagation medium with a first end and a second end. The first end is attached to the first EO signal converter, and the second end is attached to the second EO signal converter. The signal propagation medium carries signals between the first connection terminal and the second connection terminal to support memory accesses performed by the processing unit to access data at memory locations within the RAM resource.

Abstract: A connector module is provided that includes a longitudinal body adapted for installation in a computer equipment rack capable of housing a plurality of server units positioned in a stack configuration. The longitudinal body has a plurality of data connectors mounted along an outer surface. Each data connector is located at a different location along the outer surface of the longitudinal body and is adapted to receive a signal source introduced from a front side of the outer surface. The connector module includes a collection of signal paths coupled to the plurality of data connectors. Signal paths are positioned toward a backside of the outer surface. The longitudinal body is adapted for installation in a transverse orientation relative to the plurality of server units in the stack configuration such that each data connector is positioned in proximity to a connector mounted on a corresponding one of the server units.

Abstract: A system is disclosed. The system includes a first optical transceiver having a first set of transmitters and a first set of receivers and a second optical transceiver having a second set of transmitters coupled anti-symmetrically to the first set of receivers of the first optical transceiver and a second set of receivers coupled anti-symmetrically to the first set of transmitters of the first optical transceiver.

Abstract: An optical communications device has light transmitters of a first wavelength that are coupled to a number of first waveguides of an optical data link, respectively. A second set of light transmitters of a second, different wavelength are coupled to another set of waveguides of the link, respectively. The light transmitters are to transmit data from the same data processing element that is to use the link to communicate with another data processing element. The device also has a set of light detectors of the first wavelength that are coupled to the second set of waveguides, respectively. Another set of light detectors of the second wavelength are coupled to the set of first waveguides, respectively. Other embodiments are also described and claimed.

Abstract: Described herein is a hermetic fiber optic package that may have a wide bandwidth radio frequency (e.g., between 9 kHz and 300 GHz) interface and a multilayer substrate provides a platform to integrated various components such as, for example, integrated circuits having electronic components, optoelectronic components, or optics. In one embodiment, the substrate has a wide bandwidth surface mountable interface that may be a single ended or a differential that allows for an electrical signal to pass from the exterior of the package to the interior. The interior of the package contains a “riser” that is used to bring an electrical signal from the plane of the substrate to the plane close to the optical axis. This riser includes a transmission line to achieve the change in height. The transmission line can be single ended or differential. Also within the package is a “submount” upon which electrical/optical/electro-optic components can be integrated.

Abstract: A method and apparatus for a backsided and recessed optical package connection is described. The method includes the formation of a substrate having a top surface layer and an opposed layer, including one or more recessed portions. Following formation of the substrate, leads of a lead unit are coupled to one or more of the recessed portions of the substrate. Next, one or more optical electronic components are mounted onto the top surface of the substrate. Once the optoelectric components are mounted to the top surface of the substrate, a cap is attached to the top surface of the substrate to encapsulate the one or more optical electronic components and form an optoelectronic package.

Abstract: An integrated multi-channel transmitter for fiber optic applications is disclosed. The transmitter includes a laser array coupled to a modulator chip by way of an isolator sandwiched between two lenslet arrays. The modulator chip includes an array of modulators, with each one receiving the output of one of the lasers. The chip also includes a coupler that receives the outputs from the modulators and combines them into a single, combined output signal which, in turn, may be coupled an output fiber.

Abstract: An optical sub-assembly (OSA) apparatus for use in an optical transmission system comprises a housing, a plurality of TO-can packaged optical devices, and a plurality of wavelength selective filters. Each of the plurality of TO-can packaged optical devices is sensitive to optical signal of one of a plurality of wavelengths. Each of the plurality of wavelength selective filters is capable of directing an optical signal of the one of the plurality of wavelengths in a pre-determined direction. The OSA apparatus can be used as one of an optical signal receiving apparatus and an optical signal transmitting apparatus.

Abstract: A method and apparatus for a backsided and recessed optical package connection is described. The method includes the formation of a substrate having a top surface layer and an opposed layer, including one or more recessed portions. Following formation of the substrate, leads of a lead unit are coupled to one or more of the recessed portions of the substrate. Next, one or more optical electronic components are mounted onto the top surface of the substrate. Once the optoelectric components are mounted to the top surface of the substrate, a cap is attached to the top surface of the substrate to encapsulate the one or more optical electronic components and form an optoelectronic package.

Abstract: An integrated multi-channel transmitter for fiber optic applications is disclosed. The transmitter includes a laser array coupled to a modulator chip by way of an isolator sandwiched between two lenslet arrays. The modulator chip includes an array of modulators, with each one receiving the output of one of the lasers. The chip also includes a coupler that receives the outputs from the modulators and combines them into a single, combined output signal which, in turn, may be coupled an output fiber.

Abstract: Optoelectronic modules and methods of manufacturing the same are disclosed. Some of the disclosed modules employ a tape automated bonding substrate (TAB) which is surface mounted with circuit elements. In some examples, the TAB is mounted to a rigid substrate after a fiber submount is passively positioned on the substrate. This modular manufacturing technique limits the value of yield loss. In some example modules, only one active alignment is employed to manufacture the module. Some of the disclosed modules include an optically pluggable connector.

Abstract: A package is described. In one embodiment, the package includes multiple optical elements and multiple flexures, with at least one optical element attached to each flexure. The optical elements may be in alignment with each other. In an alternative embodiment, multiple optical elements are attached to a single flexure.

Abstract: A package is described. In one embodiment, the package includes multiple optical elements and multiple flexures, with at least one optical element attached to each flexure. The optical elements may be in alignment with each other. In an alternative embodiment, multiple optical elements are attached to a single flexure.

Abstract: A method and apparatus for a backsided and recessed optical package connection is described. The method includes the formation of a substrate having a top surface layer and an opposed layer, including one or more recessed portions. Following formation of the substrate, leads of a lead unit are coupled to one or more of the recessed portions of the substrate. Next, one or more optical electronic components are mounted onto the top surface of the substrate. Once the optoelectric components are mounted to the top surface of the substrate, a cap is attached to the top surface of the substrate to encapsulate the one or more optical electronic components and form an optoelectronic package.

Abstract: There is provided a coil and a method for fabricating the same. One embodiment of the coil includes a plurality of traces in one area of a substrate. Each trace has a first end located at a first side of the area, and a second end located at a second side of the area opposite the first side. A plurality of wires couples the plurality of traces to form a coil. Each wire couples the first end of one trace to the second end of another trace located adjacent to the one trace.

Abstract: Accordingly, a coil is described. The coil includes a plurality of traces in one area of a substrate. Each trace has a first end located at a first side of the area, and a second end located at a second side of the area opposite the first side. A plurality of wires couples the plurality of traces to form a coil. Each wire couples the first end of one trace to the second end of another trace located adjacent to the one trace.

Abstract: A low profile ringframe used in electro-optical module packaging is disclosed. The ringframe can be mounted so as to be set back from, be flush with, or be extending exteriorly over the outer end wall of the ceramic substrate, and may also be formed so as to help physically separate the ringframe-to-subtrate solder joint from the ringframe-to-laser weld seam. The ringframe, along the side where it is sealed to the adjacent substrate, can be notched with one or more cutout areas to allow a space for wicking of reflowed solder to prevent a built-up solder fillet from forming exteriorly of the ringframe.