Abstract: The device includes at least the following components: a heating resistor intended for heating a component to be regenerated; a current source; a thermistor connected to the current source and thermally coupled to the heating resistor, the thermistor, through which the current flows, having a voltage Vtemp across its terminals, which voltage reflects the temperature of the heating resistor; an error amplifier, which amplifies the difference between the voltage Vset and the voltage Vtemp and delivers a voltage Vctrl that corresponds to the amplified difference; a switch, which switches the current flowing through the heating resistor; an oscillator, which delivers a voltage Vosc formed with a modulated duty cycle, the duty cycle of the pulses of the voltage Vosc being dependent on the voltage Vctrl, the pulses controlling the opening of the switch.

Abstract: A thermal conditioning device for an electronic component mounted in a package positioned on a multilayer printed circuit board comprises: at least one active component arranged on the printed circuit board, and suitable for producing or absorbing thermal energy, at least one heat transfer surface internal to the printed circuit board, located under the package, a device for transferring the thermal energy between the active component or components and the heat transfer surface, at least one metallic element linking the heat transfer surface to the package situated on the multilayer printed circuit board. A printed circuit board comprising such a thermal conditioning device for an electronic component, and associated heating and cooling methods are also provided.

Abstract: The device includes at least the following components: a heating resistor intended for heating a component to be regenerated; a current source; a thermistor connected to the current source and thermally coupled to the heating resistor, the thermistor, through which the current flows, having a voltage Vtemp across its terminals, which voltage reflects the temperature of the heating resistor; an error amplifier, which amplifies the difference between the voltage Vset and the voltage Vtemp and delivers a voltage Vctrl that corresponds to the amplified difference; a switch, which switches the current flowing through the heating resistor; an oscillator, which delivers a voltage Vosc formed with a modulated duty cycle, the duty cycle of the pulses of the voltage Vosc being dependent on the voltage Vctrl, the pulses controlling the opening of the switch.

Abstract: A thermal conditioning device for an electronic component mounted in a package positioned on a multilayer printed circuit board comprises: at least one active component arranged on the printed circuit board, and suitable for producing or absorbing thermal energy, at least one heat transfer surface internal to the printed circuit board, located under the package, a device for transferring the thermal energy between the active component or components and the heat transfer surface, at least one metallic element linking the heat transfer surface to the package situated on the multilayer printed circuit board. A printed circuit board comprising such a thermal conditioning device for an electronic component, and associated heating and cooling methods are also provided.