Abstract: The invention relates to a new type of encapsulated surface acoustic wave component and to a method for the batch production of such components. The component comprises a surface acoustic wave device on the surface of a substrate. The encapsulation package furthermore comprises the substrate, a first layer located on the substrate and hollowed out locally at least at the level of the active surface of the surface acoustic wave device, a printed circuit covering entire first layer and conductive via holes going through the unit formed by the first layer and the printed circuit so as to provide for the electrical connection of the surface acoustic wave device from the exterior.

Abstract: The invention relates to a new type of encapsulated surface acoustic wave component and to a method for the batch production of such components.

Abstract: A process for the fabrication of a multielement acoustic probe. A flexible circuit having conducting tracks on at least one of its sides is used. This circuit is joined to a plate of piezoelectric material having metallizations. Vias are produced through the flexible circuit in order to address the metallizations and to produce electrical contacts within the vias. This process may be used in echography probes.

Abstract: The invention relates to a surface wave device linked to a base by a conductive material which is anisotropic in a direction perpendicular to the plane of the surface wave device and of the base. This anisotropic conductive material provides for the mechanical efficacy and the encapsulation of the surface wave device. It is deposited locally in the plane of the base, in such a way as to provide for the presence of a cavity in which the surface acoustic waves can propagate.

Abstract: A method for the packaging of electronic components, including the mounting of at least one electronic component on its active face side to a base, the base including electrical contacts on an external face and connection pads on a face opposite the external face, and including a first series of via holes connecting the electrical contacts and the connection pads and a second series of holes for use in aspiration. A deformable film is deposited on the face opposite to the active face of the electronic component or components. The deformable film is aspirated through the second series of holes from the face opposite the external face of the base, so as to sheath the electronic component or components. The method may furthermore include, on top of the deformable film, a mineral deposition to provide for the hermetic sealing of the components and a conductive deposition to provide for the shielding. Such an application may find particular application to surface wave filters.

Abstract: The invention relates to a process for the fabrication of a multielement acoustic probe. This process comprises the use of a flexible circuit having conducting tracks on at least one of its sides, the joining of this circuit to a plate of piezoelectric material (having metallizations), the production of vias through the flexible circuit, in order to address the said metallizations, and the production of electrical contacts within the vias.

Abstract: A method of manufacturing a multiple-element acoustic probe including piezoelectric transducers and an array of interconnections connecting the transducers to an electronic signal processing and control device. The probe also includes a continuous ground electrode integrated between the transducers and the acoustic matching elements, facing the piezoelectric transducers, the acoustic matching elements being totally uncoupled from one another mechanically. This probe may be used in medical imaging or underwater imaging.

Abstract: The invention relates to a multiple-element acoustic probe comprising piezoelectric transducers (Tij) and an array of interconnections connecting the acoustic transducers to an electronic signal processing and control device. This probe further comprises a continuous ground electrode (P) integrated between the transducers and acoustic matching elements, facing the piezoelectrical transducers, the acoustic matching elements being totally uncoupled from one another mechanically.

Abstract: An acoustic probe and a method for making the same. The probe includes a novel interconnection network consisting of two portions, i.e., a first portion in which M.times.N conductive paths have a section contacting M.times.N piezoelectric transducers and are arranged at a pitch (P.sub.N) in a direction (D.sub.x) and at a pitch (P.sub.M) in direction (D.sub.y) within the acoustic absorption material; and a second portion in which the M.times.N conductive paths are arranged on M dielectric substrates spaced apart at a pitch (P'.sub.M) and each provided with N paths are arranged at a pitch (P'.sub.N). A method for making the acoustic probe is also disclosed. The dielectric substrates may advantageously be flexible printed circuits optionally including chips.

Abstract: The disclosure relates to a mass memory with very large-scale integration as well as to a method for the manufacture of such a memory.

Abstract: A process relating to the manufacture of medical echograph probes for establishing a network of connections to elementary transducer units. The process includes the steps of cutting transducer units from a piezoelectric plate, drilling holes in a polymer film on the piezoelectric plate by means of a photoablation process or a reactive ion plasma etching process, and making connections by metallization and then etching to form conducting tracks which connect to the piezoelectric layer via the drilled holes.

Abstract: A thermal detector with a monolithic structure comprises a layer of material sensitive to infrared radiation and an insulating layer constituted by a thermostable polymer that can be deposited as a thin layer and has a microporous structure. This insulating layer enables the thermal decoupling of the sensitive layer from the substrate comprising reading circuits with which the detector is provided. The performance characteristics of currently used monolithic infrared detectors can thus be substantially improved through the notable reduction of the thermal losses in the sensitive layer. This is achieved through the greatly reduced thermal conductivity of the layer of dielectric polymer. Application to infrared imaging devices.

Abstract: The invention is a mechanical sensor produced from a polymer film whose upper part (A) is made conductive, the lower part (B) remaining an insulator. When a strain is applied, the mechanical sensor according to the invention distorts, varying the resistance of part (A) and thus allowing the strain to be measured. Preferably, the polymer used is a thermostable polymer.

Abstract: A thermal detector with a monolithic structure comprises a layer of material sensitive to infrared radiation and an insulating layer constituted by a thermostable polymer that can be deposited as a thin layer and has a microporous structure. This insulating layer enables the thermal decoupling of the sensitive layer from the substrate comprising reading circuits with which the detector is provided. The performance characteristics of currently used monolithic infrared detectors can thus be substantially improved through the notable reduction of the thermal losses in the sensitive layer. This is achieved through the greatly reduced thermal conductivity of the layer of dielectric polymer. Application to infrared imaging devices.

Abstract: The invention is a method of producing a multilayer polymer-metal system to interconnect integrated circuits which allows two-dimensional electrical and/or optical connections between components, in which a first layer of polymer is deposited on a rigid substrate such that the layer can be separated from the substrate, in which a multilayer interconnection system is then produced on this first layer using industrial methods and in which the rigid substrate is removed after installation and connection of the integrated circuit.

Abstract: Disclosed is a method for the making of microlenses for optical applications (display for example) resulting from the deposition of a liquid on a substrate, the surface of which has been locally modified so as to increase the wetting capacity of the liquid thereon. The substrate may be a polymer and the wetting liquid may be an organic fluid capable of hardening by an adapted treatment.

Abstract: A method for impregnating electrolytic capacitors by a tetracyanoquinodimethane (TCNQ) salt is disclosed. The method consists in introducing TCNQ salt into the capacitors by electrolytic means, with a solution consisting of a solvent, wherein TCNQ has been dissolved and which contains a support electrolyte, the cation of the support electrolyte and the dissolved TCNQ leading, after electrolytic dissociation, to said TCNQ salt. The method can be applied to the manufacture of aluminum electrolytic capacitors with solid electrolyte.

Abstract: The invention pertains to a capacitor of a thermostable polymer film type. The polymer used is polyphenylquinoxaline or polyhydantoin. The polymer film may be obtained by casting with organic solutions. The capacitor can also be obtained with supporting films covered with metallizations coated with this thermostable polymer.