Abstract: In an apparatus for preforming the ends of wire leads of lead frames, prior to bonding, the lead frames are fed successively through a preforming position. A positioning and alignment device is provided correctly positioning the lead frames prior to preforming, the device using as datum surfaces, surfaces used to position the lead frames during manufacture. Typically the lead frames are produced on perforated strip film and the perforations act as positioning datum surfaces during manufacture and during preforming. After preforming the lead frames are fed to a bonding position for automatic bonding, as by an ultrasonic wobble bonding tool.

Abstract: An ultrasonic wobble-bonding apparatus for bonding leads of lead frames has a bonding tool attached to a support member which is mounted on a double axis pivot or trunnion, the pivot or trunnion in turn mounted on a sector bearing. The interception of the two axis is on a center common with the active surface of the bonding tool, the active surface being concave. The tool is moved about the two axes in a predetermined manner such that the common center on the active surface -- which is also the contact position between tool and lead frames -- follows a predetermined path on the active surface. The pivot and sector bearing are displaced from the bonding tool to leave a clear working space -- particularly useful for automatic bonding of leads of lead frames arranged in long strips or coils.

Abstract: The removal of connector pins from a panel, such as a printed circuit board, in which the pin extends from the panel and is soldered to a circuit member on one or both sides of the panel, is achieved by a tool positioned over the pin and having a main body member which is held in contact with the panel surface and with an axially sliding gripping member having a split gripping portion. The gripping member is moved by a tubular member surrounding the gripping member and which, on axial movement, forces the split gripping portion of the gripping member into firm frictional contact with the pin, further axial movement of the tubular member moving the gripping member and pin axially shearing the solder joint. The tubular member is moved by a pivotally mounted handle, the reaction from the pivoting of the handle and pulling on the pin holding the tool firmly against the panel. The pin is removed without damage to the panel and a new pin can be inserted and resoldered using the remaining solder at the joint.