Abstract: Printed circuits having conductive traces applied adjacent to a substrate, such as one where the traces have a resistivity of from about 1 to about 0.1 ohms/square, and methods for forming a fluid composition receiving layer adjacent to a substrate. One such method includes depositing a primary treatment fluid having a particle dispersion and a binder in a carrier fluid adjacent to at least a portion of a substrate to provide a treated substrate having a fluid composition receiving layer. The primary treatment fluid is deposited in a pattern using a: micro-fluid ejection head. After deposition, the carrier fluid content of the fluid composition receiving layer is reduced.