Patents by Inventor Jean-Michel Morelle
Jean-Michel Morelle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10082265Abstract: An illumination and/or signaling device for an automotive vehicle includes a dielectric substrate including a plurality of conductive tracks, and a plurality of light-emitting diodes surface-mounted on the dielectric substrate. The light emitting diodes are electrically connected to the conductive tracks of the dielectric substrate according to a predetermined connection plan. At least one control circuit board for controlling the light-emitting diodes includes a plurality of connecting pins and an electrical connection circuit board including a plurality of conductive lines for electrically connecting the connecting pins of the control circuit board to the conductive tracks of the dielectric substrate according to a predetermined connection plan. The electrical connection circuit board is connected to the conductive tracks of the dielectric substrate via an anisotropic conductive film.Type: GrantFiled: February 3, 2017Date of Patent: September 25, 2018Assignee: VALEO VISIONInventors: Marc Duarte, Zdravko Zojceski, Jean-Michel Morelle
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Publication number: 20170227186Abstract: An illumination and/or signaling device for an automotive vehicle includes a dielectric substrate including a plurality of conductive tracks, and a plurality of light-emitting diodes surface-mounted on the dielectric substrate. The light emitting diodes are electrically connected to the conductive tracks of the dielectric substrate according to a predetermined connection plan. At least one control circuit board for controlling the light-emitting diodes includes a plurality of connecting pins and an electrical connection circuit board including a plurality of conductive lines for electrically connecting the connecting pins of the control circuit board to the conductive tracks of the dielectric substrate according to a predetermined connection plan. The electrical connection circuit board is connected to the conductive tracks of the dielectric substrate via an anisotropic conductive film.Type: ApplicationFiled: February 3, 2017Publication date: August 10, 2017Applicant: VALEO VISIONInventors: Marc DUARTE, Zdravko Zojceski, Jean-Michel Morelle
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Patent number: 9706665Abstract: A device for assembling an element on a surface of a substrate by providing a solder-forming mass. The device has a means for moving the element and a measurement means. The means for moving the element includes a support and an element gripper member. The gripper member has a vertical axis that is perpendicular to the surface of the substrate and is mounted to move freely in translation on the support in a direction parallel to its vertical axis. The measurement means measures a variation of the position of the element in vertical translation.Type: GrantFiled: June 25, 2014Date of Patent: July 11, 2017Assignee: VALEO ETUDES ELECTRONIQUESInventors: Laurent Vivet, Jean-Michel Morelle, Sandra Dimelli, Laurent Deneu-Fontaine, Romaric Lenoir
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Patent number: 9167703Abstract: In this method, a vertical stack is formed on an axis coinciding substantially with the gravity direction and comprising, from top to bottom: the element; the mass in a solid state; and the substrate. The mass is then heated so as to cause it to pass into a liquid state enabling it to spread on the substrate. More particularly, after the stack has been formed, the element is left free to move vertically, and during heating, variation in the vertical position of the element is measured.Type: GrantFiled: October 9, 2009Date of Patent: October 20, 2015Assignee: VALEO ETUDES ELECTRONIQUESInventors: Laurent Vivet, Jean-Michel Morelle, Sandra Dimelli, Laurent Deneu-Fontaine, Romaric Lenoir
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Patent number: 8958209Abstract: Said electronic power module (10) includes: a stack (14) comprising a metal layer forming an electric circuit (26) and intended for supporting an electronic power component (18) such as a semiconductor; a metal body forming a heat drain (20); and a dielectric material layer (22) forming an electric insulator and inserted between the electric circuit (26) and the heat drain (20). The stack (14) includes a composite material body (24) having a carbon-charged metal matrix. The carbon charge is between 20 and 60 volume percent. Said composite body (24) is inserted between an area of the electric circuit (26) and the electric insulator (22), said area being intended for supporting the electronic power component (18).Type: GrantFiled: October 7, 2010Date of Patent: February 17, 2015Assignee: Valeo Equipements Electriques MoteurInventors: Jean-Michel Morelle, Ky Lim Tan, Laurent Vivet, Sandra Dimelli, Stéphane Thomelin, Hérve Lorin
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Patent number: 8952288Abstract: A method having a step of heating a mass forming a braze. Before the heating step, the method includes steps of arranging the mass and the member on the support. In particular, it includes a step of positioning the mass on the support and a step of applying a first compressive force on the mass so as to compress said mass against the support, the intensity of the first force increasing up to a predetermined first value chosen so as to flatten the mass. Next, the method includes a step of positioning the member on the flattened mass and a step of applying a second compressive force to the member so as to compress said member against the flattened mass and the support, the intensity of the second force increasing up to a second predefined value, the second predefined value being lower than the first predefined value.Type: GrantFiled: November 8, 2012Date of Patent: February 10, 2015Assignee: Valeo Equipements Electriques MonteurInventors: Jean-Michel Morelle, Laurent Vivet, Mathieu Medina, Sandra Dimelli
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Patent number: 8916963Abstract: The invention relates to a power module (10), preferably for a vehicle, in particular an electric vehicle, characterized in that said module includes two vertically adjacent semiconducting chips (12, 14), each chip having a first surface (20, 22) to be connected to a heat sink substrate (24, 26), and a second surface (28, 30) separate from the first and on which at least one electronic component (38a-44b) is arranged, the module being arranged such that the second surfaces of the chips are arranged opposite one another.Type: GrantFiled: October 7, 2010Date of Patent: December 23, 2014Assignee: Valeo Etudes ElectroniquesInventors: Jean-Michel Morelle, Ky Lim Tan, Laurent Vivet, Sandra Dimelli, Stéphane Thomelin, Hervé Lorin, Patrick Dubus
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Publication number: 20140304984Abstract: A device for assembling an element on a surface of a substrate by providing a solder-forming mass. The device has a means for moving the element and a measurement means. The means for moving the element includes a support and an element gripper member. The gripper member has a vertical axis that is perpendicular to the surface of the substrate and is mounted to move freely in translation on the support in a direction parallel to its vertical axis. The measurement means measures a variation of the position of the element in vertical translation.Type: ApplicationFiled: June 25, 2014Publication date: October 16, 2014Applicant: VALEO ETUDES ELECTRONIQUESInventors: Laurent VIVET, Jean-Michel MORELLE, Sandra DIMELLI, Laurent DENEU-FONTAINE, Romaric LENOIR
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Patent number: 8822880Abstract: In accordance with said control method, the transmission of the laser beam is periodically interrupted with the aid of means for masking the laser beam placed between the reference point and a source of the laser beam. Moreover, the transmission power of the source of the laser beam is varied between the minimum and maximum values, such that the emission times of the source of the laser beam at the minimum power substantially coincide with the masking times of the laser beam via the masking means. Preferably, the minimum value is at least equal to 10% and the maximum value at most equal to 90% of a maximum emission power of the source of the laser beam.Type: GrantFiled: June 16, 2006Date of Patent: September 2, 2014Assignee: Valeo Etudes ElectroniquesInventors: Jean-Michel Morelle, Laurent Vivet
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Patent number: 8742259Abstract: This holder includes a conductor metal part designed to be warmed for assembly of the electrical component on the metal part. It also includes a part made of synthetic material, jointed with the metal part, guaranteeing cohesion of the holder. This part made out of synthetic material contains a mass with a low melting point and a mass with a high melting point, inserted between the mass with a low melting point and the metal part. More specifically, the mass with the high melting point is made in a material with a melting point greater than the melting point of the mass with a low melting point.Type: GrantFiled: June 12, 2007Date of Patent: June 3, 2014Assignee: Valeo Etudes ElectroniquesInventors: Jean-Michel Morelle, Laurent Vivet, Blaise Rouleau
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Patent number: 8723079Abstract: In this soldering method, a laser is directed onto an end face of the stack in such a manner that the laser heats the stack. At least one parameter of the laser is adjusted to a value that is the image by a mathematical model of at least one thermal characteristic of the stack. The parameter of the laser is a parameter selected from an irradiation duration, a surface area of the end face of the stack that is irradiated by the laser, and an irradiating power of the laser.Type: GrantFiled: January 9, 2007Date of Patent: May 13, 2014Assignee: Valeo Etudes ElectroniquesInventors: Gerard-Marie Martin, Jean-Michel Morelle, Laurent Vivet
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Patent number: 8444913Abstract: In this method, the conductive powder mass is placed on the support, and then the member is placed on the mass and a compression force is applied, urging the member against the mass and the support before heating the mass. The magnitude is increased from an initial value to a first predefined value for agglomerating the mass, which value is less than a plastic deformation threshold of the powder mass. Then, the magnitude is maintained at the first predefined value throughout a predetermined duration for agglomerating the powder mass. Finally, the magnitude is increased from the first value to a second predefined value less than a critical threshold for damaging the member but greater than a minimum threshold for sintering the mass at the predetermined temperature, the second predefined value being greater than the first predefined value.Type: GrantFiled: April 23, 2008Date of Patent: May 21, 2013Assignee: Valeo Etudes ElectroniquesInventors: Jean-Michel Morelle, Laurent Vivet, Mathieu Medina, Sandra Dimelli
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Publication number: 20120268895Abstract: Said electronic power module (10) includes: a stack (14) comprising a metal layer forming an electric circuit (26) and intended for supporting an electronic power component (18) such as a semiconductor; a metal body forming a heat drain (20); and a dielectric material layer (22) forming an electric insulator and inserted between the electric circuit (26) and the heat drain (20). The stack (14) includes a composite material body (24) having a carbon-charged metal matrix. The carbon charge is between 20 and 60 volume percent. Said composite body (24) is inserted between an area of the electric circuit (26) and the electric insulator (22), said area being intended for supporting the electronic power component (18).Type: ApplicationFiled: October 7, 2010Publication date: October 25, 2012Applicant: VALEO ETUDES ELECTRONIQUESInventors: Jean-Michel Morelle, Ky Lim Tan, Laurent Vivet, Sandra Dimelli, Stéphane Thomelin, Hervé Lorin
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Publication number: 20120235290Abstract: The invention relates to a power module (10), preferably for a vehicle, in particular an electric vehicle, characterised in that said module includes two vertically adjacent semiconducting chips (12, 14), each chip having a first surface (20, 22) to be connected to a heat sink substrate (24, 26), and a second surface (28, 30) separate from the first and on which at least one electronic component (38a-44b) is arranged, the module being arranged such that the second surfaces of the chips are arranged opposite one another.Type: ApplicationFiled: October 7, 2010Publication date: September 20, 2012Applicant: VALEO ETUDES ELECTRONIQUESInventors: Jean-Michel Morelle, Ky Lim Tan, Laurent Vivet, Sandra Dimelli, Stéphane Thomelin, Hervé Lorin, Patrick Dubus
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Patent number: 8039973Abstract: The module is of the type comprising an electronic component provided with a conductive face that is electrically connected to a connection member of the component by means of a conductor that is corrugated at least in part so as to define an alternating sequence of oppositely-directed arcs, a first series of arcs being connected to the conductive face of the electronic component. The conductor also includes a second series of arcs opposite to the arcs of the first series and interposed between the arcs of the first series, the second series of arcs being connected to the conductive face of the connection member.Type: GrantFiled: January 30, 2007Date of Patent: October 18, 2011Assignee: Valeo Etudes ElectroniquesInventors: Jean-Michel Morelle, Laurent Vivet, Mathieu Medina, Renan Leon
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Publication number: 20100176098Abstract: In this method, the conductive powder mass is placed on the support, and then the member is placed on the mass and a compression force is applied, urging the member against the mass and the support before heating the mass. The magnitude is increased from an initial value to a first predefined value for agglomerating the mass, which value is less than a plastic deformation threshold of the powder mass. Then, the magnitude is maintained at the first predefined value throughout a predetermined duration for agglomerating the powder mass. Finally, the magnitude is increased from the first value to a second predefined value less than a critical threshold for damaging the member but greater than a minimum threshold for sintering the mass at the predetermined temperature, the second predefined value being greater than the first predefined value.Type: ApplicationFiled: April 23, 2008Publication date: July 15, 2010Applicant: VALEO ETUDES ELECTRONIQUESInventors: Jean-Michel Morelle, Laurent Vivet, Mathieu Medina, Sandra Dimelli
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Publication number: 20100157561Abstract: This holder includes a conductor metal part designed to be warmed for assembly of the electrical component on the metal part. It also includes a part made of synthetic material, jointed with the metal part, guaranteeing cohesion of the holder. This part made out of synthetic material contains a mass with a low melting point and a mass with a high melting point, inserted between the mass with a low melting point and the metal part. More specifically, the mass with the high melting point is made in a material with a melting point greater than the melting point of the mass with a low melting point.Type: ApplicationFiled: June 12, 2007Publication date: June 24, 2010Applicant: VALEO ETUDES ELECTRONIQUESInventors: Jean-Michel Morelle, Laurent Vivet, Blaise Rouleau
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Publication number: 20100139089Abstract: In this method, a vertical stack is formed on an axis coinciding substantially with the gravity direction and comprising, from top to bottom: the element; the mass in a solid state; and the substrate. The mass is then heated so as to cause it to pass into a liquid state enabling it to spread on the substrate. More particularly, after the stack has been formed, the element is left free to move vertically, and during heating, variation in the vertical position of the element is measured.Type: ApplicationFiled: October 9, 2009Publication date: June 10, 2010Applicant: VALEO ETUDES ELECTRONIQUESInventors: Laurent VIVET, Jean-Michel MORELLE, Sandra DIMELLI, Laurent DENEU-FONTAINE, Romaric LENOIR
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Publication number: 20100089879Abstract: A method having a step of heating a mass forming a braze. Before the heating step, the method includes steps of arranging the mass and the member on the support. In particular, it includes a step of positioning the mass on the support and a step of applying a first compressive force on the mass so as to compress said mass against the support, the intensity of the first force increasing up to a predetermined first value chosen so as to flatten the mass. Next, the method includes a step of positioning the member on the flattened mass and a step of applying a second compressive force to the member so as to compress said member against the flattened mass and the support, the intensity of the second force increasing up to a second predefined value, the second predefined value being lower than the first predefined value.Type: ApplicationFiled: September 11, 2007Publication date: April 15, 2010Applicant: VALEO ELECTRONIQUE ET SYSTEMES DE LIAISONInventors: Jean-Michel Morelle, Laurent Vivet, Mathieu Medina, Sandra Dimelli
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Publication number: 20100000979Abstract: In accordance with said control method, the transmission of the laser beam is periodically interrupted with the aid of means for masking the laser beam placed between the reference point and a source of the laser beam. Moreover, the transmission power of the source of the laser beam is varied between the minimum and maximum values, such that the emission times of the source of the laser beam at the minimum power substantially coincide with the masking times of the laser beam via the masking means. Preferably, the minimum value is at least equal to 10% and the maximum value at most equal to 90% of a maximum emission power of the source of the laser beam.Type: ApplicationFiled: June 16, 2006Publication date: January 7, 2010Applicant: VALEO ETUDES ELECTRONIQUESInventors: Jean-Michel Morelle, Laurent Vivet