Patents by Inventor Jean-Michel Tschann

Jean-Michel Tschann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal matching in semiconductor devices using heat distribution structures
    Patent number: 8859337
    Abstract: Embodiments described herein provide a chip, comprising a first device on a substrate and a second device on the substrate. The chip further comprises a heat distribution structure in thermal proximity to the first device and the second device, wherein the heat distribution structure is thermally isolated and reduces a thermal gradient between the first device and the second device.
    Type: Grant
    Filed: December 13, 2010
    Date of Patent: October 14, 2014
    Assignee: Soitec
    Inventors: Stephen J Gaul, Steven Howard Voldman, Jean-Michel Tschann
  • THERMAL MATCHING IN SEMICONDUCTOR DEVICES USING HEAT DISTRIBUTION STRUCTURES
    Publication number: 20110141696
    Abstract: Embodiments described herein provide a chip, comprising a first device on a substrate and a second device on the substrate. The chip further comprises a heat distribution structure in thermal proximity to the first device and the second device, wherein the heat distribution structure is thermally isolated and reduces a thermal gradient between the first device and the second device.
    Type: Application
    Filed: December 13, 2010
    Publication date: June 16, 2011
    Applicant: INTERSIL AMERICAS INC.
    Inventors: Stephen J. Gaul, Steven Howard Voldman, Jean-Michel Tschann