Abstract: A tape (T) to which a plurality of elements (C) are affixed by means of a glue in a solid state is manufactured in the following manner. In a gluing step, in which elements (C) are glue to a basic tape (T) by means of a glue in a liquid state so as to obtain a glued tape. The gluing step is followed by a winding step and a heating step. In the winding step, the glued tape (T) is wound while the glue is in a state between the liquid state and the solid state, so as to obtain a winded glued tape. In the heating step, in the winded glued tape is heated, so that the glue reaches the solid state.

Abstract: A method of manufacturing an integrated circuit element from a silicon wafer, the silicon wafer having an active face and an inactive face, a passivation layer being deposited on the active face, where the method includes: an organic-layer-depositing step, in which an organic layer is deposited on the inactive face of the silicon wafer using a spin coating technique to obtain a sandwich-like structure, the passivation layer and the organic layer having substantially the same thickness, and a wafer-sawing step, in which a slice of the silicon wafer is sawed so as to obtain a several integrated circuit elements.

Abstract: The printed circuit has connection pads emerging in a face of the integrated circuit, which face is covered in an insulating layer (5) having openings in register with the connection pads, and at least one conductor track (7) extending over the first insulating layer and having one end connected to one of the connection pads of the integrated circuit. A second insulating layer (8) covers the first insulating layer and has openings (9) in register with each conductor track (7) of the first layer and in register with each connection pad that is not connected to a conductor track (7), and it carries at least one repositioning conductor track (10) extending over the second insulating layer (8) having one end connected to a conductor track (7) of the first insulating layer.