Abstract: A connector is described for removable electrical connection of an array package having a plurality of pins. A first board having a plurality of openings formed therethrough and a second parallel board having a plurality of complementary contact elements extending into the openings are interconnected by a heat-recoverable metal motion transmitting means preferably in the form of a grid positioned between the boards. One end of the grid is connected to the first board and the other end of the grid is connected to the second board to move the boards relative to each other causing engagement between the contact elements and the pins of an array package that may be inserted into the openings.