Abstract: The invention relates to a light-emitting arrangement comprising a printed circuit board, PCB, having at least one electrically and thermally conductive portion, a light-emitting diode, LED, being thermally connected to the at least one electrically and thermally conductive portion by at least one contact of the LED, and a heat release member for dissipating heat generated by the LED, the heat release member being thermally connected to the at least one electrically and thermally conductive portion, wherein the heat generated by the LED is transferred along a heat transfer path extending from the LED via the at least one contact and the at least one electrically and thermally conductive portion to the heat release member. The light-emitting arrangement according to the invention provides greatly improved heat removal from the LED while using a low-cost glass-epoxy material for the PCB.

Abstract: The present invention relates to a LED-array system (202) comprising at least one LED package (200), said at least one LED package comprising a LED (204) and being arranged on a substrate (206) provided with means (208) for supplying the LED package (200) with a drive voltage, wherein said at least one LED package is immersed in a supporting layer (212) covering the substrate plate (206). In order to improve optical efficiency and reduce glare the LED package also comprises a reflector (220) having a reflective surface for collimating the light emitted by the LED (204). The invention also relates to lighting systems comprising the LED-array system and a method for producing said LED-array system.