Patents by Inventor Jean-Paul Henry

Jean-Paul Henry has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for transferring solder bumps
    Patent number: 7070087
    Abstract: The present invention relates to improvements in forming and transferring solder bumps for use in mounting integrated circuit substrates on chip carrier packages. A mold having cavities for the solder bumps is held in contact with a substrate and a compressible device. As the temperature is increased to melt the solder in the cavities, at an appropriate time and temperature, the compressible device is caused to decompress resulting in the mold separating from the substrate and leaving formed solder bumps on the contacts on the substrate. Various mechanisms are described to cause the force holding the mold and substrate together to decrease.
    Type: Grant
    Filed: December 3, 2003
    Date of Patent: July 4, 2006
    Assignee: International Business Machines Corporation
    Inventors: Guy Brouillette, David Danovitch, Jean-Paul Henry
  • METHOD AND APPARATUS FOR TRANSFERRING SOLDER BUMPS
    Publication number: 20040214420
    Abstract: The present invention relates to improvements in forming and transferring solder bumps for use in mounting integrated circuit substrates on chip carrier packages. A mold having cavities for the solder bumps is held in contact with a substrate and a compressible device. As the temperature is increased to melt the solder in the cavities, at an appropriate time and temperature, the compressible device is caused to decompress resulting in the mold separating from the substrate and leaving formed solder bumps on the contacts on the substrate. Various mechanisms are described to cause the force holding the mold and substrate together to decrease.
    Type: Application
    Filed: December 3, 2003
    Publication date: October 28, 2004
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Guy Brouillette, David Danovitch, Jean-Paul Henry
  • Slide hammer removal tool
    Patent number: D794406
    Type: Grant
    Filed: February 20, 2016
    Date of Patent: August 15, 2017
    Inventors: Edgar Grant Eckenswiller, Jean Paul Henry Desroches