Patents by Inventor Jean-Philippe Court

Jean-Philippe Court has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230038948
    Abstract: Disclosed is a bonded assembly comprising at least: a first substrate, a second substrate, an intermediate deformation layer secured to the first substrate, the intermediate deformation layer comprising a material in which cavities are provided so that the intermediate deformation layer has a stiffness which is variable along a direction parallel to the intermediate deformation layer, an adhesive between the intermediate layer and the second substrate.
    Type: Application
    Filed: December 15, 2020
    Publication date: February 9, 2023
    Inventors: Jean-Philippe COURT, Hamza ABBAD EL ANDALOUSSI, Firas SAYED AHMAD, Pierre MONTAUFRAY, Alexandre MONTEIL, Thierry ROURE
  • Publication number: 20180363690
    Abstract: A bonded assembly that includes a substrate (102), a connector (101, 201) including a bonding surface arranged with a gap to the substrate (102), a support zone surrounding the bonding surface, at least one gasket (202) compressed between the substrate and the support zone, the gasket (202), the connector (101, 201) and the substrate (102) delimiting a sealed volume (209), a recessed overflow groove (208) formed between the bonding surface and the support zone and forming part of the sealed volume (209) and a hardened adhesive (107) at least partially occupying the sealed volume, the adhesive holding the connector on the substrate via the bonding surface.
    Type: Application
    Filed: October 26, 2016
    Publication date: December 20, 2018
    Inventor: Jean-Philippe COURT
  • Publication number: 20160243791
    Abstract: A bonded assembly designed for assembling a substrate to a structure or indeed to reinforce a structure. The bonded assembly includes: first and second substrates, an intermediate layer rigidly connected to the first substrate, and having flexibility that varies along the first substrate, the variable flexibility resulting from a variation in the thickness of at least one material of the intermediate layer, an adhesive between the intermediate layer and the second substrate.
    Type: Application
    Filed: October 20, 2014
    Publication date: August 25, 2016
    Inventor: Jean-Philippe COURT
  • Patent number: 8869595
    Abstract: An adhesive assembly is provided in particular for assembling a novel element on a structure or further for reinforcing a structure. The adhesive assembly includes a substrate, a rigid element placed with an interval relative to the substrate, at least one seal compressed between the substrate and the rigid element and defining a sealed space within said interval, and a hardened adhesive occupying said space. The seal is compressed by the rigid element that is held on the substrate by the hardened adhesive.
    Type: Grant
    Filed: June 18, 2010
    Date of Patent: October 28, 2014
    Assignee: Cold Pad
    Inventors: Jean-Philippe Court, René-Louis Geffroy
  • Publication number: 20120096926
    Abstract: An adhesive assembly is provided in particular for assembling a novel element on a structure or further for reinforcing a structure. The adhesive assembly includes a substrate, a rigid element placed with an interval relative to the substrate, at least one seal compressed between the substrate and the rigid element and defining a sealed space within said interval, and a hardened adhesive occupying said space. The seal is compressed by the rigid element that is held on the substrate by the hardened adhesive.
    Type: Application
    Filed: June 18, 2010
    Publication date: April 26, 2012
    Applicant: COLD PAD
    Inventors: Jean-Philippe Court, René-Louis Geffroy