Abstract: An apparatus for selectively tinning a zone of a plurality of leads overhanging a window of a substrate for a very large scale integrated circuit is provided, which employs a vise made up of a pair of hollow jaws forming a shaft when the jaws are in clamping position, wherein the shaft communicates with a supply of tin, a wave of tin being provided through the shaft to bathe the zone of the leads to be tinned, the apparatus further being adapted to send a jet of gas to the tinned zone of the leads.

Abstract: The TAB substrate (10) of the very large scale integrated circuit (11) includes an insulating sheet (12) including a window (13) provided with leads (14) overhanging it, a tinned zone (19) in the window to facilitate the operation of outer lead bonding. The lead (14) may be bare or gold-plated.

Abstract: An apparatus and method of the soldering or bonding of conductive leads to corresponding conductive pads of an integrated circuit chip includes a fixed soldering tool having a soleplate shaped to match the configuration of the pads, and a bench for supporting the chip. The bench is supported by a plurality of vertically moveable rods located with respect to the bench such that the longitudinal axes of the rods intersect the surface of the chip at predetermined fixed points which are located within a surface area of the chip bonded by a rectangular or square line long which the conductive pads are positioned. The movement of each of the rods is controlled by a corresponding actuator mechanism which enables each rod to be independently controlled. By appropriately controlling the movement of each rod, the bench can be made to tilt or oscillate with respect to its central point. In operation, the rods are controlled so as to move a chip carried on the bench into engagement with the fixed soleplate.