Abstract: The invention relates to a faceplate including a dielectric layer and a protection layer. According to the invention, in order to re-scatter the UV radiation, the interface between the dielectric layer and the protection layer is structured such that it has an average roughness, which is included in the wavelength domain of said radiation, of between 130 and 20 nm in particular. Such re-scattering means are significantly more economical and effective than previous means. The aforementioned roughness can be obtained by performing an abrasion operation on the surface of the dielectric layer.

Abstract: The invention relates to a method and device for etching a thin conductive layer which is disposed on an insulating plate such as to form an electrode network thereon. Before the etching takes place, a protective film, comprising patterns corresponding to the electrodes in the network, is applied, said film being removed after etching. The inventive etching method consists in: moving the plate in the general direction of the electrodes to be formed; circulating an electrochemical bath in a shear zone which is defined by the surface of the layer to be etched and by the surface of a counter electrode; and passing an electric current between the counter electrode and the zones which are not protected by the protective film, said current being conveyed over a line of contacts which is disposed on the surface of the conductive layer perpendicularly to the direction of passage D. In this way, etching homogeneity and network formation precision are improved.

Abstract: The invention relates to a faceplate comprising a dielectric layer and a protection layer. According to the invention, in order to re-scatter the UV radiation, the interface between the dielectric layer and the protection layer is structured such that it has an average roughness, which is included in the wavelength domain of said radiation, of between 130 and 200 nm in particular. Such re-scattering means are significantly more economical and effective than previous means. The aforementioned roughness can be obtained by performing an abrasion operation on the surface of the dielectric layer.

Abstract: The invention concerns faceplate, more particularly for plasma display, comprising a substrate on which is provided at least one electrode, made of conductive material consisting of a metal alloy based on aluminium and/or zinc having a melting point higher than 700° C.; the electrode is designed to be coated with a dielectric layer. Thus, the harmful effects derived from reactions of the electrode materials with those of the dielectric layer are limited, in particular when said layer is being cured.

Abstract: The present invention relates to a plate, more particularly for plasma display panels, comprising a substrate 10 on which at least one electrode 21, made of a conducting material consisting of an aluminium-based and/or zinc-based metal alloy having a melting point above 700° C., is produced; the electrode is intended to be covered with a dielectric layer.