Abstract: Disclosed is a method for the manufacture of a contact-free card comprising an antenna embedded in a card body and connected, by its connection terminals, to the contact zones of an electronic module of the card body as well as a card obtained by such a method. The method comprises depositing a plastic sheet in a cavity of a mold; dispensing liquid plastic material into the cavity; and distributing the material on the surface of the sheet so that it is guided by the antenna in order to form a layer of the card body. The disclosed method can be applied to cards that are exclusively contact-free cards and to combined cards designed for operations such as remote cash operations.

Abstract: Portable chip-card readers enabling a remote link to be set up with a central processing unit. It consists in providing, in a pack, for at least two different types, radiofrequency or infrared for example, of communication with the central processing unit. These communications means are selected from the chip card or for detecting signals of the central processing unit, or from both together. An activation circuit is used, if necessary, to activate the reader only on the detection of these signals. It enables the use of a signal reader for different applications, such as permission for entry or the payment of highway toll fees.

Abstract: A micromodule includes a slotted metal strip and a perforated dielectric strip having a thickness of less than 70 micrometers, preferably between 30 and 50 micrometers. The metal strip is bonded to the dielectric strip so as to overlie the slots in the metal strip. A chip is bonded to the dielectric strip and connected to the metal strip through the perforations in the dielectric strip. An insulating resin layer encapsulates the chip and is bonded to the dielectric strip. The micromodule may be used, for example, in a smart card, as a radiating antenna, or as an identification label.

Abstract: The method consists in pressure bonding a first strip to a second strip through a bonding press, marking each of the strips with the pattern pitches and juxtaposing the pattern pitch markings of each strip at the time of the bonding by extension of at least one strip with respect to another and by differential heating of each of the opposing strips to cause a relative shift, by expansion, of the two strips with respect to each other.

Abstract: To provide I.C. cards that are reinforced and above all in which the card body is compatible both with using the I.C. in the card and with using a surface of the card that is coated with a film of magnetic material, at least two reinforcing sheets made of different types of reinforcing material are provided so as to adapt the expansion coefficient and the strength coefficient of the card so that both these coefficients lie within a range that is common to both card technologies. It is shown that this provides greater synergy in use of cards having both electronic memory and magnetic memory since in spite of temperature expansion magnetic card shapes are maintained, thereby making it possible to use magnetic tracks that comply with mass data storage requirements for use with magnetic tracks.

Abstract: To program a robot, without requiring action by specially qualified staff, electronic cards (called chip cards) are used. A handling workman stacks chip cards in an automatic distributor. These chip cards correspond to a set of tasks to be performed. The robot is designed to come and stand in queue before this distributor to receive the chip card which is located at the bottom of the stack and has the program of instructions which it has to carry out.

Abstract: A method for positioning an electronic component and its contacts on a card is disclosed. The electronic component is first of all placed in the cavity of the card, then the electrical contacts are placed on the card and electrically connected to the output terminals by a so-called tape automatic bonding process using a film on which the electrical contacts are deposited.

Abstract: Disclosed is a method for installing an electronic component and its electrical connections on a support provided with a cavity to house said component. A metallic layer is cut out into zones on which there is deposited a layer of polyimide which mechanically holds the said zones during the operations for the electrical connection of the electronic component and for encapsulation and installation on the support. This method avoids the use of a supporting film and of a bonder to fix the metallic joints to the film, namely elements that do not withstand high temperatures during encapsulation.

Abstract: The disclosure relates to memory cards having an electronic component housed in a cavity. The electronic support has a first base made of silicon, with a small thickness (between 50 and 100 microns) and a thicker (between 200 and 300 microns) second base, which is deposited on the first base and is formed by a material which is harder than silicon, such as cobalt, vanadium, titanium or ceramic.