Abstract: A method enabling the improving of the connections of printed circuits or the like by preventing the accumulation of droplets of metal alloy at selected connection points of conductive strips disposed on at least one surface of insulating insualting planar support member of the printed circuit. The method includes forming sharp appendages of the strips at selected connection points of the strips which appendages point in substantially the same direction and are located proximate to the selected connection points. Upon applying a film of metal alloy over the conductive strips, the sharp appendages serve for driving the excess metal alloy away from the selected connection points under the action of surface-tension during the formation of the film of metal alloy on the strip.