Patents by Inventor Jean-Pierre Levivier

Jean-Pierre Levivier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and tools for cutting semiconductor products
    Patent number: 6418922
    Abstract: A method of cutting a wafer of a semiconductor material, including breaking the wafer along cutting paths using a knife hitting a sheet supporting the wafer in a frame. The method includes using knives of different lengths according to the wafer region in which the cutting path is located using a tool block including apparatus for receiving at least two knives of different lengths and for rotating step-by-step around an axis to change the knife that is active in the wafer cutting.
    Type: Grant
    Filed: May 26, 2000
    Date of Patent: July 16, 2002
    Assignee: STMicroelectronics S.A.
    Inventors: André Dubois, Jean-Pierre Levivier