Abstract: The leadframe has a perforation to form, between a central platform and a peripheral part located a certain distance apart, radiating elongate leads. The leadframe has, on its rear face that comes into contact with a bearing surface of a mold, at least one recess and a groove for connecting this recess to the perforation.

Abstract: The leadframe has a perforation to form, between a central platform and a peripheral part located a certain distance apart, radiating elongate leads. The leadframe has, on its rear face that comes into contact with a bearing surface of a mold, at least one recess and a groove for connecting this recess to the perforation.

Abstract: A semiconductor device includes a chip forming an integrated circuit, an electrical leadframe, and a heat sink. The passive face of the chip is fixed by adhesive bonding to a bearing face of the heat sink. The leadframe has a central opening giving it the shape of a central leadframe ring, which extends around the chip and which is fixed so as to bear on the bearing face of the heat sink. The central leadframe ring is fixed by soldering to the bearing face of the heat sink respectively at four points far from the corners of the central leadframe ring. The bearing face of the heat sink has alignment and fixing studs which project and are engaged in through-passages in the central leadframe ring.

Abstract: A heat sink for mounting a semiconductor chip in a plastic casing. The upper surface of the heat sink is in thermal contact with the semiconductor chip, the lower surface is coplanar with a main surface of the casing. The heat sink is formed from a substantially square sheet of metal having each of its corners folded as a tongue to provide a substantially square base, each of the folded tongues forming the lower surface of the base.

Abstract: An integrated circuit casing includes an insulating plate having metallized through holes connected to conductive tracks. The conductive tracks on the lower surface extend to first pads which are designed to receive connection balls. The conductive tracks of the upper surface extend to second pads connected to terminals of an integrated circuit chip. The chip is glued on the upper surface of the plate. An encapsulation material embeds the chip. A first insulating layer is deposited on the lower surface of the plate and etched away in front of the first pads. A second insulating layer is deposited on the upper surface of the plate and etched away in front of the second pads and the through holes, the encapsulation material filling the holes.

Abstract: A heat sink for mounting a semiconductor chip in a plastic casing. The upper surface of the heat sink is in thermal contact with the semiconductor chip, the lower surface is coplanar with a main surface of the casing. The heat sink is formed from a substantially square sheet of metal having each of its corners folded as a tongue to provide a substantially square base, each of the folded tongues forming the lower surface of the base.