Abstract: The present invention relates to a device for generating a wave of solder in a wave soldering machine used for soldering components on printed circuit boards passing through the machine, said device being equipped with a nozzle comprising an elongated chamber with convergent walls and a discharge opening at its upper part, which opening extends below the displacement path of the printed circuit boards and through the entire width of said path, said nozzle, which is connected with a reservoir supplying liquid solder and equipped with heating elements, being designed to send an upwardly directed stream of solder which forms a wave, the said wave licking the lower face of the printed circuit boards and the components leads protruding therefrom. Said device is equipped, close to the opening of the nozzle, with at least one auxiliary heater capable of heating up the solder in the vicinity of the wave and to keep its temperature there to a value higher than a given value.

Abstract: Wave soldering machine of the type comprising a frame, at least one solder pot mounted on the frame and equipped with a nozzle designed to produce a wave of solder, a conveyor mounted on the frame and designed to carry the printed circuit boards along a substantially linear path, and a device for adjusting the height of the solder pot, thus permitting the adjustment of the height of the wave with respect to the path, machine wherein the frame comprises a moving track of general direction similar to that of the conveyor and on which is mounted the solder pot, the path and track forming together a predetermined angle of small value, and the track having an inclination as small as possible with respect to the horizontal, and a device for adjusting the position of the solder pot along the moving track.