Abstract: A light tube for illumination by a power supply circuit includes a bulb portion and at least one end cap disposed on the bulb portion. A plurality of light emitting diodes is disposed inside the bulb portion for illuminating in response to electrical current to be received from the power supply circuit. The light emitting diodes are arranged in spaced-apart groupings.

Abstract: Disclosed are a variety of porous and non-porous wire-like structures of microscopic and nanoscopic scale. For instance, disclosed are structures that comprise a porous object that comprises: (i) a first region; and (ii) a second region adjacent to the first region along an axis of the object, where the first region has at least one porous property different from that of the second region. Also disclosed are structures that include: (i) a high resistivity silicon; and (ii) a cross-section that is substantially perpendicular to an axis of the object. Also disclosed are methods of making and using such structures.

Abstract: The invention relates to a blade for a lining of a mould intended for vulcanizing a tire tread, the said blade being produced by selective laser melting. The blade comprises an anchoring part configured to anchor the blade in a body of the lining, a moulding part configured to mould at least one cut in the tread of the tire. The blade further comprises reinforcing means, wholly present in the anchoring part of the said blade.

Abstract: The invention relates to a lining assembly (14) comprising a plurality of lining elements (18) intended to be attached to a support block (12) of a segment (10) of a mold for a tire, the lining elements (18) being intended to form tread blocks of part of a tread band of a tire, the assembly (14) further comprising at least one sacrificial connecting element (24) joining the lining elements (18) together.

Abstract: Methods and apparatus are disclosed for condensing vapour phase compounds or elements, typically metals such as magnesium, obtained by reduction processes.

Abstract: The present invention relates to a method for fabricating an interconnect stack of an integrated-circuit device. Air gaps are fabricated in the interconnect stack on one or more interconnect levels. The method comprises forming local etch vias (216, 218) between a lower etch-barrier layer (236) and an upper etch-barrier layer (211) on top of an upper-intermediate interconnect level (224). Lateral inhomogeneities of the dielectric constant on the upper-intermediate interconnect level are removed in comparison with prior-art devices. For in the finished interconnect stack local variations in the dielectric permittivity can only occur at the (former) etch vias, which are either visible by the presence of air cavities or hardly visible due to a later filling with the dielectric material of the next interlevel dielectric layer.

Abstract: The invention relates to a lining assembly (14), characterized in that it comprises: a skin (18) having first (20) and second (22) opposed surfaces, the first surface (20) being intended to be in contact with a support block (12) of a tire mould, and a plurality of lining elements (24) projecting from the second surface (22) of the skin (18), the lining elements being intended to form tread patterns on a portion of a radially external surface of a tire.

Abstract: The invention relates to a lining assembly (14) comprising a plurality of lining elements (18) intended to be attached to a support block (12) of a segment (10) of a mould for a tire, the lining elements (18) being intended to form tread blocks of part of a tread band of a tire, the assembly (14) further comprising at least one sacrificial connecting element (24) joining the lining elements (18) together.

Abstract: A sclerosing embolizing hydrogel comprising from about 0.1% by weight to about 4.0% by weight of chitosan; from about 0.01M to about 1M of hydrochloric acid; from 0% by volume to about 40% by volume of iopamidol; from 0.5% by weight to about 25% by weight of ?-glycerophosphate disodium salt; and from about 0.05% by weight to about 4% by weight of sodium tetradecyl sulphate. Also a kit for synthesizing the hydrogel and a method using the hydrogel to treat a vascular defect in a subject.

Abstract: Disclosed are a variety of porous and non-porous wire-like structures of microscopic and nanoscopic scale. For instance, disclosed are structures that comprise a porous object that comprises: (i) a first region; and (ii) a second region adjacent to the first region along an axis of the object, where the first region has at least one porous property different from that of the second region. Also disclosed are structures that include: (i) a high resistivity silicon; and (ii) a cross-section that is substantially perpendicular to an axis of the object. Also disclosed are methods of making and using such structures.

Abstract: One aspect of the present invention relates to methods of embolizing a vascular site in a mammal comprising introducing into the vasculature of a mammal a composition comprising an inverse thermosensitive polymer, wherein said inverse thermosensitive polymer gels in said vasculature, which composition may be injected through a small catheter, and which compositions gel at or below body temperature. In certain embodiments of the methods of embolization, said composition further comprises a marker molecule, such as a dye, radiopaque, or an MRI-visible compound.

Abstract: A vehicular bus having a roof reinforcement structure having a plurality of hubs and angularly spaced reinforcement channel members extending radially outward from each hub. The vehicular bus further includes and improved destination sign and advertising panel members positioned in the interior of the bus and extending down the sides of a bus visible through the side windows.

Abstract: The present invention relates to a method for fabricating an interconnect stack of an integrated-circuit device. Air gaps are fabricated in the interconnect stack on one or more interconnect levels. The method comprises forming local etch vias (216, 218) between a lower etch-barrier layer (236) and an upper etch-barrier layer (211) on top of an upper-intermediate interconnect level (224). Lateral inhomogeneities of the dielectric constant on the upper-intermediate interconnect level are removed in comparison with prior-art devices. For in the finished interconnect stack local variations in the dielectric permittivity can only occur at the (former) etch vias, which are either visible by the presence of air cavities or hardly visible due to a later filling with the dielectric material of the next interlevel dielectric layer.

Abstract: The invention concerns a method for testing immunity to noise derived from interferences between components in a mixed analogic and digital electronic system. The method comprises determining by simulating the highest-level noise observed in the system, or the worst noise generated by interferences. If a test for noise sensitivity is successful with this injected worst noise, then the system is accepted. In the case where the worst noise test fails, the method comprises calculating by simulating the lowest-level noise observed in the system, or the injected best noise. If a test for noise sensitivity fails with this injected best signal, then the system is rejected.

Abstract: A bus side wall construction includes a skeletal member formed by a plurality of metallic members welded together and a plurality of window assemblies. The metallic members include a longitudinal roof member, a longitudinal lower member, a longitudinal upper member and a longitudinal waist member disposed between the longitudinal upper and lower members. Spaced vertical tubular members extend from the longitudinal waist member. Cross orientated tubular truss members extend between the longitudinal waist member and the longitudinal lower member. The window assemblies are positioned above the longitudinal waist member and supported by the vertical tubular members. An outer and inner skin covers the skeletal member from the longitudinal waist member and the longitudinal lower member. Insulation members are secured between the inner and outer skins.

Abstract: A bus construction has a front entry door assembly with adjacent front and rear panels, wherein the rear panel is wider than the front panel so that the front panel does not block the driver's view to the side rear view mirror when the door is in the open position. The front entry door assembly is disposed in the front portion of the sidewall of the bus that is inwardly tapered to provide easy access into the interior of the bus through the opened panels by a wheel-chair bound passenger. A destination sign is configured in a support spaced from the front windshield to eliminate frost or moisture condensation on the destination sign when the bus is in use. Panels are also provided along the upper edges of the sidewalls of the bus for providing sequential displays advertising. The advertising presentation is protected and viewed through the upper portions of the glass of the sidewall window assemblies.

Abstract: A process for the milling of a nuclear graphite contaminated with radioelements includes subjecting the graphite, immersed in a liquid medium, to high-voltage pulses. The liquid medium has a resistivity such that, owing to the effect of the energy conveyed by the said pulses, electric arcs are initiated and, upon contact with the graphite, break the carbon-carbon bonds that make up the graphite. The number of high-voltage pulses is set so as to obtain a given particle size.

Abstract: A process for the treatment of a nuclear graphite contaminated with radioelements includes subjecting the graphite, immersed in a medium containing water, to high-voltage pulses. The pulses have sufficient energy for electric arcs to be initiated and to break the constituent bonds of the water molecules and the carbon-carbon bonds of the graphite. The number of high-voltage pulses is determined so as to convert the graphite into gas.

Abstract: A method for determining transmission characteristics over a first communication path and a second communication path, while an amount of the signal transmitted over the first communication path couples into the second communication path. In case of excess of capacity over the first communication path and a shortage of capacity over the second communication path, the transmit power over said first communication path is decreased such that the requested service is met over both communication paths. This optimal transmit power can be determined by trying successive transmit power values until the requested service is met, e.g. by means of a dichotomy algorithm or the like. The optimal transmit power value can be computed directly as well, e.g. by making use of the transfer characteristics of the coupling path. A transceiver unit may also be used to implement the present method.

Abstract: A vehicular bus having a roof reinforcement structure having a plurality of hubs and angularly spaced reinforcement channel members extending radially outward from each hub. The vehicular bus further includes and improved destination sign and advertising panel members positioned in the interior of the bus and extending down the sides of a bus visible through the side windows.