Abstract: A first chip comprises a first set of one or more metal layers having a first thickness and comprising at least one metal layer that has a first CTE. A first volume of the first chip is adjacent to the first set of one or more metal layers. A second volume of the first chip comprises one or more electronic or photonic structures, and a second set of one or more metal layers that has a second thickness at least twice as large as the first thickness. At least one metal layer in the second set has a second CTE. A set of one or more metal structures of the first chip is adjacent to the second volume and comprises at least one metal structure electrically connected to at least a portion of at least one metal layer in the second set of one or more metal layers.

Abstract: A coherent light source is configured to output an optical wave. An optical modulation module is configured to provide spatially-dependent modulations to at least one of (1) a phase or (2) an amplitude of the optical wave, thereby resulting in a modified optical wave. A dispensing structure comprises a substrate bonded to one or more deposition materials capable of being ejected from the substrate, or in conjunction with a portion of the substrate, by exposure to an optical intensity above a threshold. The spatially-dependent modulations are determined based at least in part on a target intensity profile of the modified optical wave at a surface of or within the dispensing structure.

Abstract: In one aspect, in general, a method for placing a chip for device manufacturing comprises: picking up the chip with a component placement tool comprises a tool surface; spatially translating the component placement tool and the chip along a direction substantially perpendicular to a plane defined by a reference surface, the spatially translating comprising beginning the spatially translating at a first spatial coordinate with respect to the direction, and ending the spatially translating when contact between the reference surface and the tool surface is detected by a sensor at a second spatial coordinate with respect to the direction; and in response to detecting the contact, releasing the chip from the component placement tool and onto a portion of a device assembly in proximity to the second spatial coordinate with respect to the direction.

Abstract: Disclosed include compositions, kits and methods for nucleic acid-based detection and identification of vaginal disorders, for example, vulvovaginal candidiasis, trichomoniasis and/or bacterial vaginosis. The compositions, kits and methods can be used for obtaining robust diagnostic testing performance against interfering substances, for example, gels present in clinical vaginal-swab samples.