Abstract: A device for connecting a wire to a support, for example a semiconductor device, by means of thermocompression bonding, by buttwelding, has a movable tool for holding the wire while one end is exposed. An electrode is spaced from the wire end and means are provided for producing a high electric voltage between the electrode and the wire end so as to produce a spark discharge therebetween sufficient to melt the wire end and form a ball. The tool is then used to cause thermocompression bonding.

Abstract: The invention concerns a process for the two-sided exposure of a semiconductor or substrate plate, especially exposure of a wafer, through exposure masks which are arranged in plane parallel, parallel and rotational alignment to either side of a semiconductor plate. The invention further concerns an apparatus for parallel and rotational alignment to either side of a semiconductor plate. The invention further concerns an apparatus for parallel and rotational alignment of a semiconductor or substrate plate, especially alignment of a wafer, in relation to two exposure masks, operating on either of the two surfaces of the semiconductor or substrate plate, for the purpose of a two-sided exposure, in accord with the process established by the invention.