Abstract: The electrical contact (200) comprises a contact part (212) exhibiting a surface (228, 230) intended to be in contact with the surface of a support, and a clip (202) intended to receive a pin of an electrical component, so that the pin received lies along a main axis parallel to an up/down direction. The clip (202) comprises at least two jaws (204, 206, 208, 210) around the axis A, which are intended to grip the pin laterally, each jaw (204, 206, 208, 210) exhibiting a fixed end and a free end, and the contact surface is formed by at least one flange (228, 230) intended to come to bear on said surface of the support.

Abstract: A production line for producing electronic modules including a printed-circuit board, at least one first-type component, and at least one second-type component, wherein the production line includes a unit for putting the first-type component in place, a general heating unit for melting a solder placed between the at least one first-type component and the circuit, a unit for putting the second-type component in place, and a local heating unit for melting a solder placed between the at least one second-type component and the circuit.

Abstract: An electronic module (10) designed to be installed in a vehicle, comprises a casing (11) containing at least two circuit boards (12, 13) connected together by at least one electrical conductor (14), the conductor having one of its ends bonded to one of the circuit boards and the other of its ends bonded to the other circuit board, the ends of the conductor being bonded by a “wedge bonding” technique, the casing also containing a protective resin (17) coating at least one of the bonded ends of the electrical conductor. This resin is a polyurethane resin.

Abstract: The electrical contact (200) comprises a contact part (212) exhibiting a surface (228, 230) intended to be in contact with the surface of a support, and a clip (202) intended to receive a pin of an electrical component, so that the pin received lies along a main axis parallel to an up/down direction. The clip (202) comprises at least two jaws (204, 206, 208, 210) around the axis A, which are intended to grip the pin laterally, each jaw (204, 206, 208, 210) exhibiting a fixed end and a free end, and the contact surface is formed by at least one flange (228, 230) intended to come to bear on said surface of the support.

Abstract: A production line for producing electronic modules including a printed-circuit board, at least one first-type component, and at least one second-type component, wherein the production line includes a unit for putting the first-type component in place, a general heating unit for melting a solder placed between the at least one first-type component and the circuit, a unit for putting the second-type component in place, and a local heating unit for melting a solder placed between the at least one second-type component and the circuit.

Abstract: A process for manufacturing an electronic module including a printed-circuit board, at least one first-type component and one second-type component is disclosed. The process involves placing solder on the board, putting the first-type component in a first position, heating the entire board to melt the solder, resulting in soldering of the first-type component, putting the second-type component in a second position such that the second-type component has leads bearing on the board via the solder, and heating the solder locally to melt the solder such that the second-type component is soldered by applying two electrodes on each lead of the second-type component and making an electrical current flow between the electrodes to heat each lead of the second-type component. Each of the two electrodes directly contacts each lead of the second-type component to make the current flow between the two electrodes via the corresponding lead of the second-type component.

Abstract: An electronic module includes a board with a printed circuit, at least one component of a first type soldered to the board, and at least one component of a second type. The component of the second type extends above the at least one component of the first type. The at least one component of the first type is placed at least partially between the at least one component of the second type and the board and the at least one component of the second type includes a plurality of pads soldered to the board.

Abstract: An electronic module (10) designed to be installed in a vehicle, comprises a casing (11) containing at least two circuit boards (12, 13) connected together by at least one electrical conductor (14), the conductor having one of its ends bonded to one of the circuit boards and the other of its ends bonded to the other circuit board, the ends of the conductor being bonded by a “wedge bonding” technique, the casing also containing a protective resin (17) coating at least one of the bonded ends of the electrical conductor. This resin is a polyurethane resin.

Abstract: The invention relates to a method for producing an electronic module (2) comprising a printed circuit (4) board (3), at least one first type of component (5), and a second type of component (6), said method comprising the following steps: solder (8) is placed on the board; the first type of component is placed in position; the board is generally heated in order to melt the solder in such a way as to solder the first type of component; the second type of component is positioned in such a way that it has tongues (7) which are supported on the board by means of solder; and the solder is locally heated such that it melts in order to solder the second type of component. The invention also relates to a production line for implementing said method.

Abstract: The invention relates to a method for producing an electronic module (2) comprising a printed circuit (4) board (3), at least one first type of component (5), and a second type of component (6), said method comprising the following steps: solder is placed on the board; the first type of component is positioned; the solder is melted in order to solder the first type of component; the second type of component is positioned in such a way that it extends above the first type of component and has tongues (7) supported on the board by means of solder; and the solder is melted in order to solder the second type of component.

Abstract: A method for forming a display cell with counter-electrode contact pick-ups. Contact blocks are separated from counter-electrode contacts by means of a passivation film. An electrical connection between the counter-electrode and the contacts is obtained by calcining the glue of the blocks to render it conductive by the use of a laser beam. The passivation film and counter-electrode contact are also perforated by using the laser beam.

Abstract: A method for embodying a display cell with a counter-electrode contact pickup. Contact blocks 12 are separated from counter-electrode contacts 20 by passivation film 22. The electrodes linked between the counter-electrode and the contacts 20 are obtained by calcining the glue of the blocks so as to render them conductive by using a laser beam 30. In addition, the passivation film 22 is perforated by using the laser beam 30. This method finds particular application in the embodiment of liquid crystal display screens.