Abstract: In one embodiment of an epitaxial LED device, a buffer layer (e.g. dielectric layer) between the current spreading layer and the substitute substrate includes a plurality of vias and has a refractive index that is below that of the current spreading layer. A reflective metal layer between the buffer layer and the substitute substrate is connected to the current spreading layer through the vias in the buffer layer. The buffer layer separates the current spreading layer from the reflective metal layer. In yet another embodiment, stress management is provided by causing or preserving stress, such as compressive stress, in the LED so that stress in the LED is reduced when it experiences thermal cycles.

Abstract: The optical lens embodiment of the invention refracts and reflects light emitted from the light emitting diode chips on a unique combination of curved surfaces to obtain the desired coupling to a lateral light guide. The system of curved surfaces redirects rays from multiple LED chips laterally by multiple refraction and/or reflection. The optical lens has an optical axis, and comprises a bottom surface and a curved reflecting surface having a concave side. The concave side is oriented to face said bottom surface at an oblique angle. The reflecting surface surrounds the optical axis. The lens comprises a first curved refracting surface having a concave side facing the concave side of the reflecting surface and a second refracting surface extending as a smooth curve from the bottom surface to the first refracting surface.

Abstract: In one embodiment of an epitaxial LED device, a buffer layer (e.g. dielectric layer) between the current spreading layer and the substitute substrate comprises a plurality of vias and has a refractive index that is below that of the current spreading layer. A reflective metal layer between the buffer layer and the substitute substrate is connected to the current spreading layer through the vias in the buffer layer. The buffer layer separates the current spreading layer from the reflective metal layer. In yet another embodiment, stress management is provided by causing or preserving stress, such as compressive stress, in the LED so that stress in the LED is reduced when it experiences thermal cycles.

Abstract: The optical lens embodiment of the invention refracts and reflects light emitted from the light emitting diode chips on a unique combination of curved surfaces to obtain the desired coupling to a lateral light guide. The system of curved surfaces redirects rays from multiple LED chips laterally by multiple refraction and/or reflection. The optical lens has an optical axis, and comprises a bottom surface and a curved reflecting surface having a concave side. The concave side is oriented to face said bottom surface at an oblique angle. The reflecting surface surrounds the optical axis. The lens comprises a first curved refracting surface having a concave side facing the concave side of the reflecting surface and a second refracting surface extending as a smooth curve from the bottom surface to the first refracting surface.

Abstract: A soft solder flowing into the recesses of a semiconductor thin film LED provides: (a) increased bonding strength and better mechanical durability, (b) improved heat dissipation, (c) enhanced light extraction when the LED film is bonded to a new carrier. Annealing localized islands of absorbing metal creates an ohmic contact. Those isolated islands are inter-connected by a layer of a highly reflective metal. This design enables a significant absorption reduction within the LED device and leads to a significant improvement of light extraction. Additionally, the light extraction efficiency of an isotropic light emitting device is improved via surface shaping of the device by a 2D-array of micro-lenses and photonic band gap structure. For manufacturability purpose the making of micron-size lenses of the surface of the chip may preferably be performed as a final step, preferably with optical lithography.