Abstract: A flexible, preferably polymer-based, rectangular floor covering element of double-angling type has six sides: a decorative top face and a bottom face, as well as four edges. The first long edge has a first connection profile with a recess at the bottom face and a tongue overhanging the recess. The second long edge opposite the first long edge has a second connection profile with a protrusion at the bottom face and a groove for receiving the tongue of the first profile. The first short edge is equipped with the first profile and the second short edge is equipped with the second profile. When looking at the floor covering element from above the top face, the edges of the floor covering element are arranged in the following order in the clockwise direction: 1) the first long edge, 2) the first short edge, 3) the second long edge and 4) the second short edge.

Abstract: The present invention is related to decorative surface coverings, in particular floor or wall coverings, exhibiting low volatile organic compounds (VOC) emission, comprising one or more adjacent plasticized polyvinyl chloride layers and a polyurethane top-layer, said top-layer being obtained from radiation curing a 100% solids polyurethane formulation.

Abstract: The present invention is related to decorative surface coverings, in particular floor or wall coverings, exhibiting low VOC emission, comprising one or more adjacent plasticized polyvinyl chloride layers and a polyurethane top-layer, said top-layer being obtained from the actinic irradiation of an aqueous ethylenically unsaturated polyurethane dispersion after evaporation of the water part. The decorative surface coverings comprise a mechanical embossed textured and/or patterned structure.

Abstract: A process for producing a surface covering with an embossed printed surface is described. A substrate (16) is continuously moved through a production line, and this substrate (16) is first provided, in a printing equipment (12), with a printed pattern and thereafter, in an embossing equipment (14), with an embossed pattern, which is registered with the printed pattern. The printing equipment (12) produces the printed pattern in-line with the production of the embossed pattern. During printing in the printing equipment (12), the printed pattern is stretched or compressed, dynamically responsive to indicators of misalignments between the printed pattern and the embossed pattern, so as to correct or prevent the misalignments. A production line for carrying out this process is also proposed.

Abstract: A process for producing a surface covering with an embossed printed surface is described. A substrate (16) is continuously moved through a production line, and this substrate (16) is first provided, in a printing equipment (12), with a printed pattern and thereafter, in an embossing equipment (14), with an embossed pattern, which is registered with the printed pattern. The printing equipment (12) produces the printed pattern in-line with the production of the embossed pattern. During printing in the printing equipment (12), the printed pattern is stretched or compressed, dynamically responsive to indicators of misalignments between the printed pattern and the embossed pattern, so as to correct or prevent the misalignments. A production line for carrying out this process is also proposed.

Abstract: A process for producing a surface covering with an embossed printed surface is described. A substrate (16) is continuously moved through a production line, and this substrate (16) is first provided, in a printing equipment (12), with a printed pattern and thereafter, in an embossing equipment (14), with an embossed pattern, which is registered with the printed pattern. The printing equipment (12) produces the printed pattern in-line with the production of the embossed pattern. During printing in the printing equipment (12), the printed pattern is stretched or compressed, dynamically responsive to indicators of misalignments between the printed pattern and the embossed pattern, so as to correct or prevent the misalignments. A production line for carrying out this process is also proposed.

Abstract: The invention relates to a floorboard for a flooring system comprising a plurality of mechanically connectable floorboards. The floorboard comprises a first connecting profile along a first side and a second connecting profile along a second side that is parallel to the first side. The first connecting profile is configured for locking engagement with the second connecting profile of another floorboard both horizontally and vertically. The first connecting profile comprises a protruding strip at the bottom face of the floorboard, the protruding strip terminating outwardly in a locking element projecting towards the top face of the floor board. The second connecting profile comprises an overhanging tongue delimiting at its bottom a recess for receiving the protruding strip, the recess comprising a locking groove configured for cooperating with the locking element so as to provide a horizontal locking effect.

Abstract: A decorative surface covering element has a height of 4 mm or less from its top surface to the bottom surface. The surface covering element is configured as a multi-layered compound with a polymer-based core layer laminated between a backing layer and a wear layer, the core layer comprising a core material having a lesser shore hardness than the backing layer and the wear layer. The surface covering element comprises a first connecting profile, integral with the multi-layered compound, that extends along at least one of the edges of the surface covering element. The first connecting profile comprises at least one protrusion realized in the core layer, the protrusion having side surfaces for being seized between opposite surfaces of a recess in a second connecting profile, configured for mating with the first connecting profile, of another decorative surface covering element.

Abstract: A synthetic multilayer floor covering has floor panels, each of which comprises at least a first and a second edge with a first and a second connecting profile, respectively. The connecting profiles are complementarily shaped so that adjacent floor panels may be coupled to one another. The first connecting profile of a first floor panel and/or the second connecting profile of a second floor panel is deformed when connecting profiles become coupled with each other. The deformation comprises a component that persists as the connecting profiles remain coupled. The persistent deformation results in stress within the connecting profiles, which are made of viscoelastic material. That material undergoes significant stress relaxation. At standard ambient temperature and pressure, the stress within the first and/or the second connecting profile decreases by at least 40% within 12 hours after the connecting profiles have become coupled.

Abstract: A synthetic multilayer floor covering has floor panels, each of which comprises at least a first and a second edge with a first and a second connecting profile, respectively. The connecting profiles are complementarily shaped so that adjacent floor panels may be coupled to one another. The first connecting profile of a first floor panel and/or the second connecting profile of a second floor panel is deformed when connecting profiles become coupled with each other. The deformation comprises a component that persists as the connecting profiles remain coupled. The persistent deformation results in stress within the connecting profiles, which are made of viscoelastic material. That material undergoes significant stress relaxation. At standard ambient temperature and pressure, the stress within the first and/or the second connecting profile decreases by at least 40% within 12 hours after the connecting profiles have become coupled.

Abstract: The invention relates to a floorboard for a flooring system comprising a plurality of mechanically connectable floorboards. The floorboard comprises a first connecting profile along a first side and a second connecting profile along a second side that is parallel to the first side. The first connecting profile is configured for locking engagement with the second connecting profile of another floorboard both horizontally and vertically. The first connecting profile comprises a protruding strip at the bottom face of the floorboard, the protruding strip terminating outwardly in a locking element projecting towards the top face of the floor board. The second connecting profile comprises an overhanging tongue delimiting at its bottom a recess for receiving the protruding strip, the recess comprising a locking groove configured for cooperating with the locking element so as to provide a horizontal locking effect.

Abstract: An encapsulated device comprises: an organic optoelectronic component exhibiting at least one sensitive surface protected from oxygen and/or water vapor; and a multilayer encapsulation structure covering the sensitive surface, comprising at least one layer made of organic material interposed between first and second barrier layers made of nonmetallic inorganic material impermeable to oxygen and water vapor; wherein the barrier layers are made of a material chosen from a stoichiometric metal oxide, stoichiometric silicon oxide and a silicon oxynitride and produced by atomic layer deposition, and wherein the multilayer encapsulation structure also comprises at least one active layer containing a nonstoichiometric oxide exhibiting an oxygen deficiency, also interposed between the first and said second barrier layers. A process for encapsulating a component exhibiting a “sensitive” surface protected from oxygen and/or water vapor by producing a multilayer encapsulation structure is provided.

Abstract: A flexible, preferably polymer-based, rectangular floor covering element of double-angling type has six sides: a decorative top face and a bottom face, as well as four edges. The first long edge has a first connection profile with a recess at the bottom face and a tongue overhanging the recess. The second long edge opposite the first long edge has a second connection profile with a protrusion at the bottom face and a groove for receiving the tongue of the first profile. The first short edge is equipped with the first profile and the second short edge is equipped with the second profile. When looking at the floor covering element from above the top face, the edges of the floor covering element are arranged in the following order in the clockwise direction: 1) the first long edge, 2) the first short edge, 3) the second long edge and 4) the second short edge.

Abstract: A multilayer floor covering comprises a resilient top covering (12) for providing a walking surface, a sheet-type sensor layer (16) arranged underneath the resilient top covering, a first adhesive layer (14) attaching the resilient top covering to the sheet-type sensor layer and a second adhesive layer (18) for attaching the sheet-type sensor layer to an underlying subfloor (20). To facilitate access to the sheet-type sensor layer, the first adhesive layer (14) is configured to provide lower resistance to peeling than the second adhesive layer (18). The invention further proposes a kit of parts for achieving such a floor covering as well as a method for installing the floor covering.

Abstract: A process for producing a surface covering with an embossed printed surface is described. A substrate (16) is continuously moved through a production line, and this substrate (16) is first provided, in a printing equipment (12), with a printed pattern and thereafter, in an embossing equipment (14), with an embossed pattern, which is registered with the printed pattern. The printing equipment (12) produces the printed pattern in-line with the production of the embossed pattern. During printing in the printing equipment (12), the printed pattern is stretched or compressed, dynamically responsive to indicators of misalignments between the printed pattern and the embossed pattern, so as to correct or prevent the misalignments. A production line for carrying out this process is also proposed.

Abstract: A decorative surface covering element has a height of 4 mm or less from its top surface to the bottom surface. The surface covering element is configured as a multi-layered compound with a polymer-based core layer laminated between a backing layer and a wear layer, the core layer comprising a core material having a lesser shore hardness than the backing layer and the wear layer. The surface covering element comprises a first connecting profile, integral with the multi-layered compound, that extends along at least one of the edges of the surface covering element. The first connecting profile comprises at least one protrusion realized in the core layer, the protrusion having side surfaces for being seized between opposite surfaces of a recess in a second connecting profile, configured for mating with the first connecting profile, of another decorative surface covering element.

Abstract: The present invention is related to decorative surface coverings, in particular floor or wall coverings, exhibiting low VOC emission, comprising one or more adjacent plasticized polyvinyl chloride layers and a polyurethane top-layer, said top-layer being obtained from the actinic irradiation of an aqueous ethylenically unsaturated polyurethane dispersion after evaporation of the water part. The decorative surface coverings comprise a mechanical embossed textured and/or patterned structure.

Abstract: The present invention is related to decorative surface coverings, in particular floor or wall coverings, exhibiting low volatile organic compounds (VOC) emission, comprising one or more adjacent plasticized polyvinyl chloride layers and a polyurethane top-layer, said top-layer being obtained from radiation curing a 100% solids polyurethane formulation.

Abstract: An encapsulated device comprises: an organic optoelectronic component exhibiting at least one sensitive surface protected from oxygen and/or water vapor; and a multilayer encapsulation structure covering the sensitive surface, comprising at least one layer made of organic material interposed between first and second barrier layers made of nonmetallic inorganic material impermeable to oxygen and water vapor; wherein the barrier layers are made of a material chosen from a stoichiometric metal oxide, stoichiometric silicon oxide and a silicon oxynitride and produced by atomic layer deposition, and wherein the multilayer encapsulation structure also comprises at least one active layer containing a nonstoichiometric oxide exhibiting an oxygen deficiency, also interposed between the first and said second barrier layers. A process for encapsulating a component exhibiting a “sensitive” surface protected from oxygen and/or water vapor by producing a multilayer encapsulation structure is provided.

Abstract: A decorative moulding for a building wall comprises a profiled body with a back side for attachment to the building wall and a front side, the profiled body having a recess on the back side for accommodating a LED ribbon and a coating film attached on the front side. The profiled body is made of translucent light-diffusing material.