Abstract: A method and associated system. The method includes steps of: (a) a voltage bin is selected from of a set of voltage bins, each voltage bin having a different range of frequencies based on the highest operating frequency and the lowest operating frequency specified for an integrated circuit chip not previously tested; (b) a functional path test is performed on a selected path of a set of testable data paths of the integrated circuit chip not previously tested; (c) if the integrated circuit chip fails the functional path test, then a current supply voltage value is changed to a voltage value associated with a not previously selected voltage bin; (d) a not previously tested path of the set of testable paths is selected. Steps (b), (c) and (d) are repeated until every path of the set of testable paths has been tested.

Abstract: A method and associated system. The method includes steps of: (a) a voltage bin is selected from of a set of voltage bins, each voltage bin having a different range of frequencies based on the highest operating frequency and the lowest operating frequency specified for an integrated circuit chip not previously tested; (b) a functional path test is performed on a selected path of a set of testable data paths of the integrated circuit chip not previously tested; (c) if the integrated circuit chip fails the functional path test, then a current supply voltage value is changed to a voltage value associated with a not previously selected voltage bin; (d) a not previously tested path of the set of testable paths is selected. Steps (b), (c) and (d) are repeated until every path of the set of testable paths has been tested.

Abstract: A method, test system and computer program product and system for voltage binning integrated circuit chips. The method includes selecting or changing a voltage bin of a set of voltages bins corresponding to frequency specification limits of an integrated circuit chip using functional testing of data paths of the integrated circuit chip.

Abstract: A method, test system and computer program product and system for voltage binning integrated circuit chips. The method includes selecting or changing a voltage bin of an integrated circuit chip using functional testing of data paths of the integrated circuit chip.

Abstract: Disclosed is a method that predicts test yield for a semiconductor product, prior to design layout. This is accomplished by applying a critical area analysis to individual library elements that are used to form a specific product and by estimating the test yield impact of combining these library elements. For example, the method considers the test yield impact of sensitivity to library element to library element shorts and the test yield impact of sensitivity to wiring faults. The disclosed method further allows die size growth to be traded off against the use of library elements with higher test yield in order to provide an optimal design solution. Thus, the method may be used to modify library element selection so as to optimize test yield. Lastly, the method further repeats itself at key design checkpoints to revalidate initial test yield (and cost) assumptions made when the product was quoted to a customer.

Abstract: A method of optimizing power usage in an integrated circuit design analyzes multiple operating speed cut points that are expected to be produced by the integrated circuit design. The operating speed cut points are used to divide identically designed integrated circuit devices after manufacture into relatively slow integrated circuit devices and relatively fast integrated circuit devices. The method selects an initial operating speed cut point to minimize a maximum power consumption level of the relatively slow integrated circuit devices and the relatively fast identically designed integrated circuit devices. The method then manufactures the integrated circuit devices using the integrated circuit design and tests operating speeds and power consumption levels of the identically designed integrated circuit devices.

Abstract: A method of optimizing power usage in an integrated circuit design analyzes multiple operating speed cut points that are expected to be produced by the integrated circuit design. The operating speed cut points are used to divide identically designed integrated circuit devices after manufacture into relatively slow integrated circuits and relatively fast integrated circuit devices. The method selects an initial operating speed cut point to minimize a maximum power level of the relatively slow integrated circuits and relatively fast integrated circuit devices. The method then manufactures the integrated circuit devices using the integrated circuit design and tests the operating speeds and power consumption levels of the integrated circuit devices. Then, the method adjusts the initial cut point to a final cut point based on the testing, to minimize the maximum power level of the relatively slow integrated circuits and relatively fast integrated circuit devices.

Abstract: A method generates area dependent design rules during semiconductor technology qualification by identifying the layout parametric variation in a semiconductor technology and establishing layout dependent design rules. This method applies the area dependent design rules to identify design sensitivity to area dependent design rules and to optimize semiconductor libraries and/or semiconductor products using an on-chip parametric monitor by designing processes for library elements, semiconductor design systems, and/or custom semiconductor products using the layout dependent design rules.

Abstract: Disclosed is a method that predicts test yield for a semiconductor product, prior to design layout. This is accomplished by applying a critical area analysis to individual library elements that are used to form a specific product and by estimating the test yield impact of combining these library elements. For example, the method considers the test yield impact of sensitivity to library element to library element shorts and the test yield impact of sensitivity to wiring faults. The disclosed method further allows die size growth to be traded off against the use of library elements with higher test yield in order to provide an optimal design solution. Thus, the method may be used to modify library element selection so as to optimize test yield. Lastly, the method further repeats itself at key design checkpoints to revalidate initial test yield (and cost) assumptions made when the product was quoted to a customer.

Abstract: Disclosed is a method that predicts test yield for a semiconductor product, prior to design layout. This is accomplished by applying a critical area analysis to individual library elements that are used to form a specific product and by estimating the test yield impact of combining these library elements. For example, the method considers the test yield impact of sensitivity to library element to library element shorts and the test yield impact of sensitivity to wiring faults. The disclosed method further allows die size growth to be traded off against the use of library elements with higher test yield in order to provide an optimal design solution. Thus, the method may be used to modify library element selection so as to optimize test yield. Lastly, the method further repeats itself at key design checkpoints to revalidate initial test yield (and cost) assumptions made when the product was quoted to a customer.

Abstract: A method of modeling yield for semiconductor products includes determining expected faults for each of a plurality of library elements by running a critical area analysis on each of the library elements, and assessing, from the critical area analysis, an expected number of faults per unit area, and comparing the same to actual observed faults on previously manufactured semiconductor products. Thereafter, the expected number of faults for each library element is updated in response to observed yield. A database is established, which includes the die size and expected faults for each of the library elements. Integrated circuit product die size is estimated, and library elements to be used to create the integrated circuit die are selected. Fault and size data for each of the selected library elements are obtained, the adjusted estimated faults for each of the library elements are summed, and estimated yield is calculated.

Abstract: Embodiments herein provide a method and computer program product for optimizing router settings to increase IC yield. A method begins by reviewing yield data in an IC manufacturing line to identify structure-specific mechanisms that impact IC yield. Next, the method establishes a structural identifier for each structure-specific mechanism, wherein the structural identifiers include wire codes, tags, and/or unique identifiers. Different structural identifiers are established for wires having different widths. Furthermore, the method establishes a weighting factor for each structure-specific mechanism, wherein higher weighting factors are established for structure-specific mechanisms comprising thick wires proximate to multiple thick wires. The method establishes the structural identifiers and the weighting factors for incidence of spacing between single wide lines, double wide lines, and triple wide lines and for incidence of wires above large metal lands.

Abstract: A method of estimating integrated circuit yield comprises providing an integrated circuit layout and a set of systematic defects based on a manufacturing process. Next, the method represents a systematic defect by modifying structures in the integrated circuit layout to create modified structures. More specifically, for short-circuit-causing defects, the method pre-expands the structures when the structures comprise a higher systematic defect sensitivity level, and pre-shrinks the structures when the structures comprise a lower systematic defect sensitivity level. Following this, a critical area analysis is performed on the integrated circuit layout using the modified structures, wherein dot-throwing, geometric expansion, or Voronoi diagrams are used. The method then computes a fault density value, random defects and systematic defects are computed.

Abstract: A method, apparatus, and computer program product that performs yield estimates using critical area analysis on integrated circuits having redundant and non-redundant elements. The non-redundant elements are ignored or removed from the critical area analysis performed for undesired opens.

Abstract: Disclosed is a method that predicts test yield for a semiconductor product, prior to design layout. This is accomplished by applying a critical area analysis to individual library elements that are used to form a specific product and by estimating the test yield impact of combining these library elements. For example, the method considers the test yield impact of sensitivity to library element to library element shorts and the test yield impact of sensitivity to wiring faults. The disclosed method further allows die size growth to be traded off against the use of library elements with higher test yield in order to provide an optimal design solution. Thus, the method may be used to modify library element selection so as to optimize test yield. Lastly, the method further repeats itself at key design checkpoints to revalidate initial test yield (and cost) assumptions made when the product was quoted to a customer.

Abstract: An integrated circuit (IC) design method for use as a design and/or manufacturing tool for designing and/or manufacturing integrated circuitry (110). The method utilizes one or more library element (150A-F) to provide a flexible modeling template. Each library element includes one or more module ports (160A-F) each for accepting any one of a plurality of device modules (170). The device modules are logical representations of corresponding respective portions of the integrated circuitry. For any given module port, the corresponding device modules may be interchanged essentially without additional integrated circuitry design changes.

Abstract: A method for providing quality control on wafers running on a manufacturing line is disclosed. The resistances on a group of manufacturing test structures within a wafer running on a wafer manufacturing line are initially measured. Then, an actual distribution value is obtained based on the result of the measured resistances on the group of manufacturing test structures. The difference between the actual distribution value and a predetermined distribution value is recorded. The predetermined distribution value is previously obtained based on a ground rule resistance. Next, the resistances on a group of design test structures within the wafer are measured. The measured resistances of the group of design test structures are correlated to the measured resistances of the group of manufacturing test structures in order to obtain an offset value.

Abstract: A method and system for predicting manufacturing yield for a proposed integrated circuit The method includes: in the order recited: (a) providing a multiplicity of different integrated circuit library elements in a design database, each library element linked to a corresponding normalization factor in the design database; (b) selecting library elements from the design database to include in a proposed design for the integrated circuit; (c) generating an equivalent circuit count of the proposed design based on the normalization factors and a count of each different library element included in the proposed design; and (d) calculating a predicted manufacturing yield based on the equivalent circuit count, a predicted density of manufacturing defects and an area of the proposed integrated circuit chip.