Patents by Inventor Jeanne L. Luce
Jeanne L. Luce has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10998445Abstract: The present description relates the formation of a first level interlayer dielectric material layer within a non-planar transistor, which may be formed by a spin-on coating technique followed by oxidation and annealing. The first level interlayer dielectric material layer may be substantially void free and may exert a tensile strain on the source/drain regions of the non-planar transistor.Type: GrantFiled: May 18, 2020Date of Patent: May 4, 2021Assignee: Intel CorporationInventors: Sameer S. Pradhan, Jeanne L. Luce
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Patent number: 10964800Abstract: Semiconductor devices having fin-end stress-inducing features, and methods of fabricating semiconductor devices having fin-end stress-inducing features, are described. In an example, a semiconductor structure includes a semiconductor fin protruding through a trench isolation region above a substrate. The semiconductor fin has a top surface, a first end, a second end, and a pair of sidewalls between the first end and the second end. A gate electrode is over a region of the top surface and laterally adjacent to a region of the pair of sidewalls of the semiconductor fin. The gate electrode is between the first end and the second end of the semiconductor fin. A first dielectric plug is at the first end of the semiconductor fin. A second dielectric plug is at the second end of the semiconductor fin.Type: GrantFiled: December 2, 2016Date of Patent: March 30, 2021Assignee: Intel CorporationInventors: Byron Ho, Michael L. Hattendorf, Jeanne L. Luce, Ebony L. Mays, Erica J. Thompson
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Patent number: 10811251Abstract: A flowable chemical vapor deposition method including depositing a dielectric film precursor on a substrate in a flowable form; depositing an oligomerization agent on the substrate; forming a dielectric film from the dielectric film precursor; and curing the dielectric film under a pressure greater than atmospheric pressure. A method including depositing a dielectric film precursor as a liquid on a substrate in the presence of an oligomerization agent; treating the deposited dielectric film precursor to inhibit outgassing; and curing the dielectric film precursor to form a dielectric film. A method including delivering a dielectric film precursor as a vapor to a substrate including gap structures between device features; condensing the dielectric film precursor on the substrate to a liquid; flowing the liquid into the gap structures; and curing the dielectric film precursor under a pressure of 15 pounds per square inch gauge or greater.Type: GrantFiled: September 30, 2016Date of Patent: October 20, 2020Assignee: Intel CorporationInventors: Jeanne L. Luce, Ebony L. Mays, Aravind S. Killampalli, Jay P. Gupta
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Publication number: 20200279950Abstract: The present description relates the formation of a first level interlayer dielectric material layer within a non-planar transistor, which may be formed by a spin-on coating technique followed by oxidation and annealing. The first level interlayer dielectric material layer may be substantially void free and may exert a tensile strain on the source/drain regions of the non-planar transistor.Type: ApplicationFiled: May 18, 2020Publication date: September 3, 2020Applicant: Intel CorporationInventors: Sameer S. Pradhan, Jeanne L. Luce
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Publication number: 20200058761Abstract: Semiconductor devices having fin-end stress-inducing features, and methods of fabricating semiconductor devices having fin-end stress-inducing features, are described. In an example, a semiconductor structure includes a semiconductor fin protruding through a trench isolation region above a substrate. The semiconductor fin has a top surface, a first end, a second end, and a pair of sidewalls between the first end and the second end. A gate electrode is over a region of the top surface and laterally adjacent to a region of the pair of sidewalls of the semiconductor fin. The gate electrode is between the first end and the second end of the semiconductor fin. A first dielectric plug is at the first end of the semiconductor fin. A second dielectric plug is at the second end of the semiconductor fin.Type: ApplicationFiled: December 2, 2016Publication date: February 20, 2020Inventors: Byron HO, Michael L. HATTENDORF, Jeanne L. LUCE, Ebony L. MAYS, Erica J. THOMPSON
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Publication number: 20190181003Abstract: A flowable chemical vapor deposition method including depositing a dielectric film precursor on a substrate in a flowable form; depositing an oligomerization agent on the substrate; forming a dielectric film from the dielectric film precursor; and curing the dielectric film under a pressure greater than atmospheric pressure. A method including depositing a dielectric film precursor as a liquid on a substrate in the presence of an oligomerization agent; treating the deposited dielectric film precursor to inhibit outgassing; and curing the dielectric film precursor to form a dielectric film. A method including delivering a dielectric film precursor as a vapor to a substrate including gap structures between device features; condensing the dielectric film precursor on the substrate to a liquid; flowing the liquid into the gap structures; and curing the dielectric film precursor under a pressure of 15 pounds per square inch gauge or greater.Type: ApplicationFiled: September 30, 2016Publication date: June 13, 2019Inventors: Jeanne L. LUCE, Ebony L. MAYS, Aravind S. KILLAMPALLI, Jay P. GUPTA
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Publication number: 20190035673Abstract: An embodiment includes a semiconductor apparatus comprising: a trench with an aspect ratio of at least 7:1 (height:width); and a dielectric included in the trench; wherein the dielectric: (a) includes carbon and at least one of silicon nitride and silicon carbide, and (b) does not include an oxide. Other embodiments are described herein.Type: ApplicationFiled: March 31, 2016Publication date: January 31, 2019Inventors: Ebony L. Mays, Jeanne L. Luce, Elizabeth Mallon
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Patent number: 10147634Abstract: Techniques are disclosed for providing trench isolation of semiconductive fins using flowable dielectric materials. In accordance with some embodiments, a flowable dielectric can be deposited over a fin-patterned semiconductive substrate, for example, using a flowable chemical vapor deposition (FCVD) process. The flowable dielectric may be flowed into the trenches between neighboring fins, where it can be cured in situ, thereby forming a dielectric layer over the substrate, in accordance with some embodiments. Through curing, the flowable dielectric can be converted, for example, to an oxide, a nitride, and/or a carbide, as desired for a given target application or end-use. In some embodiments, the resultant dielectric layer may be substantially defect-free, exhibiting no or an otherwise reduced quantity of seams/voids.Type: GrantFiled: August 1, 2016Date of Patent: December 4, 2018Assignee: INTEL CORPORATIONInventors: Ritesh Jhaveri, Jeanne L. Luce, Sang-Won Park, Dennis G. Hanken
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Publication number: 20160343609Abstract: Techniques are disclosed for providing trench isolation of semiconductive fins using flowable dielectric materials. In accordance with some embodiments, a flowable dielectric can be deposited over a fin-patterned semiconductive substrate, for example, using a flowable chemical vapor deposition (FCVD) process. The flowable dielectric may be flowed into the trenches between neighboring fins, where it can be cured in situ, thereby forming a dielectric layer over the substrate, in accordance with some embodiments. Through curing, the flowable dielectric can be converted, for example, to an oxide, a nitride, and/or a carbide, as desired for a given target application or end-use. In some embodiments, the resultant dielectric layer may be substantially defect-free, exhibiting no or an otherwise reduced quantity of seams/voids.Type: ApplicationFiled: August 1, 2016Publication date: November 24, 2016Applicant: INTEL CORPORATIONInventors: Ritesh JHAVERI, Jeanne L. LUCE, Sang-Won PARK, Dennis G. HANKEN
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Patent number: 9406547Abstract: Techniques are disclosed for providing trench isolation of semiconductive fins using flowable dielectric materials. In accordance with some embodiments, a flowable dielectric can be deposited over a fin-patterned semiconductive substrate, for example, using a flowable chemical vapor deposition (FCVD) process. The flowable dielectric may be flowed into the trenches between neighboring fins, where it can be cured in situ, thereby forming a dielectric layer over the substrate, in accordance with some embodiments. Through curing, the flowable dielectric can be converted, for example, to an oxide, a nitride, and/or a carbide, as desired for a given target application or end-use. In some embodiments, the resultant dielectric layer may be substantially defect-free, exhibiting no or an otherwise reduced quantity of seams/voids.Type: GrantFiled: December 24, 2013Date of Patent: August 2, 2016Assignee: INTEL CORPORATIONInventors: Ritesh Jhaveri, Jeanne L. Luce, Sang-Won Park, Dennis G. Hanken
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Publication number: 20150179501Abstract: Techniques are disclosed for providing trench isolation of semiconductive fins using flowable dielectric materials. In accordance with some embodiments, a flowable dielectric can be deposited over a fin-patterned semiconductive substrate, for example, using a flowable chemical vapor deposition (FCVD) process. The flowable dielectric may be flowed into the trenches between neighboring fins, where it can be cured in situ, thereby forming a dielectric layer over the substrate, in accordance with some embodiments. Through curing, the flowable dielectric can be converted, for example, to an oxide, a nitride, and/or a carbide, as desired for a given target application or end-use. In some embodiments, the resultant dielectric layer may be substantially defect-free, exhibiting no or an otherwise reduced quantity of seams/voids.Type: ApplicationFiled: December 24, 2013Publication date: June 25, 2015Inventors: Ritesh Jhaveri, Jeanne L. Luce, Sang-Won Park, Dennis G. Hanken
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Patent number: 6114227Abstract: This invention relates to the design of apparatus for processing electronic devices, including equipment for chemical vapor deposition or transport polymerization. The new designs of gas separator plates, their configuration, and the regulation of gas flows through the system provides control over the pattern of precursor gas flow away from the separation plates, thereby decreasing the amount of byproducts that are deposited on the plates and throughout the reactor. New designs for shaping other surfaces of the dispersion head reduces contamination of those elements, and new designs for chamber panels decrease the deposition of byproducts on those surfaces, as well as other elements of the reactor. Decreasing deposition of byproducts increases the amount and the quality of the film that can be deposited without requiring the system to be shut down for cleaning.Type: GrantFiled: March 29, 1999Date of Patent: September 5, 2000Assignee: Quester Technology, Inc.Inventors: David Leksell, Ming Xi Chan, Joseph P. Ellul, Jeanne L. Luce, David T. Ryan, Iqbal A. Shareef, Chung J. Lee, Stephen M. Campbell, Giovanni Antonio Foggiato
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Patent number: 6079353Abstract: This invention relates to the design of apparatus for processing electronic devices, including equipment for chemical vapor deposition. The new designs of gas separator plates, their configuration, and the regulation of gas flows through the system provides control over the pattern of precursor gas flow away from the separation plates, thereby decreasing the amount of byproducts that are deposited on the plates and throughout the reactor. New designs for shaping other surfaces of the dispersion head reduces contamination of those elements, and new designs for chamber panels decrease the deposition of byproducts on those surfaces, as well as other elements of the reactor. Decreasing deposition of byproducts increases the amount of thin film, and the quality of the film which can be deposited without requiring the system to be shut down. This increases the throughput of products in the deposition process, thereby increasing the efficiency of electronic device manufacture and lowering the cost.Type: GrantFiled: March 28, 1998Date of Patent: June 27, 2000Assignee: Quester Technology, Inc.Inventors: David Leksell, Ming Xi Chan, Joseph P. Ellul, Jeanne L. Luce, David T. Ryan, Iqbal A. Shareef, Chung J. Lee, Giovanni Antonio Foggiato