Patents by Inventor Jeanne S. Pavio

Jeanne S. Pavio has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7898057
    Abstract: A power transistor includes a plurality of transistor cells. Each transistor cell has a first electrode coupled to a first electrode interconnection region overlying a first major surface, a control electrode coupled to a control electrode interconnection region overlying the first major surface, and a second electrode coupled to a second electrode interconnection region overlying a second major surface. Each transistor cell has an approximately constant doping concentration in the channel region. A dielectric platform is used as an edge termination of an epitaxial layer to maintain substantially planar equipotential lines therein. The power transistor finds particular utility in radio frequency applications operating at a frequency greater than 500 megahertz and dissipating more than 5 watts of power. The semiconductor die and package are designed so that the power transistor can efficiently operate under such severe conditions.
    Type: Grant
    Filed: March 23, 2006
    Date of Patent: March 1, 2011
    Assignee: HVVi Semiconductors, Inc.
    Inventors: Robert Bruce Davies, Warren Leroy Seely, Jeanne S Pavio
  • Patent number: 7582962
    Abstract: A heat dissipation device comprises a multilayer substrate, a channel formed in the multilayer substrate, and tubes disposed within the channel, the tubes suitable for removing heat from a heat generating device located adjacent to the multilayer substrate.
    Type: Grant
    Filed: November 7, 2007
    Date of Patent: September 1, 2009
    Assignee: Rockwell Collins, Inc.
    Inventor: Jeanne S. Pavio
  • Publication number: 20090152695
    Abstract: A semiconductor component having a semiconductor chip mounted on a packaging substrate and a method for manufacturing the semiconductor component that uses batch processing steps for fabricating the packaging substrate. A heatsink is formed using an injection molding process. The heatsink has a front surface for mating with a semiconductor chip and a leadframe assembly. The heatsink also has a back surface from which a plurality of fins extend. The leadframe assembly includes a leadframe having leadframe leads extending from opposing sides of the leadframe to a central area of the leadframe. A liquid crystal polymer is disposed in a ring-shaped pattern on the leadframe leads. The liquid-crystal polymer is partially cured. The leadframe assembly is mounted on the front surface of the heatsink and the liquid crystal polymer is further cured to form a packaging assembly, which is then singulated into packaging substrates.
    Type: Application
    Filed: February 25, 2009
    Publication date: June 18, 2009
    Applicant: HVVI Semiconductors, Inc.
    Inventor: Jeanne S. Pavio
  • Patent number: 7335534
    Abstract: A semiconductor component having a semiconductor chip mounted on a packaging substrate and a method for manufacturing the semiconductor component that uses batch processing steps for fabricating the packaging substrate. A heatsink is formed using an injection molding process. The heatsink has a front surface for mating with a semiconductor chip and a leadframe assembly. The heatsink also has a back surface from which a plurality of fins extend. The leadframe assembly includes a leadframe having leadframe leads extending from opposing sides of the leadframe to a central area of the leadframe. A liquid crystal polymer is disposed in a ring-shaped pattern on the leadframe leads. The liquid crystal polymer is partially cured. The leadframe assembly is mounted on the front surface of the heatsink and the liquid crystal polymer is further cured to form a packaging assembly, which is then singulated into packaging substrates.
    Type: Grant
    Filed: January 6, 2006
    Date of Patent: February 26, 2008
    Assignee: HVVI, Semiconductors, Inc.
    Inventor: Jeanne S. Pavio
  • Publication number: 20080017998
    Abstract: In various embodiments, semiconductor components and methods to manufacture semiconductor components are disclosed. In one embodiment, a semiconductor component includes a semiconductor die and multiple coplanar leads coupled to the semiconductor die, wherein the semiconductor die includes a power transistor and wherein the multiple leads are spaced apart from each other by a distance of about 0.1 millimeters (mm) or less. The semiconductor components further include a packaging material encapsulating the semiconductor die, wherein the packaging material is formed between the leads to electrically isolate the leads from each other. Other embodiments are described and claimed.
    Type: Application
    Filed: July 19, 2006
    Publication date: January 24, 2008
    Inventor: Jeanne S. Pavio
  • Publication number: 20040202900
    Abstract: A system and method for controlling or otherwise effectively managing cell voltage degradation in the operation of a fuel cell device comprises inter alia a fuel cell (110) in parallel electrical connection with a secondary power source (145) and an automated controller (155) for switching between power supplied from the fuel cell (100) and the secondary power source (145). Disclosed features and specifications may be variously adapted or optionally modified to control or otherwise optimize the rate of cell voltage degradation in any fuel cell system. Exemplary embodiments of the present invention may be readily integrated with other existing fuel cell technologies for the improvement of device package form factors, weights and other manufacturing and/or device performance metrics.
    Type: Application
    Filed: April 9, 2003
    Publication date: October 14, 2004
    Inventors: Jeanne S. Pavio, Joseph W. Bostaph, Chenggang Xie
  • Patent number: 6696195
    Abstract: A fuel cell device and method of forming the fuel cell device including a base portion, formed of a singular body, and having a major surface. At least one fuel cell membrane electrode assembly is formed on the major surface of the base portion and includes an electrically conductive hydrophilic material for the wicking of reaction water and providing for electrical conduction to a current collector. A fluid supply channel including a mixing chamber is defined in the base portion and communicating with the fuel cell membrane electrode assembly for supplying a fuel-bearing fluid to the membrane electrode assembly. An exhaust channel including a water recovery and recirculation channel is defined in the base portion and communicating with the membrane electrode assembly and the electrically conductive hydrophilic material. The membrane electrode assembly and the cooperating fluid supply channel and cooperating exhaust channel forming a single fuel cell assembly.
    Type: Grant
    Filed: August 9, 2001
    Date of Patent: February 24, 2004
    Assignee: Motorola, Inc.
    Inventors: Jeanne S. Pavio, Joseph W. Bostaph, Allison M. Fisher
  • Publication number: 20030031913
    Abstract: A fuel cell device and method of forming the fuel cell device including a base portion, formed of a singular body, and having a major surface. At least one fuel cell membrane electrode assembly is formed on the major surface of the base portion and includes an electrically conductive hydrophilic material for the wicking of reaction water and providing for electrical conduction to a current collector. A fluid supply channel including a mixing chamber is defined in the base portion and communicating with the fuel cell membrane electrode assembly for supplying a fuel-bearing fluid to the membrane electrode assembly. An exhaust channel including a water recovery and recirculation channel is defined in the base portion and communicating with the membrane electrode assembly and the electrically conductive hydrophilic material. The membrane electrode assembly and the cooperating fluid supply channel and cooperating exhaust channel forming a single fuel cell assembly.
    Type: Application
    Filed: August 9, 2001
    Publication date: February 13, 2003
    Applicant: Motorola, Inc.
    Inventors: Jeanne S. Pavio, Joseph W. Bostaph, Allison M. Fisher
  • Patent number: 5528076
    Abstract: A leadframe (10) formed by a method including providing a preform of silicon carbide, placing the preform in a mold, injecting a liquefied metal, such as aluminum, into the mold to fill the mold and infiltrate the preform, using heat and pressure. The mold defines a mounting area (12) in which the preform is positioned, and a plurality of leads (20, 22, 28, 29).
    Type: Grant
    Filed: February 1, 1995
    Date of Patent: June 18, 1996
    Assignee: Motorola, Inc.
    Inventor: Jeanne S. Pavio