Abstract: A method of etching a semiconductor substrate. The method includes the steps of applying a photoresist etch mask layer to a device surface of the substrate. A select first area of the photoresist etch mask is masked, imaged and developed. A select second area of the photoresist etch mask layer is irradiated to assist in post etch stripping of the etch mask layer from the select second area. The substrate is etched to form fluid supply slots through a thickness of the substrate. At least the select second area of the etch mask layer is removed from the substrate, whereby mask layer residue formed from the select second area of the etch mask layer is significantly reduced.

Abstract: Fluid ejection head assemblies, fluid ejection devices, and methods for improving fluid sealing of fluid ejection head assemblies. One such fluid ejection head assembly includes a substrate cavity and a substantially planar surface surrounding the substrate cavity. The substantially planar surface contains at least one external vent, at least one internal vent channel, and a plurality of vents in fluid flow communication with the substrate cavity and providing fluid flow communication between the internal vent channel and the external vent. The plurality of vents, the at least one external vent and the at least one internal vent channel are disposed in fluid flow communication with an environment external to the substrate cavity for flow of a gas associated with an adhesive at least partially disposed in the substrate cavity, to the environment during the curing of the adhesive.

Abstract: This invention addresses how an end user can create an electroluminescent device (1, 31) using basic components obtained by the end user as retail items. The layers or subassemblies (15, 17) are created first. Then the layers are assembled to form a completed device customized as selected by the end user. The subassemblies may be created layer-by-layer by thermal inkjet. Elements used typically will be made by manufacturers and sold commercially separately. This encompasses the printing of conductive patterns for electroluminescence on paper. In one aspect a display has a main body that may be permanent and useful indefinitely, while a part carrying the conductive pattern defining the display is readily removed and is replaced by another such part on which a new conductive pattern is printed. For tight contact with the main body, the display provides releasable pressure. Air pockets are minimized with a thin layer of highly viscous dielectric liquid.

Abstract: A progressive stencil printing system and method for applying encapsulant onto an inkjet printhead body is described. The system relates to a continuous stencil printing apparatus that can print encapsulant on different types of inkjet printhead bodies and clean the stencil during production.

Abstract: A method of etching a semiconductor substrate. The method includes the steps of applying a photoresist etch mask layer to a device surface of the substrate. A select first area of the photoresist etch mask is masked, imaged and developed. A select second area of the photoresist etch mask layer is irradiated to assist in post etch stripping of the etch mask layer from the select second area. The substrate is etched to form fluid supply slots through a thickness of the substrate. At least the select second area of the etch mask layer is removed from the substrate, whereby mask layer residue formed from the select second area of the etch mask layer is significantly reduced.

Abstract: A printing cartridge including a body, the body having a base and a tower defining a passageway. The tower is made from a first polymer material, and has a proximal end and a distal end. The proximal end is attached to the base. The distal end includes a surface. A frame, made of a second polymer material different from the first polymer material, is attached to the surface of the tower. A filter is attached to the frame and positioned to extend over the passageway.

Abstract: A stencil printed encapsulant material is provided for use in protecting electrical components in thermal ink jet printhead cartridges. A method of applying an encapsulant material to an ink jet print cartridge by stencil printing is also provided. The method includes providing a stencil having at least one aperture, providing an ink jet cartridge and stencil printing an encapsulant material onto a portion of the ink jet print cartridge thereby forming a layer of encapsulant material to protect electrical components or other printhead components.