Abstract: An exchanger for a pool, large storage tank, or pond is described herein. In one embodiment, the exchanger includes a diffuser hub, exchanger extension arms that extend radially outward from the diffuser hub, one or more exchanger rings that intersect with the heat exchanger extension arms, and a fill tube that extends to the diffuser hub. One or both of the heat exchanger arms and/or the exchanger rings include fluid apertures that direct fluid into the pool. Fluid pumped into the fill tube may flow through into the diffuser, through the exchanger extension arms and/or the one or more exchanger rings, and out through the fluid apertures at various locations into the pool. As such, heated fluid, or fluid to be mixed, for example, may be more evenly and quickly distributed into the pool.

Abstract: An electrode adjustment method and apparatus are disclosed for use in workpiece processing. The assembly may include an electrode assembly having first and second ends. First and second manipulators may be coupled to the first and second ends. The manipulators may be used to selectively impart movement to the first and second ends of the electrode assembly to adjust one or more properties of an ion beam passing through the electrodes. The first and second manipulators may be independently actuatable so that the first and second ends of the electrode can be adjusted independent of one another. Methods of using the disclosed apparatus are also disclosed.

Abstract: An electrode adjustment method and apparatus are disclosed for use in workpiece processing. The assembly may include an electrode assembly having first and second ends. First and second manipulators may be coupled to the first and second ends. The manipulators may be used to selectively impart movement to the first and second ends of the electrode assembly to adjust one or more properties of an ion beam passing through the electrodes. The first and second manipulators may be independently actuatable so that the first and second ends of the electrode can be adjusted independent of one another. Methods of using the disclosed apparatus are also disclosed.

Abstract: A slope compensation mechanism for automatically adapting an angle between a ski boot and a ski to a slope, including a tower mechanism having a tower base assembly mounted to the ski and a tower pivot mechanism rotatably and slidably mounted to the tower base assembly. A resilient pivot mechanism allows the tower pivot mechanism to rotate and to axially move with respect to the tower base assembly and a boot mounting beam engages with elevation angle catches corresponding to ranges of angles of a slope. A slope angle adaptation mechanism acting between the tower base assembly and the tower pivot mechanism determines a slope index angle corresponding to a slope being traversed and maintains the tower pivot mechanism at the slope index angle.

Abstract: A slope compensation mechanism for automatically adapting an angle between a ski boot and a ski to a slope, including a tower mechanism having a tower base assembly mounted to the ski and a tower pivot mechanism rotatably and slidably mounted to the tower base assembly. A resilient pivot mechanism allows the tower pivot mechanism to rotate and to axially move with respect to the tower base assembly and a boot mounting beam engages with elevation angle catches corresponding to ranges of angles of a slope. A slope angle adaptation mechanism acting between the tower base assembly and the tower pivot mechanism determines a slope index angle corresponding to a slope being traversed and maintains the tower pivot mechanism at the slope index angle.

Abstract: Embodiments of the invention generally provide a method for depositing films using photoexcitation. The photoexcitation may be utilized for at least one of treating the substrate prior to deposition, treating substrate and/or gases during deposition, treating a deposited film, or for enhancing chamber cleaning. In one embodiment, a method for depositing silicon and nitrogen-containing film on a substrate includes heating a substrate disposed in a processing chamber, generating a beam of energy of between about 1 to about 10 eV, transferring the energy to a surface of the substrate; flowing a nitrogen-containing chemical into the processing chamber, flowing a silicon-containing chemical with silicon-nitrogen bonds into the processing chamber, and depositing a silicon and nitrogen-containing film on the substrate.

Abstract: Embodiments of the invention generally provide a method for depositing films using photoexcitation. The photoexcitation may be utilized for at least one of treating the substrate prior to deposition, treating substrate and/or gases during deposition, treating a deposited film, or for enhancing chamber cleaning. In one embodiment, a method for depositing silicon and nitrogen-containing film on a substrate includes heating a substrate disposed in a processing chamber, generating a beam of energy of between about 1 to about 10 eV, transferring the energy to a surface of the substrate; flowing a nitrogen-containing chemical into the processing chamber, flowing a silicon-containing chemical with silicon-nitrogen bonds into the processing chamber, and depositing a silicon and nitrogen-containing film on the substrate.

Abstract: Embodiments of the invention generally provide a method for depositing films using photoexcitation. The photoexcitation may be utilized for at least one of treating the substrate prior to deposition, treating substrate and/or gases during deposition, treating a deposited film, or for enhancing chamber cleaning. In one embodiment, a method for depositing silicon and nitrogen-containing film on a substrate includes heating a substrate disposed in a processing chamber, generating a beam of energy of between about 1 to about 10 eV, transferring the energy to a surface of the substrate; flowing a nitrogen-containing chemical into the processing chamber, flowing a silicon-containing chemical with silicon-nitrogen bonds into the processing chamber, and depositing a silicon and nitrogen-containing film on the substrate.