Patents by Inventor Jeawon JEONG

Jeawon JEONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11974440
    Abstract: A memory device includes: a memory cell array including a plurality of memory cells; and a page buffer circuit provided in a page buffer region including a main region and a cache region provided in a first horizontal direction, and including a first page buffer unit and a second page buffer unit adjacent to each other in a second horizontal direction in the main region. A first sensing node of the first page buffer unit includes a first lower metal pattern, and a first upper metal pattern, and electrically connected to the first lower metal pattern. A second sensing node of the second page buffer unit includes a second lower metal pattern, and a second upper metal pattern, electrically connected to the second lower metal pattern, and not adjacent to the first upper metal pattern in the second horizontal direction.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: April 30, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yongsung Cho, Inho Kang, Ansoo Park, Jeunghwan Park, Dongha Shin, Jeawon Jeong
  • Publication number: 20240130131
    Abstract: A memory device may include word line patterns stacked on a substrate and spaced from each other in a vertical direction, a channel structure extending in the vertical direction, and first contact plugs and second contact plugs extending in the vertical direction. The substrate may include a cell area, a cell wiring area, and a through-hole wiring area. The word line patterns may be on the cell area and the cell wiring area and may extend to the cell wiring area in a direction parallel to an upper surface of the substrate. The first contact plugs may be on the cell wiring area and each may be electrically connected with a corresponding one of the word line patterns and insulated from remaining word line patterns other than the corresponding one of the word line patterns. The second contact plugs may be on the through-hole wiring area.
    Type: Application
    Filed: April 17, 2023
    Publication date: April 18, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jeawon JEONG, Dongha SHIN, Bongsoon LIM
  • Patent number: 11830805
    Abstract: A vertical memory device includes a plurality of word lines on a substrate, a plurality of word line cut regions extending parallel to each other, a memory cell array comprising a plurality of channel structures extending on the substrate through the plurality of word lines and arranged in a honeycomb structure, a plurality of contacts on the plurality of channel structures, and a plurality of bit lines connected to the plurality of channel structures through the plurality of contacts. The memory cell array comprises a first sub-array and a second sub-array, which are defined by the plurality of word line cut regions and are connected to some identical bit lines from among the plurality of bit lines, and a layout of contacts in the first sub-array from among the plurality of contacts is different from a layout of contacts in the second sub-array from among the plurality of contacts.
    Type: Grant
    Filed: March 25, 2021
    Date of Patent: November 28, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dongha Shin, Jeawon Jeong, Bongsoon Lim
  • Publication number: 20220045080
    Abstract: A memory device includes: a memory cell array including a plurality of memory cells; and a page buffer circuit provided in a page buffer region including a main region and a cache region provided in a first horizontal direction, and including a first page buffer unit and a second page buffer unit adjacent to each other in a second horizontal direction in the main region. A first sensing node of the first page buffer unit includes a first lower metal pattern, and a first upper metal pattern, and electrically connected to the first lower metal pattern. A second sensing node of the second page buffer unit includes a second lower metal pattern, and a second upper metal pattern, electrically connected to the second lower metal pattern, and not adjacent to the first upper metal pattern in the second horizontal direction.
    Type: Application
    Filed: March 31, 2021
    Publication date: February 10, 2022
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yongsung CHO, Inho KANG, Ansoo PARK, Jeunghwan PARK, Dongha SHIN, Jeawon JEONG
  • Publication number: 20210366825
    Abstract: A vertical memory device includes a plurality of word lines on a substrate, a plurality of word line cut regions extending parallel to each other, a memory cell array comprising a plurality of channel structures extending on the substrate through the plurality of word lines and arranged in a honeycomb structure, a plurality of contacts on the plurality of channel structures, and a plurality of bit lines connected to the plurality of channel structures through the plurality of contacts. The memory cell array comprises a first sub-array and a second sub-array, which are defined by the plurality of word line cut regions and are connected to some identical bit lines from among the plurality of bit lines, and a layout of contacts in the first sub-array from among the plurality of contacts is different from a layout of contacts in the second sub-array from among the plurality of contacts.
    Type: Application
    Filed: March 25, 2021
    Publication date: November 25, 2021
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Dongha SHIN, Jeawon JEONG, Bongsoon LIM