Patents by Inventor Jeb Wu
Jeb Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230352437Abstract: Embodiments relate to using nanoporous metal tips to establish connections between a first body and a second body. The first body is positioned relative to the second body to align contacts protruding from a first surface of the first body with electrodes protruding from a second surface of the second body. The second surface faces the first surface. The contacts, the electrodes, or both comprise nanoporous metal tips. A relative movement is made between the first body and the second body after positioning the first body to approach the first body to the second body. The contacts and the electrodes are bonded by melting and solidifying the nanoporous metal tips after approaching the first body and the second body.Type: ApplicationFiled: July 18, 2022Publication date: November 2, 2023Inventors: Daniel Brodoceanu, Zheng Sung Chio, Oscar Torrents Abad, Jeb Wu, Ali Sengül
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Patent number: 11735689Abstract: The invention is directed towards enhanced systems and methods for employing a pulsed photon (or EM energy) source, such as but not limited to a laser, to electrically couple, bond, and/or affix the electrical contacts of a semiconductor device to the electrical contacts of another semiconductor devices. Full or partial rows of LEDs are electrically coupled, bonded, and/or affixed to a backplane of a display device. The LEDs may be ?LEDs. The pulsed photon source is employed to irradiate the LEDs with scanning photon pulses. The EM radiation is absorbed by either the surfaces, bulk, substrate, the electrical contacts of the LED, and/or electrical contacts of the backplane to generate thermal energy that induces the bonding between the electrical contacts of the LEDs' electrical contacts and backplane's electrical contacts. The temporal and spatial profiles of the photon pulses, as well as a pulsing frequency and a scanning frequency of the photon source, are selected to control for adverse thermal effects.Type: GrantFiled: May 23, 2022Date of Patent: August 22, 2023Assignee: Meta Platforms Technologies, LLCInventors: Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio, Sharon Nannette Farrens, Ali Sengul, Tennyson Nguty
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Publication number: 20230253524Abstract: The invention is directed towards enhanced systems and methods for employing a pulsed photon (or EM energy) source, such as but not limited to a laser, to electrically couple, bond, and/or affix the electrical contacts of a semiconductor device to the electrical contacts of another semiconductor devices. Full or partial rows of LEDs are electrically coupled, bonded, and/or affixed to a backplane of a display device. The LEDs may be ?LEDs. The pulsed photon source is employed to irradiate the LEDs with scanning photon pulses. The EM radiation is absorbed by either the surfaces, bulk, substrate, the electrical contacts of the LED, and/or electrical contacts of the backplane to generate thermal energy that induces the bonding between the electrical contacts of the LEDs' electrical contacts and backplane's electrical contacts. The temporal and spatial profiles of the photon pulses, as well as a pulsing frequency and a scanning frequency of the photon source, are selected to control for adverse thermal effects.Type: ApplicationFiled: January 30, 2023Publication date: August 10, 2023Inventors: Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio, Sharon Nannette Farrens
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Patent number: 11575069Abstract: The invention is directed towards enhanced systems and methods for employing a pulsed photon (or EM energy) source, such as but not limited to a laser, to electrically couple, bond, and/or affix the electrical contacts of a semiconductor device to the electrical contacts of another semiconductor devices. Full or partial rows of LEDs are electrically coupled, bonded, and/or affixed to a backplane of a display device. The LEDs may be ?LEDs. The pulsed photon source is employed to irradiate the LEDs with scanning photon pulses. The EM radiation is absorbed by either the surfaces, bulk, substrate, the electrical contacts of the LED, and/or electrical contacts of the backplane to generate thermal energy that induces the bonding between the electrical contacts of the LEDs' electrical contacts and backplane's electrical contacts. The temporal and spatial profiles of the photon pulses, as well as a pulsing frequency and a scanning frequency of the photon source, are selected to control for adverse thermal effects.Type: GrantFiled: January 21, 2020Date of Patent: February 7, 2023Assignee: Meta Platforms Technologies, LLCInventors: Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio, Sharon Nanette Farrens, Ali Sengul
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Patent number: 11563142Abstract: The invention is directed towards enhanced systems and methods for employing a pulsed photon (or EM energy) source, such as but not limited to a laser, to electrically couple, bond, and/or affix the electrical contacts of a semiconductor device to the electrical contacts of another semiconductor devices. Full or partial rows of LEDs are electrically coupled, bonded, and/or affixed to a backplane of a display device. The LEDs may be ?LEDs. The pulsed photon source is employed to irradiate the LEDs with scanning photon pulses. The EM radiation is absorbed by either the surfaces, bulk, substrate, the electrical contacts of the LED, and/or electrical contacts of the backplane to generate thermal energy that induces the bonding between the electrical contacts of the LEDs' electrical contacts and backplane's electrical contacts. The temporal and spatial profiles of the photon pulses, as well as a pulsing frequency and a scanning frequency of the photon source, are selected to control for adverse thermal effects.Type: GrantFiled: January 21, 2020Date of Patent: January 24, 2023Assignee: Meta Platforms Technologies, LLCInventors: Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio, Ali Sengul
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Patent number: 11557692Abstract: The invention is directed towards enhanced systems and methods for employing a pulsed photon (or EM energy) source, such as but not limited to a laser, to electrically couple, bond, and/or affix the electrical contacts of a semiconductor device to the electrical contacts of another semiconductor devices. Full or partial rows of LEDs are electrically coupled, bonded, and/or affixed to a backplane of a display device. The LEDs may be ?LEDs. The pulsed photon source is employed to irradiate the LEDs with scanning photon pulses. The EM radiation is absorbed by either the surfaces, bulk, substrate, the electrical contacts of the LED, and/or electrical contacts of the backplane to generate thermal energy that induces the bonding between the electrical contacts of the LEDs' electrical contacts and backplane's electrical contacts. The temporal and spatial profiles of the photon pulses, as well as a pulsing frequency and a scanning frequency of the photon source, are selected to control for adverse thermal effects.Type: GrantFiled: January 21, 2020Date of Patent: January 17, 2023Assignee: Meta Platforms Technologies, LLCInventors: Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio, Sharon Nanette Farrens
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Publication number: 20220393060Abstract: The invention is directed towards enhanced systems and methods for employing a pulsed photon (or EM energy) source, such as but not limited to a laser, to electrically couple, bond, and/or affix the electrical contacts of a semiconductor device to the electrical contacts of another semiconductor devices. Full or partial rows of LEDs are electrically coupled, bonded, and/or affixed to a backplane of a display device. The LEDs may be ?LEDs. The pulsed photon source is employed to irradiate the LEDs with scanning photon pulses. The EM radiation is absorbed by either the surfaces, bulk, substrate, the electrical contacts of the LED, and/or electrical contacts of the backplane to generate thermal energy that induces the bonding between the electrical contacts of the LEDs' electrical contacts and backplane's electrical contacts. The temporal and spatial profiles of the photon pulses, as well as a pulsing frequency and a scanning frequency of the photon source, are selected to control for adverse thermal effects.Type: ApplicationFiled: June 24, 2022Publication date: December 8, 2022Inventors: Jeb Wu, Daniel Brodoceanu, Zheng Sung Chio, Tennyson Nguty, Oscar Torrents Abad, Ali Sengul
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Publication number: 20220352412Abstract: The invention is directed towards enhanced systems and methods for employing a pulsed photon (or EM energy) source, such as but not limited to a laser, to electrically couple, bond, and/or affix the electrical contacts of a semiconductor device to the electrical contacts of another semiconductor devices. Full or partial rows of LEDs are electrically coupled, bonded, and/or affixed to a backplane of a display device. The LEDs may be ?LEDs. The pulsed photon source is employed to irradiate the LEDs with scanning photon pulses. The EM radiation is absorbed by either the surfaces, bulk, substrate, the electrical contacts of the LED, and/or electrical contacts of the backplane to generate thermal energy that induces the bonding between the electrical contacts of the LEDs' electrical contacts and backplane's electrical contacts. The temporal and spatial profiles of the photon pulses, as well as a pulsing frequency and a scanning frequency of the photon source, are selected to control for adverse thermal effects.Type: ApplicationFiled: May 23, 2022Publication date: November 3, 2022Inventors: Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio, Sharon Nannette Farrens, Ali Sengul, Tennyson Nguty
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Patent number: 11424214Abstract: Embodiments relate to using nanoporous metal tips to establish connections between a first body and a second body. The first body is positioned relative to the second body to align contacts protruding from a first surface of the first body with electrodes protruding from a second surface of the second body. The second surface faces the first surface. The contacts, the electrodes, or both comprise nanoporous metal tips. A relative movement is made between the first body and the second body after positioning the first body to approach the first body to the second body. The contacts and the electrodes are bonded by melting and solidifying the nanoporous metal tips after approaching the first body and the second body.Type: GrantFiled: February 6, 2020Date of Patent: August 23, 2022Assignee: Meta Platforms Technologies, LLCInventors: Daniel Brodoceanu, Zheng Sung Chio, Oscar Torrents Abad, Jeb Wu, Ali Sengül
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Patent number: 11417792Abstract: A light emitting diode (LED) array is formed by bonding an LED substrate to a backplane substrate via fitted nanotube interconnects. The backplane substrate may include circuits for driving the LED array. The LED substrate may be a chip or wafer, and may include one or more LED devices. The LED substrate is positioned above the backplane substrate, such that a LED device of the LED substrate is aligned to a corresponding circuit in the backplane substrate. Each of the fitted interconnects electrically connect a LED device to the corresponding circuit of the backplane substrate.Type: GrantFiled: March 19, 2020Date of Patent: August 16, 2022Assignee: Meta Platforms Technologies, LLCInventors: Ali Sengül, Zheng Sung Chio, Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Tennyson Nguty
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Patent number: 11404600Abstract: The invention is directed towards enhanced systems and methods for employing a pulsed photon (or EM energy) source, such as but not limited to a laser, to electrically couple, bond, and/or affix the electrical contacts of a semiconductor device to the electrical contacts of another semiconductor devices. Full or partial rows of LEDs are electrically coupled, bonded, and/or affixed to a backplane of a display device. The LEDs may be ?LEDs. The pulsed photon source is employed to irradiate the LEDs with scanning photon pulses. The EM radiation is absorbed by either the surfaces, bulk, substrate, the electrical contacts of the LED, and/or electrical contacts of the backplane to generate thermal energy that induces the bonding between the electrical contacts of the LEDs' electrical contacts and backplane's electrical contacts. The temporal and spatial profiles of the photon pulses, as well as a pulsing frequency and a scanning frequency of the photon source, are selected to control for adverse thermal effects.Type: GrantFiled: January 21, 2020Date of Patent: August 2, 2022Assignee: Meta Platforms Technologies, LLCInventors: Jeb Wu, Daniel Brodoceanu, Zheng Sung Chio, Tennyson Nguty, Oscar Torrents Abad, Ali Sengul
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Patent number: 11391967Abstract: The disclosed transparent circuit board may include a transparent substrate, a first conductive trace coupled to the transparent substrate, and an electrical component having a bottom surface facing the transparent substrate and a top surface facing away from the transparent substrate. The bottom surface may include a first electrical contact coupled to the first conductive trace, and the top surface may include a second electrical contact. The transparent circuit board may also include a second conductive trace electrically connected to the second electrical contact and a transparent encapsulation layer coupled to the transparent substrate and encapsulating the electrical component. Various other ophthalmic devices, systems, and methods are also disclosed.Type: GrantFiled: May 8, 2019Date of Patent: July 19, 2022Assignee: Facebook Technologies, LLCInventors: Karol Constantine Hatzilias, Jeb Wu, Paul Armen Tchertchian, Robin Sharma, Christopher Yuan Ting Liao
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Patent number: 11374148Abstract: The invention is directed towards enhanced systems and methods for employing a pulsed photon (or EM energy) source, such as but not limited to a laser, to electrically couple, bond, and/or affix the electrical contacts of a semiconductor device to the electrical contacts of another semiconductor devices. Full or partial rows of LEDs are electrically coupled, bonded, and/or affixed to a backplane of a display device. The LEDs may be ?LEDs. The pulsed photon source is employed to irradiate the LEDs with scanning photon pulses. The EM radiation is absorbed by either the surfaces, bulk, substrate, the electrical contacts of the LED, and/or electrical contacts of the backplane to generate thermal energy that induces the bonding between the electrical contacts of the LEDs' electrical contacts and backplane's electrical contacts. The temporal and spatial profiles of the photon pulses, as well as a pulsing frequency and a scanning frequency of the photon source, are selected to control for adverse thermal effects.Type: GrantFiled: January 21, 2020Date of Patent: June 28, 2022Assignee: Facebook Technologies, LLCInventors: Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio, Sharon Nanette Farrens, Ali Sengul, Tennyson Nguty
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Patent number: 11349053Abstract: Embodiments relate to the design of an electronic device capable having flexible interconnects that connect together a first body and a second body of the electronic device. The flexible interconnects allow the electrical device to better withstand thermal-mechanical stress during fabrication of the electronic device and user usage of the electronic device.Type: GrantFiled: January 14, 2020Date of Patent: May 31, 2022Assignee: Facebook Technologies, LLCInventors: Zheng Sung Chio, Daniel Brodoceanu, Ali Sengül, Oscar Torrents Abad, Jeb Wu, Pooya Saketi, Chao Kai Tung, Tennyson Nguty, Allan Pourchet
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Patent number: 11296268Abstract: A light emitting diode (LED) array is formed by bonding an LED substrate to a backplane substrate via magnetized interconnects. The backplane substrate may include circuits for driving the LED array, and each of the magnetized interconnects electrically connect a LED device to a corresponding circuit of the backplane substrate. The magnetized interconnects may be formed by electrically connecting first structures protruding from the backplane substrate to second structures protruding from the LED substrate. At least one of the first structure and the second structure includes ferromagnetic material configured to secure the first structure to the second structure.Type: GrantFiled: March 20, 2020Date of Patent: April 5, 2022Assignee: Facebook Technologies, LLCInventors: Ali Sengül, Oscar Torrents Abad, Daniel Brodoceanu, Zheng Sung Chio, Jeb Wu, Chao Kai Tung, Tennyson Nquty, Allan Pourchet
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Patent number: 11276672Abstract: A light emitting diode (LED) chip is bonded to a substrate. The LED chip includes one or more dummy electrodes that corresponds to one or more contacts on the substrate. The one or more dummy electrodes are exposed to a laser beam for coupling the one or more dummy electrodes to the one or more contacts. The one or more dummy electrodes may be positioned along edges of the LED chip that surround a display area of the LED chip and provide bonding strength between the LED chip and the substrate.Type: GrantFiled: October 8, 2019Date of Patent: March 15, 2022Assignee: Facebook Technologies, LLCInventors: Jeb Wu, Oscar Torrents Abad, Daniel Brodoceanu, Pooya Saketi, Zheng Sung Chio, Ali Sengül
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Patent number: 11255529Abstract: A light emitting diode (LED) chip is bonded to a substrate. The LED chip includes a plurality of electrodes that each corresponds to a contact on the substrate. The plurality of electrodes are exposed to one or more laser beams for coupling the LED chip to the substrate. The laser beams may be directed to one or more edges or corners of the plurality of electrodes, where the edges or corners lie outside emission areas of LEDs on the LED chip.Type: GrantFiled: October 29, 2019Date of Patent: February 22, 2022Assignee: Facebook Technologies, LLCInventors: Jeb Wu, Oscar Torrents Abad, Daniel Brodoceanu, Pooya Saketi, Zheng Sung Chio, Ali Sengül
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Patent number: 11239400Abstract: A light-emitting diode (LED) array is formed by bonding an LED chip or wafer to a backplane substrate via curved interconnects. The backplane substrate may include circuits for driving the LED's. One or more curved interconnects are formed on the backplane substrate. A curved interconnect may be electrically connected to a corresponding circuit of the backplane substrate, and may include at least a portion with curvature. The LED chip or wafer may include one or more LED devices. Each LED device may have one or more electrical contacts. The LED chip or wafer is positioned above the backplane substrate to spatially align electrical contacts of the LED devices with the curved interconnects on the backplane substrate. The electrical contacts are bonded to the curved interconnects to electrically connect the LED devices to corresponding circuits of the backplane substrate.Type: GrantFiled: January 8, 2020Date of Patent: February 1, 2022Assignee: Facebook Technologies, LLCInventors: Zheng Sung Chio, Daniel Brodoceanu, Oscar Torrents Abad, Ali Sengül, Pooya Saketi, Jeb Wu, Chao Kai Tung, Remi Alain Delille, Tennyson Nguty, Allan Pourchet
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Publication number: 20200395519Abstract: The invention is directed towards enhanced systems and methods for employing a pulsed photon (or EM energy) source, such as but not limited to a laser, to electrically couple, bond, and/or affix the electrical contacts of a semiconductor device to the electrical contacts of another semiconductor devices. Full or partial rows of LEDs are electrically coupled, bonded, and/or affixed to a backplane of a display device. The LEDs may be ?LEDs. The pulsed photon source is employed to irradiate the LEDs with scanning photon pulses. The EM radiation is absorbed by either the surfaces, bulk, substrate, the electrical contacts of the LED, and/or electrical contacts of the backplane to generate thermal energy that induces the bonding between the electrical contacts of the LEDs' electrical contacts and backplane's electrical contacts. The temporal and spatial profiles of the photon pulses, as well as a pulsing frequency and a scanning frequency of the photon source, are selected to control for adverse thermal effects.Type: ApplicationFiled: January 21, 2020Publication date: December 17, 2020Inventors: Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio, Ali Sengul
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Publication number: 20200395521Abstract: The invention is directed towards enhanced systems and methods for employing a pulsed photon (or EM energy) source, such as but not limited to a laser, to electrically couple, bond, and/or affix the electrical contacts of a semiconductor device to the electrical contacts of another semiconductor devices. Full or partial rows of LEDs are electrically coupled, bonded, and/or affixed to a backplane of a display device. The LEDs may be ?LEDs. The pulsed photon source is employed to irradiate the LEDs with scanning photon pulses. The EM radiation is absorbed by either the surfaces, bulk, substrate, the electrical contacts of the LED, and/or electrical contacts of the backplane to generate thermal energy that induces the bonding between the electrical contacts of the LEDs' electrical contacts and backplane's electrical contacts. The temporal and spatial profiles of the photon pulses, as well as a pulsing frequency and a scanning frequency of the photon source, are selected to control for adverse thermal effects.Type: ApplicationFiled: January 21, 2020Publication date: December 17, 2020Inventors: Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio, Shari Farrens