Patents by Inventor Jed H. Rankin, Jr.

Jed H. Rankin, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Forming an extremely thin semiconductor-on-insulator (ETSOI) layer
    Patent number: 8110483
    Abstract: Solutions for forming an extremely thin semiconductor-on-insulator (ETSOI) layer are disclosed. In one embodiment, a method includes providing a wafer including a plurality of semiconductor-on-insulator (SOI) layer regions separated by at least one shallow trench isolation (STI); amorphizing the plurality of SOI layer regions by implanting the plurality of SOI layer regions with an implant species; and removing a portion of the amorphized SOI layer region to form at least one recess in the amorphized SOI layer region.
    Type: Grant
    Filed: October 22, 2009
    Date of Patent: February 7, 2012
    Assignee: International Business Machines Corporation
    Inventors: Wagdi W. Abadeer, Lilian Kamal, legal representative, Kiran V. Chatty, Jason E. Cummings, Toshiharu Furukawa, Robert J. Gauthier, Jed H. Rankin, Jr., Robert R. Robison, William R. Tonti