Abstract: A test fixture for use with an improved multi-chip-module wherein the multi-chip-module has a plurality of chips on the top surface, the module having at least one net associated with the chips completely embedded within the substrate and wherein at least one pad is attached to the bottom surface of the substrate and a conductive path provided between the pad and the net. The test fixture includes a zero-insertion-force socket having at least one socket pin having a surface for conductively contacting the pad on the multi-chip-module and extending through the socket and a circuit board having a plurality of inlets for conductively receiving the socket pins including the socket pin contacting the pad.

Abstract: An improved multi-chip-module having a substrate having top and bottom surfaces, a plurality of chips on the top surface, a plurality of pins on the bottom surface, each chip having at least one lead extending through the substrate and conductively coupled to a corresponding pin, the module having at least one net associated with the chips and completely embedded within the substrate, the improvement comprising at least one pad attached to the bottom surface of the substrate, and a conductive path conductively coupled between the pad and the net.