Patents by Inventor Jee Tung Tan

Jee Tung Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hybrid sensor shift platform
    Patent number: 11581351
    Abstract: A hybrid sensor shift platform for an optical image stabilization (OIS) actuator mechanism in compact camera modules includes two or more substrates. A top substrate is composed of an organic material (e.g., a resin) to reduce mass, reduce magnetic interaction with permanent magnets, and improve reliability. One or more lower substrates of the hybrid sensor shift platform are ceramic substrates that provide the benefits of ceramics for connection to the image sensor. The organic substrate is connected via a solder bond process to the lower ceramic substrate(s). The connection between the substrates is reinforced with an under-fill of epoxy that surrounds the solder bonds, thus creating a full interface between the substrates within the overlap.
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: February 14, 2023
    Assignee: Apple Inc.
    Inventors: Aurelien R. Hubert, Jee Tung Tan, Steven Webster, Douglas S. Brodie, Qiang Yang, Masahito Morita
  • Hybrid Sensor Shift Platform
    Publication number: 20210028216
    Abstract: A hybrid sensor shift platform for an optical image stabilization (OIS) actuator mechanism in compact camera modules includes two or more substrates. A top substrate is composed of an organic material (e.g., a resin) to reduce mass, reduce magnetic interaction with permanent magnets, and improve reliability. One or more lower substrates of the hybrid sensor shift platform are ceramic substrates that provide the benefits of ceramics for connection to the image sensor. The organic substrate is connected via a solder bond process to the lower ceramic substrate(s). The connection between the substrates is reinforced with an under-fill of epoxy that surrounds the solder bonds, thus creating a full interface between the substrates within the overlap.
    Type: Application
    Filed: July 21, 2020
    Publication date: January 28, 2021
    Applicant: Apple Inc.
    Inventors: Aurelien R. Hubert, Jee Tung Tan, Steven Webster, Douglas S. Brodie, Qiang Yang, Masahito Morita