Patents by Inventor Jee-Hang Lee

Jee-Hang Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and Method for 3D Packet Scale Down with Proxy Server in Mobile Environment
    Publication number: 20100045668
    Abstract: A mobile network capable of 3-Dimensional (3D) packet scale down includes a server, mobile station and proxy server. The proxy server includes an apparatus and method for 3-Dimensional (3D) packet scale down. The method includes receiving a 3D packet from a main server, generating a set of unit figures constituting a 3D image using a parameter of the received 3D packet, and increasing a size of a partial unit figure in the generated set of the unit figures, and generating a set of the same size as the generated set of the unit figures, by figures of less number than the generated set of the unit figures.
    Type: Application
    Filed: August 18, 2009
    Publication date: February 25, 2010
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jee-Hang Lee, Dong-Jun Kum, Soon-Hwan Kwon, Seung-Jae Han, Dong-Jin Sohn