Patents by Inventor Jeerasak Potham

Jeerasak Potham has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8066171
    Abstract: An apparatus for bonding a conductive lead to a conductive terminal of a device by the use of a conductive metal ball is disclosed. A ball-forming wire comprises a first conductive metal having a first melting temperature. A clamping surface has a closed position in contact with the ball-forming wire. A wire-clamping actuator is coupled to the clamping surface and is electrically connected to a clamping signal source. A sparking pin comprises a second conductive metal having a second melting temperature higher than the first melting temperature. The sparking pin is electrically connected to a power source. A current detection transformer includes a magnetic core at least partially encircling the ball-forming wire. An analyzing circuit is electrically connected to the current detection transformer.
    Type: Grant
    Filed: January 24, 2011
    Date of Patent: November 29, 2011
    Assignee: Western Digital Technologies, Inc.
    Inventors: Pornchai Rakpongsiri, Jeerasak Potham
  • Patent number: 7896218
    Abstract: An apparatus for bonding a conductive lead to a conductive terminal of a device by the use of a conductive metal ball is disclosed and claimed. A ball-forming wire comprises a first conductive metal having a first melting temperature. A clamping surface has a closed position in contact with the ball-forming wire. A wire-clamping actuator is coupled to the clamping surface and is electrically connected to a clamping signal source. A sparking pin comprises a second conductive metal having a second melting temperature higher than the first melting temperature. The sparking pin is electrically connected to a power source. A current detection transformer includes a magnetic core at least partially encircling the ball-forming wire. An analyzing circuit is electrically connected to the current detection transformer.
    Type: Grant
    Filed: June 28, 2007
    Date of Patent: March 1, 2011
    Assignee: Western Digital Technologies, Inc.
    Inventors: Pornchai Rakpongsiri, Jeerasak Potham
  • Publication number: 20090001064
    Abstract: An apparatus for bonding a conductive lead to a conductive terminal of a device by the use of a conductive metal ball is disclosed and claimed. A ball-forming wire comprises a first conductive metal having a first melting temperature. A clamping surface has a closed position in contact with the ball-forming wire. A wire-clamping actuator is coupled to the clamping surface and is electrically connected to a clamping signal source. A sparking pin comprises a second conductive metal having a second melting temperature higher than the first melting temperature. The sparking pin is electrically connected to a power source. A current detection transformer includes a magnetic core at least partially encircling the ball-forming wire. An analyzing circuit is electrically connected to the current detection transformer.
    Type: Application
    Filed: June 28, 2007
    Publication date: January 1, 2009
    Inventors: PORNCHAI RAKPONGSIRI, JEERASAK POTHAM