Abstract: An integrated connector-antenna assembly is provided, wherein an antenna is monolithically integrated with a radio frequency (RF) connector housing. The connector-antenna assembly may also include the RF signal element, wherein the connector center pin is monolithically integrated to the connector housing. Although part of the connector-antenna assembly, the connector housing and connector signal element still serve the connector function, which is essentially a channel for RF signal from the RF signal source to the antenna.

Abstract: An integrated connector-antenna assembly is provided, wherein an antenna is monolithically integrated with a radio frequency (RF) connector housing. The connector-antenna assembly may also include the RF signal element, wherein the connector center pin is monolithically integrated to the connector housing. Although part of the connector-antenna assembly, the connector housing and connector signal element still serve the connector function, which is essentially a channel for RF signal from the RF signal source to the antenna.

Abstract: A transparent wireless bridge for providing access to an optical fiber network comprises a first transceiver outside a building and configured to transmit/receive communication signals to and from the optical fiber network. A first glass sheet attached to an outer side of a window comprises a first antenna communicatively coupled to the first transceiver and configured to transmit and receive communication signals to and from the first transceiver. A second glass sheet is attached to an inner side of the window and comprises a second antenna configured to wirelessly transmit and receive communication signals to and from the first antenna. The wireless bridge also includes a second transceiver located inside the building that is communicatively coupled to the second antenna and configured to wirelessly transmit and receive data to and from the second antenna. The wireless bridge may also be used in conjunction with a wireless drop system.

Abstract: A transparent wireless bridge for providing access to an optical fiber network comprises a first transceiver outside a building and configured to transmit/receive communication signals to and from the optical fiber network. A first glass sheet attached to an outer side of a window comprises a first antenna communicatively coupled to the first transceiver and configured to transmit and receive communication signals to and from the first transceiver. A second glass sheet is attached to an inner side of the window and comprises a second antenna configured to wirelessly transmit and receive communication signals to and from the first antenna. The wireless bridge also includes a second transceiver located inside the building that is communicatively coupled to the second antenna and configured to wirelessly transmit and receive data to and from the second antenna. The wireless bridge may also be used in conjunction with a wireless drop system.

Abstract: A transparent wireless bridge for providing access to an optical fiber network comprises a first transceiver outside a building and configured to transmit/receive communication signals to and from the optical fiber network. A first glass sheet attached to an outer side of a window comprises a first antenna communicatively coupled to the first transceiver and configured to transmit and receive communication signals to and from the first transceiver. A second glass sheet is attached to an inner side of the window and comprises a second antenna configured to wirelessly transmit and receive communication signals to and from the first antenna. The wireless bridge also includes a second transceiver located inside the building that is communicatively coupled to the second antenna and configured to wirelessly transmit and receive data to and from the second antenna. The wireless bridge may also be used in conjunction with a wireless drop system.

Abstract: A variable impedance interface device connecting a coaxial connector to an external component with a housing having a first end adapted to receive a coaxial connector and a second end having an interface where the housing is attachable to an external component, such as a printed circuit board. A cavity within the housing is defined by an inner surface and has a cavity first end and a cavity second end. The inner surface tapers between the cavity first end and the cavity second end. A mating position in the cavity has a certain dimension due to the taper of the inner surface, and defines a location at which a coaxial connector received by the housing positions. An impedance of the housing is based on the mating position and may be varied due to the impedance of the interface such that signal degradation at the interface is reduced.

Abstract: Controlled-impedance out-of-substrate package structures employing electrical devices and related assemblies, components, and methods are disclosed. An out-of-substrate package structure may be used to electrically couple an electrical device to an electrical substrate, for example a printed circuit board. The out-of-substrate package structure may be electrically coupled to the electrical substrate. Ground paths of the out-of-substrate package structure may be arranged proximate to the electrical device and arranged symmetric with respect to at least one geometric plane intersecting the electrical device. In this regard, electric field lines generated by current flowing into the electrical device tend to terminate at the return or ground paths allowing for impedance to be more easily controlled. Accordingly, the out-of-substrate package structure may be impedance matched in a better way with respect to power provided from the electrical substrate enabling faster electrical device speeds.

Abstract: A modular antenna assembly for a wireless communication system. The assembly includes an housing, an antenna substrate, a connection block, and an interconnect. The antenna substrate has an antenna formed thereon and is mounted in the housing. The connection block is attached to the antenna substrate. The interconnect has a first end and a second end, is electrically connected to the antenna through the connection block at the first end, and is configured to releasably attach the antenna substrate to another component of the wireless system. The antenna electrically connects to the another component through the interconnect at the second end. The another component is attached to a structure.

Abstract: A variable impedance interface device for connecting a coaxial connector to an external component is disclosed. The interface device has a housing having a first end adapted to receive a coaxial connector and a second end having an interface where the housing is attachable to an external component, such as a printed circuit board. A cavity within the housing is defined by an inner surface and has a cavity first end and a cavity second end. The inner surface tapers between the cavity first end and the cavity second end. A mating position in the cavity has a certain dimension due to the taper of the inner surface. The mating position defines a location at which a coaxial connector received by the housing positions. An impedance of the housing is based on the mating position and may be varied due to the impedance of the interface such that signal degradation at the interface is reduced.

Abstract: A variable impedance interface device connecting a coaxial connector to an external component with a housing having a first end adapted to receive a coaxial connector and a second end having an interface where the housing is attachable to an external component, such as a printed circuit board. A cavity within the housing is defined by an inner surface and has a cavity first end and a cavity second end. The inner surface tapers between the cavity first end and the cavity second end. A mating position in the cavity has a certain dimension due to the taper of the inner surface, and defines a location at which a coaxial connector received by the housing positions. An impedance of the housing is based on the mating position and may be varied due to the impedance of the interface such that signal degradation at the interface is reduced.

Abstract: A chipless RFID tag system having a transmitter sending an input signal and a tag substrate. An ID generation circuit on the tag relies on microstrip transmission line patterns which are pre-designed to generate a unique code. The ID generating circuit may be designed based upon the transmission line properties, including signal delay, and/or reflection, and/or phase change. The tag may be formed on a flexible substrate having at least one microstrip and the microstrip having a first portion with a first impedance and a second portion with a second impedance different from the first impedance. The tag may further include a microstrip antenna for communication with the transmitter and a receiver system. The tag may also include sensors for detection of desired substances of interest. The system may further include a receiver detecting at least two reflections from an interface of first and second impedances and identifying relative time domain positions of the reflections to one another.

Abstract: A variable impedance interface device for connecting a coaxial connector to an external component is disclosed. The interface device has a housing having a first end adapted to receive a coaxial connector and a second end having an interface where the housing is attachable to an external component, such as a printed circuit board. A cavity within the housing is defined by an inner surface and has a cavity first end and a cavity second end. The inner surface tapers between the cavity first end and the cavity second end. A mating position in the cavity has a certain dimension due to the taper of the inner surface. The mating position defines a location at which a coaxial connector received by the housing positions. An impedance of the housing is based on the mating position and may be varied due to the impedance of the interface such that signal degradation at the interface is reduced.

Abstract: Controlled-impedance out-of-substrate package structures employing electrical devices and related assemblies, components, and methods are disclosed. An out-of-substrate package structure may be used to electrically couple an electrical device to an electrical substrate, for example a printed circuit board. The out-of-substrate package structure may be electrically coupled to the electrical substrate. Ground paths of the out-of-substrate package structure may be arranged proximate to the electrical device and arranged symmetric with respect to at least one geometric plane intersecting the electrical device. In this regard, electric field lines generated by current flowing into the electrical device tend to terminate at the return or ground paths allowing for impedance to be more easily controlled. Accordingly, the out-of-substrate package structure may be impedance matched in a better way with respect to power provided from the electrical substrate enabling faster electrical device speeds.

Abstract: Discontinuous loop antennas and related components, radio-frequency identification (RFID), tags, systems, and methods are disclosed. A discontinuous loop antenna is an antenna loop structure that includes a discontinuity portion. The discontinuous loop antenna can be coupled to an RFID chip to provide an RFID tag. The discontinuity portion decreases the loop inductance and tag capacitance, thus enabling the discontinuous loop antenna to have significantly larger loop area while still matching the chip impedance, resulting in dramatic increases in near-field sensitivity. Increased near-field sensitivity provides increased power harvesting efficiency during near-field coupling. As one non-limiting example, an RFID tag having a discontinuous loop antenna may achieve significantly more power harvesting from a RF signal than an RFID tag having a continuous loop antenna tuned to the same or similar resonant frequency.

Abstract: Discontinuous loop antennas and related components, radio-frequency identification (RFID), tags, systems, and methods are disclosed. A discontinuous loop antenna is an antenna loop structure that includes a discontinuity portion. The discontinuous loop antenna can be coupled to an RFID chip to provide an RFID tag. The discontinuity portion decreases the loop inductance and tag capacitance, thus enabling the discontinuous loop antenna to have significantly larger loop area while still matching the chip impedance, resulting in dramatic increases in near-field sensitivity. Increased near-field sensitivity provides increased power harvesting efficiency during near-field coupling. As one non-limiting example, an RFID tag having a discontinuous loop antenna may achieve significantly more power harvesting from a RF signal than an RFID tag having a continuous loop antenna tuned to the same or similar resonant frequency.

Abstract: A chipless RFID tag system having a transmitter sending an input signal and a tag substrate. The tag substrate has at least one microstrip and the microstrip has a first portion with a first impedance and a second portion with a second impedance different from the first impedance. The system further includes a receiver detecting at least two reflections from an interface of the first and second impedances and identifying relative time domain positions of the reflections to one another.