Patents by Inventor Jeevan M. Prasannakumar

Jeevan M. Prasannakumar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11278717
    Abstract: A temporary medical electrical lead includes a connector pin and a single conductor coil. The coil being close-wound and having no turns of the coil distal portion being mechanically coupled together. The coil distal portion translates a force of no greater than 0.1 lbf (0.4 N) when strained 400%.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: March 22, 2022
    Assignee: Medtronic, Inc.
    Inventors: Thomas J. Steigauf, Eric H. Bonde, Phillip C. Falkner, Jeevan M. Prasannakumar, Brian T. Stolz, John Shishilla, Adam J. Rivard, Robert Sandgren, Seth Humphrys, Bernard Li
  • Publication number: 20190060636
    Abstract: A temporary medical electrical lead includes a connector pin and a single conductor coil. The coil being close-wound and having no turns of the coil distal portion being mechanically coupled together. The coil distal portion translates a force of no greater than 0.1 lbf (0.4 N) when strained 400%.
    Type: Application
    Filed: August 28, 2018
    Publication date: February 28, 2019
    Inventors: Thomas J. Steigauf, Eric H. Bonde, Phillip C. Falkner, Jeevan M. Prasannakumar, Brian T. Stolz, John Shishilla, Adam J. Rivard, Robert Sandgren, Seth Humphrys, Bernard Li
  • Patent number: 9345185
    Abstract: Techniques for forming a header for an implantable medical device via a two-shot molding process are described. The two-shot molding processes may include a first molding step that creates a first-shot assembly and a second molding step that creates a second-shot assembly. The first-shot assembly may be formed to include one or more protrusions configured to interact with a second-shot mold and/or molding material in the second molding step. The second molding step may be configured to overmold the first-shot assembly. The header may include an attachment plate at least partially embedded in molding material and configured to be mechanically coupled to a body of the implantable medical device.
    Type: Grant
    Filed: November 14, 2012
    Date of Patent: May 17, 2016
    Assignee: Medtronic, Inc.
    Inventors: Jeevan M. Prasannakumar, Christopher M. Haenisch, David Bates, John C. Olson, George Patras, Yanzhu Zhao, Jason P. Weiand
  • Patent number: 9079014
    Abstract: A contact component of an implantable medical device connector module assembly includes a threaded bore in fluid communication with a connector bore thereof, and a flanged bore in fluid communication with the threaded bore. A perimeter surface of the flanged bore creates a shutoff with a pin during injection molding to form an insulative body of the assembly, and a perimeter surface of an insulative bore formed around the pin is preferably flush with that of the flanged bore of the contact component. A centerline axis of the flanged bore is preferably aligned with that of the threaded bore, for example, so that the molded insulative bore has a centerline axis aligned with that of the threaded bore of the contact component.
    Type: Grant
    Filed: January 13, 2014
    Date of Patent: July 14, 2015
    Assignee: Medtronic, Inc.
    Inventors: Andrew J. Ries, Jeevan M. Prasannakumar, Richard P. Nelson
  • Patent number: 8989872
    Abstract: Techniques for forming a header for an implantable medical device via a two-shot molding process are described. The two-shot molding processes may include a first molding step that creates a first-shot assembly and a second molding step that creates a second-shot assembly. The first-shot assembly may be formed to include one or more protrusions configured to interact with a second-shot mold and/or molding material in the second molding step. The second molding step may be configured to overmold the first-shot assembly. The header may include an attachment plate at least partially embedded in molding material and configured to be mechanically coupled to a body of the implantable medical device.
    Type: Grant
    Filed: November 14, 2012
    Date of Patent: March 24, 2015
    Assignee: Medtronic, Inc.
    Inventors: Jeevan M. Prasannakumar, Christopher M. Haenisch, David Bates, John C. Olson, George Patras, Yanzhu Zhao, Jason P. Weiand
  • Patent number: 8945451
    Abstract: Methods for forming an insulative body of an implantable medical device connector module assembly employ an injection molding process, whereby first and second shots of insulative material form core and an overlay portions, respectively. In some methods, a panel portion of an electrical component is mounted between opposing surfaces of a mold such that a finger-like portion of the component extends into a cavity of the mold, with a first side thereof touching another surface of the mold and a second, opposite side exposed within the cavity; following first shot injection, the core portion captures the finger-like portion in relatively rigid relation thereto. When two types of connector bores are formed, a color indicator may be engaged with a feature of the core portion that is located in proximity to a connector bore of the first type, and then the overlay portion is formed over the indicator.
    Type: Grant
    Filed: May 17, 2012
    Date of Patent: February 3, 2015
    Assignee: Medtronic, Inc.
    Inventors: Andrew J. Ries, Jeevan M. Prasannakumar, Richard P. Nelson
  • Publication number: 20140133123
    Abstract: Techniques for forming a header for an implantable medical device via a two-shot molding process are described. The two-shot molding processes may include a first molding step that creates a first-shot assembly and a second molding step that creates a second-shot assembly. The first-shot assembly may be formed to include one or more protrusions configured to interact with a second-shot mold and/or molding material in the second molding step. The second molding step may be configured to overmold the first-shot assembly. The header may include an attachment plate at least partially embedded in molding material and configured to be mechanically coupled to a body of the implantable medical device.
    Type: Application
    Filed: November 14, 2012
    Publication date: May 15, 2014
    Applicant: MEDTRONIC, INC.
    Inventors: Jeevan M. Prasannakumar, Christopher M. Haenisch, David Bates, John C. Olson, George Patras, Yanzhu Zhao, Jason P. Weiand
  • Publication number: 20140135882
    Abstract: Techniques for forming a header for an implantable medical device via a two-shot molding process are described. The two-shot molding processes may include a first molding step that creates a first-shot assembly and a second molding step that creates a second-shot assembly. The first-shot assembly may be formed to include one or more protrusions configured to interact with a second-shot mold and/or molding material in the second molding step. The second molding step may be configured to overmold the first-shot assembly. The header may include an attachment plate at least partially embedded in molding material and configured to be mechanically coupled to a body of the implantable medical device.
    Type: Application
    Filed: November 14, 2012
    Publication date: May 15, 2014
    Applicant: MEDTRONIC, INC.
    Inventors: Jeevan M. Prasannakumar, Christopher M. Haenisch, David Bates, John C. Olson, George Patras, Yanzhu Zhao, Jason P. Weiand
  • Publication number: 20140123490
    Abstract: A contact component of an implantable medical device connector module assembly includes a threaded bore in fluid communication with a connector bore thereof, and a flanged bore in fluid communication with the threaded bore. A perimeter surface of the flanged bore creates a shutoff with a pin during injection molding to form an insulative body of the assembly, and a perimeter surface of an insulative bore formed around the pin is preferably flush with that of the flanged bore of the contact component. A centerline axis of the flanged bore is preferably aligned with that of the threaded bore, for example, so that the molded insulative bore has a centerline axis aligned with that of the threaded bore of the contact component.
    Type: Application
    Filed: January 13, 2014
    Publication date: May 8, 2014
    Inventors: Andrew J. Ries, Jeevan M. Prasannakumar, Richard P. Nelson
  • Patent number: 8628348
    Abstract: A contact component of an implantable medical device connector module assembly includes a threaded bore in fluid communication with a connector bore thereof, and a flanged bore in fluid communication with the threaded bore. A perimeter surface of the flanged bore creates a shutoff with a pin during injection molding to form an insulative body of the assembly, and a perimeter surface of an insulative bore formed around the pin is preferably flush with that of the flanged bore of the contact component. A centerline axis of the flanged bore is preferably aligned with that of the threaded bore, for example, so that the molded insulative bore has a centerline axis aligned with that of the threaded bore of the contact component.
    Type: Grant
    Filed: May 17, 2012
    Date of Patent: January 14, 2014
    Assignee: Medtronic, Inc.
    Inventors: Andrew J. Ries, Jeevan M. Prasannakumar, Richard P. Nelson
  • Publication number: 20130307184
    Abstract: Methods for forming an insulative body of an implantable medical device connector module assembly employ an injection molding process, whereby first and second shots of insulative material form core and an overlay portions, respectively. In some methods, a panel portion of an electrical component is mounted between opposing surfaces of a mold such that a finger-like portion of the component extends into a cavity of the mold, with a first side thereof touching another surface of the mold and a second, opposite side exposed within the cavity; following first shot injection, the core portion captures the finger-like portion in relatively rigid relation thereto. When two types of connector bores are formed, a color indicator may be engaged with a feature of the core portion that is located in proximity to a connector bore of the first type, and then the overlay portion is formed over the indicator.
    Type: Application
    Filed: May 17, 2012
    Publication date: November 21, 2013
    Inventors: Andrew J. Ries, Jeevan M. Prasannakumar, Richard P. Nelson
  • Publication number: 20130309889
    Abstract: A contact component of an implantable medical device connector module assembly includes a threaded bore in fluid communication with a connector bore thereof, and a flanged bore in fluid communication with the threaded bore. A perimeter surface of the flanged bore creates a shutoff with a pin during injection molding to form an insulative body of the assembly, and a perimeter surface of an insulative bore formed around the pin is preferably flush with that of the flanged bore of the contact component. A centerline axis of the flanged bore is preferably aligned with that of the threaded bore, for example, so that the molded insulative bore has a centerline axis aligned with that of the threaded bore of the contact component.
    Type: Application
    Filed: May 17, 2012
    Publication date: November 21, 2013
    Inventors: Andrew J. Ries, Jeevan M. Prasannakumar, Richard P. Nelson