Patents by Inventor Jeevan M. Prasannakumar
Jeevan M. Prasannakumar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11278717Abstract: A temporary medical electrical lead includes a connector pin and a single conductor coil. The coil being close-wound and having no turns of the coil distal portion being mechanically coupled together. The coil distal portion translates a force of no greater than 0.1 lbf (0.4 N) when strained 400%.Type: GrantFiled: August 28, 2018Date of Patent: March 22, 2022Assignee: Medtronic, Inc.Inventors: Thomas J. Steigauf, Eric H. Bonde, Phillip C. Falkner, Jeevan M. Prasannakumar, Brian T. Stolz, John Shishilla, Adam J. Rivard, Robert Sandgren, Seth Humphrys, Bernard Li
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Publication number: 20190060636Abstract: A temporary medical electrical lead includes a connector pin and a single conductor coil. The coil being close-wound and having no turns of the coil distal portion being mechanically coupled together. The coil distal portion translates a force of no greater than 0.1 lbf (0.4 N) when strained 400%.Type: ApplicationFiled: August 28, 2018Publication date: February 28, 2019Inventors: Thomas J. Steigauf, Eric H. Bonde, Phillip C. Falkner, Jeevan M. Prasannakumar, Brian T. Stolz, John Shishilla, Adam J. Rivard, Robert Sandgren, Seth Humphrys, Bernard Li
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Patent number: 9345185Abstract: Techniques for forming a header for an implantable medical device via a two-shot molding process are described. The two-shot molding processes may include a first molding step that creates a first-shot assembly and a second molding step that creates a second-shot assembly. The first-shot assembly may be formed to include one or more protrusions configured to interact with a second-shot mold and/or molding material in the second molding step. The second molding step may be configured to overmold the first-shot assembly. The header may include an attachment plate at least partially embedded in molding material and configured to be mechanically coupled to a body of the implantable medical device.Type: GrantFiled: November 14, 2012Date of Patent: May 17, 2016Assignee: Medtronic, Inc.Inventors: Jeevan M. Prasannakumar, Christopher M. Haenisch, David Bates, John C. Olson, George Patras, Yanzhu Zhao, Jason P. Weiand
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Patent number: 9079014Abstract: A contact component of an implantable medical device connector module assembly includes a threaded bore in fluid communication with a connector bore thereof, and a flanged bore in fluid communication with the threaded bore. A perimeter surface of the flanged bore creates a shutoff with a pin during injection molding to form an insulative body of the assembly, and a perimeter surface of an insulative bore formed around the pin is preferably flush with that of the flanged bore of the contact component. A centerline axis of the flanged bore is preferably aligned with that of the threaded bore, for example, so that the molded insulative bore has a centerline axis aligned with that of the threaded bore of the contact component.Type: GrantFiled: January 13, 2014Date of Patent: July 14, 2015Assignee: Medtronic, Inc.Inventors: Andrew J. Ries, Jeevan M. Prasannakumar, Richard P. Nelson
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Patent number: 8989872Abstract: Techniques for forming a header for an implantable medical device via a two-shot molding process are described. The two-shot molding processes may include a first molding step that creates a first-shot assembly and a second molding step that creates a second-shot assembly. The first-shot assembly may be formed to include one or more protrusions configured to interact with a second-shot mold and/or molding material in the second molding step. The second molding step may be configured to overmold the first-shot assembly. The header may include an attachment plate at least partially embedded in molding material and configured to be mechanically coupled to a body of the implantable medical device.Type: GrantFiled: November 14, 2012Date of Patent: March 24, 2015Assignee: Medtronic, Inc.Inventors: Jeevan M. Prasannakumar, Christopher M. Haenisch, David Bates, John C. Olson, George Patras, Yanzhu Zhao, Jason P. Weiand
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Patent number: 8945451Abstract: Methods for forming an insulative body of an implantable medical device connector module assembly employ an injection molding process, whereby first and second shots of insulative material form core and an overlay portions, respectively. In some methods, a panel portion of an electrical component is mounted between opposing surfaces of a mold such that a finger-like portion of the component extends into a cavity of the mold, with a first side thereof touching another surface of the mold and a second, opposite side exposed within the cavity; following first shot injection, the core portion captures the finger-like portion in relatively rigid relation thereto. When two types of connector bores are formed, a color indicator may be engaged with a feature of the core portion that is located in proximity to a connector bore of the first type, and then the overlay portion is formed over the indicator.Type: GrantFiled: May 17, 2012Date of Patent: February 3, 2015Assignee: Medtronic, Inc.Inventors: Andrew J. Ries, Jeevan M. Prasannakumar, Richard P. Nelson
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Publication number: 20140133123Abstract: Techniques for forming a header for an implantable medical device via a two-shot molding process are described. The two-shot molding processes may include a first molding step that creates a first-shot assembly and a second molding step that creates a second-shot assembly. The first-shot assembly may be formed to include one or more protrusions configured to interact with a second-shot mold and/or molding material in the second molding step. The second molding step may be configured to overmold the first-shot assembly. The header may include an attachment plate at least partially embedded in molding material and configured to be mechanically coupled to a body of the implantable medical device.Type: ApplicationFiled: November 14, 2012Publication date: May 15, 2014Applicant: MEDTRONIC, INC.Inventors: Jeevan M. Prasannakumar, Christopher M. Haenisch, David Bates, John C. Olson, George Patras, Yanzhu Zhao, Jason P. Weiand
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Publication number: 20140135882Abstract: Techniques for forming a header for an implantable medical device via a two-shot molding process are described. The two-shot molding processes may include a first molding step that creates a first-shot assembly and a second molding step that creates a second-shot assembly. The first-shot assembly may be formed to include one or more protrusions configured to interact with a second-shot mold and/or molding material in the second molding step. The second molding step may be configured to overmold the first-shot assembly. The header may include an attachment plate at least partially embedded in molding material and configured to be mechanically coupled to a body of the implantable medical device.Type: ApplicationFiled: November 14, 2012Publication date: May 15, 2014Applicant: MEDTRONIC, INC.Inventors: Jeevan M. Prasannakumar, Christopher M. Haenisch, David Bates, John C. Olson, George Patras, Yanzhu Zhao, Jason P. Weiand
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Publication number: 20140123490Abstract: A contact component of an implantable medical device connector module assembly includes a threaded bore in fluid communication with a connector bore thereof, and a flanged bore in fluid communication with the threaded bore. A perimeter surface of the flanged bore creates a shutoff with a pin during injection molding to form an insulative body of the assembly, and a perimeter surface of an insulative bore formed around the pin is preferably flush with that of the flanged bore of the contact component. A centerline axis of the flanged bore is preferably aligned with that of the threaded bore, for example, so that the molded insulative bore has a centerline axis aligned with that of the threaded bore of the contact component.Type: ApplicationFiled: January 13, 2014Publication date: May 8, 2014Inventors: Andrew J. Ries, Jeevan M. Prasannakumar, Richard P. Nelson
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Patent number: 8628348Abstract: A contact component of an implantable medical device connector module assembly includes a threaded bore in fluid communication with a connector bore thereof, and a flanged bore in fluid communication with the threaded bore. A perimeter surface of the flanged bore creates a shutoff with a pin during injection molding to form an insulative body of the assembly, and a perimeter surface of an insulative bore formed around the pin is preferably flush with that of the flanged bore of the contact component. A centerline axis of the flanged bore is preferably aligned with that of the threaded bore, for example, so that the molded insulative bore has a centerline axis aligned with that of the threaded bore of the contact component.Type: GrantFiled: May 17, 2012Date of Patent: January 14, 2014Assignee: Medtronic, Inc.Inventors: Andrew J. Ries, Jeevan M. Prasannakumar, Richard P. Nelson
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Publication number: 20130307184Abstract: Methods for forming an insulative body of an implantable medical device connector module assembly employ an injection molding process, whereby first and second shots of insulative material form core and an overlay portions, respectively. In some methods, a panel portion of an electrical component is mounted between opposing surfaces of a mold such that a finger-like portion of the component extends into a cavity of the mold, with a first side thereof touching another surface of the mold and a second, opposite side exposed within the cavity; following first shot injection, the core portion captures the finger-like portion in relatively rigid relation thereto. When two types of connector bores are formed, a color indicator may be engaged with a feature of the core portion that is located in proximity to a connector bore of the first type, and then the overlay portion is formed over the indicator.Type: ApplicationFiled: May 17, 2012Publication date: November 21, 2013Inventors: Andrew J. Ries, Jeevan M. Prasannakumar, Richard P. Nelson
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Publication number: 20130309889Abstract: A contact component of an implantable medical device connector module assembly includes a threaded bore in fluid communication with a connector bore thereof, and a flanged bore in fluid communication with the threaded bore. A perimeter surface of the flanged bore creates a shutoff with a pin during injection molding to form an insulative body of the assembly, and a perimeter surface of an insulative bore formed around the pin is preferably flush with that of the flanged bore of the contact component. A centerline axis of the flanged bore is preferably aligned with that of the threaded bore, for example, so that the molded insulative bore has a centerline axis aligned with that of the threaded bore of the contact component.Type: ApplicationFiled: May 17, 2012Publication date: November 21, 2013Inventors: Andrew J. Ries, Jeevan M. Prasannakumar, Richard P. Nelson