Patents by Inventor Jeff Alan Gordon

Jeff Alan Gordon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8338955
    Abstract: An integrated circuit package comprising an enclosure including a dielectric housing, a first electrical contact, and a second electrical contact. The dielectric housing, the first electrical contact, and the second electrical contact are configured to form a contact side of the enclosure. In addition, the first and second electrical contacts are sized to be substantially alignment insensitive for electro-mechanical connection to corresponding contacts of an end-use equipment. The enclosure encapsulates an integrated circuit die which is electrically coupled to the first and second electrical contacts. The alignment insensitive first and second electrical contacts may be electro-mechanically connected to corresponding contacts of an end-use equipment (e.g., a printer). Further, the integrated circuit package may be hosted by a peripheral device (e.g., a printer cartridge).
    Type: Grant
    Filed: April 5, 2007
    Date of Patent: December 25, 2012
    Assignee: Maxim Integrated Products, Inc.
    Inventors: Jeff Alan Gordon, Steven Hass, Hal Kurkowski, Scott Jones
  • Patent number: 7675166
    Abstract: An integrated circuit package comprising an enclosure including a dielectric housing, a first electrical contact, and a second electrical contact. The dielectric housing, the first electrical contact, and the second electrical contact are configured to form a contact side of the enclosure. In addition, the first and second electrical contacts are sized to be substantially alignment insensitive for electro-mechanical connection to corresponding contacts of an end-use equipment. The enclosure encapsulates an integrated circuit die which is electrically coupled to the first and second electrical contacts. The alignment insensitive first and second electrical contacts may be electro-mechanically connected to corresponding contacts of an end-use equipment (e.g., a printer). Further, the integrated circuit package may be hosted by a peripheral device (e.g., a printer cartridge).
    Type: Grant
    Filed: May 11, 2005
    Date of Patent: March 9, 2010
    Assignee: Maxim Integrated Products, Inc.
    Inventors: Jeff Alan Gordon, Steven N. Hass, Hal Kurkowski, Scott Jones
  • Publication number: 20080197504
    Abstract: An integrated circuit package comprising an enclosure including a dielectric housing, a first electrical contact, and a second electrical contact. The dielectric housing, the first electrical contact, and the second electrical contact are configured to form a contact side of the enclosure. In addition, the first and second electrical contacts are sized to be substantially alignment insensitive for electro-mechanical connection to corresponding contacts of an end-use equipment. The enclosure encapsulates an integrated circuit die which is electrically coupled to the first and second electrical contacts. The alignment insensitive first and second electrical contacts may be electro-mechanically connected to corresponding contacts of an end-use equipment (e.g., a printer). Further, the integrated circuit package may be hosted by a peripheral device (e.g., a printer cartridge).
    Type: Application
    Filed: April 5, 2007
    Publication date: August 21, 2008
    Applicant: MAXIM INTEGRATED PRODUCTS, INC.
    Inventors: Jeff Alan Gordon, Steven Hass, Hal Kurkowski, Scott Jones