Abstract: Compositions useful in semiconductor manufacturing for surface preparation and/or cleaning of wafer substrates such as semiconductor device precursor structures. The compositions can be employed for processing of wafers that have, or are intended to be further processed to include, copper metallization, e.g., in operations such as surface preparation, pre-plating cleaning, post-etching cleaning, and post-chemical mechanical polishing cleaning of semiconductor wafers. The compositions contain (i) alkanolamine, (ii) quaternary ammonium hydroxide and (iii) a complexing agent, and are storage-stable, as well as non-darkening and degradation-resistant in exposure to oxygen.

Abstract: The present invention relates to a system and methods generally aimed at monitoring the trajectory of surgical instruments and especially for monitoring the trajectory of surgical instrument used during pedicle fixation to ensure the proper placement of pedicle screws.

Abstract: Compositions useful in semiconductor manufacturing for surface preparation and/or cleaning of wafer substrates such as semiconductor device precursor structures. The compositions can be employed for processing of wafers that have, or are intended to be further processed to include, copper metallization, e.g., in operations such as surface preparation, pre-plating cleaning, post-etching cleaning, and post-chemical mechanical polishing cleaning of semiconductor wafers. The compositions contain (i) alkanolamine, (ii) quaternary ammonium hydroxide and (iii) a complexing agent, and are storage-stable, as well as non-darkening and degradation-resistant in exposure to oxygen.

Abstract: A cleaning solution for cleaning microelectronic substrates, particularly for post-CMP or via formation cleaning. The cleaning solution comprises a quaternary ammonium hydroxide, an organic amine, a corrosion inhibitor, optionally an organic acid, and water. A preferred cleaning solution comprises tetramethylammonium hydroxide, monoethylanolamine, gallic acid ascorbic acid, and water with the alkalinity of the cleaning solution greater than 0.073 milliequivalents base per gram of solution.

Abstract: A system and method to enable the remote supervision and operation of a call center over wireless network links. The invention pipes supervisory information from call centers, such as call waiting time, number of available of agents, oldest call waiting and other information and statistics to a remote transceiver which presents a supervisor with a user interface such as a graphical, textual or audible presentation depicting the state of the call center. The transceiver enables supervisors to remotely monitor the call center/network status, reconfigure and react to changes and exceptions on a real time basis no matter where they are located. A supervisor using the remote transceiver may transmit on the uplink to the call center a request for data, or commands for adjustment of the operation, such as rerouting of calls or direction to increase agents.

Abstract: A cleaning solution for cleaning microelectronic substrates, particularly for post-CMP or via formation cleaning. The cleaning solution comprises a quaternary ammonium hydroxide, an organic amine, a corrosion inhibitor, and water. A preferred cleaning solution comprises tetramethylammonium hydroxide, monoethylanolamine, ascorbic acid, and water with the alkalinity of the cleaning solution greater than 0.073 milliequivalents base per gram of solution.

Abstract: A cleaning solution for cleaning microelectronic substrates, particularly for post-CMP or via formation cleaning. The cleaning solution comprises a quaternary ammonium hydroxide, an organic amine, a corrosion inhibitor, optionally an organic acid, and water. A preferred cleaning solution comprises tetramethylammonium hydroxide, monoethylanolamine, gallic acid ascorbic acid, and water with the alkalinity of the cleaning solution greater than 0.073 milliequivalents base per gram of solution.

Abstract: A cleaning solution is provided for cleaning copper-containing microelectronic substrates, particularly for post-CMP or Via formation cleaning. The cleaning solution comprises a quaternary ammonium hydroxide, an organic amine, a corrosion inhibitor, and water. A preferred cleaning solution comprises tetramethylammonium hydroxide, monoethanolamine, gallic acid, and water. The pH of the cleaning solution is greater than 10.

Abstract: A protective covering for a swim platform located on a boat is provided. The protective covering may be detachably attached over the top of a swim platform, such as those platforms which are located about the rear of boats or other marine craft. Use of the protective covering will prevent waterfowl or other animals from defecating, loitering or nesting on the swim platform. The covering includes a generally rectangular portion located intermediate a right wing portion and a left wing portion. A plurality of apertures designed to secure the covering to the swim platform are provided on the rectangular portion, right wing portion and left wing portion. Both the right wing and the left wing fold forming a right sidewall and a left sidewall. The sidewalls and rectangular portion form a hollow, generally triangular structure which is placed atop and resides in the area immediately atop the swim platform. The covering is securely attached to the swim platform by any of a variety of attachment means.