Patents by Inventor Jeff Blackwood
Jeff Blackwood has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10283317Abstract: A method for TEM sample preparation and analysis that can be used in a FIB-SEM system without re-welds, unloads, user handling of the lamella, or a motorized flip stage. The method allows a dual beam FIB-SEM system with a typical tilt stage to be used to extract a sample to from a substrate, mount the sample onto a TEM sample holder capable of tilting, thin the sample using FIB milling, and rotate the sample so that the sample face is perpendicular to an electron column for STEM imaging.Type: GrantFiled: May 15, 2017Date of Patent: May 7, 2019Assignee: FEI CompanyInventors: Paul Keady, Brennan Peterson, Guus Das, Craig Matthew Henry, Larry Dworkin, Jeff Blackwood, Stacey Stone, Michael Schmidt
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Publication number: 20170250055Abstract: A method for TEM sample preparation and analysis that can be used in a FIB-SEM system without re-welds, unloads, user handling of the lamella, or a motorized flip stage. The method allows a dual beam FIB-SEM system with a typical tilt stage to be used to extract a sample to from a substrate, mount the sample onto a TEM sample holder capable of tilting, thin the sample using FIB milling, and rotate the sample so that the sample face is perpendicular to an electron column for STEM imaging.Type: ApplicationFiled: May 15, 2017Publication date: August 31, 2017Applicant: FEI CompanyInventors: Paul Keady, Brennan Peterson, Guus Das, Craig Matthew Henry, Larry Dworkin, Jeff Blackwood, Stacey Stone, Michael Schmidt
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Patent number: 9653260Abstract: A method for TEM sample preparation and analysis that can be used in a FIB-SEM system without re-welds, unloads, user handling of the lamella, or a motorized flip stage. The method allows a dual beam FIB-SEM system with a typical tilt stage to be used to extract a sample to from a substrate, mount the sample onto a TEM sample holder capable of tilting, thin the sample using FIB milling, and rotate the sample so that the sample face is perpendicular to an electron column for STEM imaging.Type: GrantFiled: November 30, 2012Date of Patent: May 16, 2017Assignee: FEI CompanyInventors: Paul Keady, Brennan Peterson, Guus Das, Craig Henry, Larry Dworkin, Jeff Blackwood, Stacey Stone, Michael Schmidt
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Patent number: 9263306Abstract: A protective layer is applied to a work piece to protect the surface during charged particle beam processing by directing a fluid toward the surface. The surface is preferably not touched by the applicator. Ink jet print-type print heads are suitable applicators. Ink jet-type print heads allow a wide variety of fluids to be used to form the protective layer. Useful fluids that form protective layers include colloidal silica having small silver particles and hydrocarbon-based inks.Type: GrantFiled: January 6, 2012Date of Patent: February 16, 2016Assignee: FEI CompanyInventors: Jeff Blackwood, Stacey Stone
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Patent number: 8859963Abstract: A method and apparatus for preparing thin TEM samples in a manner that reduces or prevents bending and curtaining is realized. Embodiments of the present invention deposit material onto the face of a TEM sample during the process of preparing the sample. In some embodiments, the material can be deposited on a sample face that has already been thinned before the opposite face is thinned, which can serve to reinforce the structural integrity of the sample and refill areas that have been over-thinned due to a curtaining phenomena. In other embodiments, material can also be deposited onto the face being milled, which can serve to reduce or eliminate curtaining on the sample face.Type: GrantFiled: May 25, 2012Date of Patent: October 14, 2014Assignee: FEI CompanyInventors: Michael Moriarty, Stacey Stone, Jeff Blackwood
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Publication number: 20130248354Abstract: A method for TEM sample preparation and analysis that can be used in a FIB-SEM system without re-welds, unloads, user handling of the lamella, or a motorized flip stage. The method allows a dual beam FIB-SEM system with a typical tilt stage to be used to extract a sample to from a substrate, mount the sample onto a TEM sample holder capable of tilting, thin the sample using FIB milling, and rotate the sample so that the sample face is perpendicular to an electron column for STEM imaging.Type: ApplicationFiled: November 30, 2012Publication date: September 26, 2013Inventors: Paul Keady, Brennan Peterson, Guus Das, Craig Henry, Larry Dworkin, Jeff Blackwood, Stacey Stone, Michael Schmidt
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Patent number: 8536525Abstract: An improved method and apparatus for S/TEM sample preparation and analysis. Preferred embodiments of the present invention provide improved methods for TEM sample creation, especially for small geometry (<100 nm thick) TEM lamellae. A novel sample structure and a novel use of a milling pattern allow the creation of S/TEM samples as thin as 50 nm without significant bowing or warping. Preferred embodiments of the present invention provide methods to partially or fully automate TEM sample creation, to make the process of creating and analyzing TEM samples less labor intensive, and to increase throughput and reproducibility of TEM analysis.Type: GrantFiled: February 27, 2012Date of Patent: September 17, 2013Assignee: FEI CompanyInventors: Jeff Blackwood, Stacey Stone
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Patent number: 8525137Abstract: An improved method and apparatus for S/TEM sample preparation and analysis. Preferred embodiments of the present invention provide improved methods for TEM sample creation, especially for small geometry (<100 nm thick) TEM lamellae. A novel sample structure and a novel use of a milling pattern allow the creation of S/TEM samples as thin as 50 nm without significant bowing or warping. Preferred embodiments of the present invention provide methods to partially or fully automate TEM sample creation, to make the process of creating and analyzing TEM samples less labor intensive, and to increase throughput and reproducibility of TEM analysis.Type: GrantFiled: October 22, 2007Date of Patent: September 3, 2013Assignee: Fei CompanyInventors: Jeff Blackwood, Stacey Stone, Jason Arjavac
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Publication number: 20130143412Abstract: A method and apparatus for preparing thin TEM samples in a manner that reduces or prevents bending and curtaining is realized. Embodiments of the present invention deposit material onto the face of a TEM sample during the process of preparing the sample. In some embodiments, the material can be deposited on a sample face that has already been thinned before the opposite face is thinned, which can serve to reinforce the structural integrity of the sample and refill areas that have been over-thinned due to a curtaining phenomena. In other embodiments, material can also be deposited onto the face being milled, which can serve to reduce or eliminate curtaining on the sample face.Type: ApplicationFiled: May 25, 2012Publication date: June 6, 2013Applicant: FEI CompanyInventors: Michael Moriarty, Stacey Stone, Jeff Blackwood
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Publication number: 20120152731Abstract: An improved method and apparatus for S/TEM sample preparation and analysis. Preferred embodiments of the present invention provide improved methods for TEM sample creation, especially for small geometry (<100 nm thick) TEM lamellae. A novel sample structure and a novel use of a milling pattern allow the creation of S/TEM samples as thin as 50 nm without significant bowing or warping. Preferred embodiments of the present invention provide methods to partially or fully automate TEM sample creation, to make the process of creating and analyzing TEM samples less labor intensive, and to increase throughput and reproducibility of TEM analysis.Type: ApplicationFiled: February 27, 2012Publication date: June 21, 2012Applicant: FEI COMPANYInventors: Jeff Blackwood, Stacey Stone
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Publication number: 20120107521Abstract: A protective layer is applied to a work piece to protect the surface during charged particle beam processing by directing a fluid toward the surface. The surface is preferably not touched by the applicator. Ink jet print-type print heads are suitable applicators. Ink jet-type print heads allow a wide variety of fluids to be used to form the protective layer. Useful fluids that form protective layers include colloidal silica having small silver particles and hydrocarbon-based inks.Type: ApplicationFiled: January 6, 2012Publication date: May 3, 2012Applicant: FEI COMPANYInventors: Jeff Blackwood, Stacey Stone
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Patent number: 8134124Abstract: An improved method and apparatus for S/TEM sample preparation and analysis. Preferred embodiments of the present invention provide improved methods for TEM sample creation, especially for small geometry (<100 nm thick) TEM lamellae. A novel sample structure and a novel use of a milling pattern allow the creation of S/TEM samples as thin as 50 nm without significant bowing or warping. Preferred embodiments of the present invention provide methods to partially or fully automate TEM sample creation, to make the process of creating and analyzing TEM samples less labor intensive, and to increase throughput and reproducibility of TEM analysis.Type: GrantFiled: October 22, 2007Date of Patent: March 13, 2012Assignee: FEI CompanyInventors: Jeff Blackwood, Stacey Stone
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Patent number: 8097308Abstract: A protective layer is applied to a work piece to protect the surface during charged particle beam processing by directing a fluid toward the surface. The surface is preferably not touched by the applicator. Ink jet print-type print heads are suitable applicators. Ink jet-type print heads allow a wide variety of fluids to be used to form the protective layer. Useful fluids that form protective layers include colloidal silica having small silver particles and hydrocarbon-based inks.Type: GrantFiled: October 30, 2007Date of Patent: January 17, 2012Assignee: FEI CompanyInventors: Jeff Blackwood, Stacey Stone
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Publication number: 20100308219Abstract: An improved method and apparatus for S/TEM sample preparation and analysis. Preferred embodiments of the present invention provide improved methods for TEM sample creation, especially for small geometry (<100 nm thick) TEM lamellae. A novel sample structure and a novel use of a milling pattern allow the creation of S/TEM samples as thin as 50 nm without significant bowing or warping. Preferred embodiments of the present invention provide methods to partially or fully automate TEM sample creation, to make the process of creating and analyzing TEM samples less labor intensive, and to increase throughput and reproducibility of TEM analysis.Type: ApplicationFiled: October 22, 2007Publication date: December 9, 2010Applicant: FEI COMPANYInventors: Jeff Blackwood, Stacey Stone, Jason Arjavac
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Publication number: 20100300873Abstract: An improved method and apparatus for S/TEM sample preparation and analysis. Preferred embodiments of the present invention provide improved methods for TEM sample creation, especially for small geometry (<100 nm thick) TEM lamellae. A novel sample structure and a novel use of a milling pattern allow the creation of S/TEM samples as thin as 50 nm without significant bowing or warping. Preferred embodiments of the present invention provide methods to partially or fully automate TEM sample creation, to make the process of creating and analyzing TEM samples less labor intensive, and to increase throughput and reproducibility of TEM analysis.Type: ApplicationFiled: October 22, 2007Publication date: December 2, 2010Applicant: FEI COMPANYInventors: Jeff Blackwood, Stacey Stone
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Patent number: 7675049Abstract: A coating is applied to a work piece in a charged particle beam system without directing the beam to work piece. The coating is applied by sputtering, either within the charged particle beam vacuum chamber or outside the charged particle beam vacuum chamber. In one embodiment, the sputtering is performed by directing the charged particle beam to a sputter material source, such as a needle from a gas injection system. Material is sputtered from the sputter material source onto the work piece to form, for example, a protective or conductive coating, without requiring the beam to be directed to the work piece, thereby reducing or eliminating damage to the work piece.Type: GrantFiled: February 14, 2007Date of Patent: March 9, 2010Assignee: FEI CompanyInventors: Michael Schmidt, Jeff Blackwood
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Publication number: 20080102224Abstract: A protective layer is applied to a work piece to protect the surface during charged particle beam processing by directing a fluid toward the surface. The surface is preferably not touched by the applicator. Ink jet print-type print heads are suitable applicators. Ink jet-type print heads allow a wide variety of fluids to be used to form the protective layer. Useful fluids that form protective layers include colloidal silica having small silver particles and hydrocarbon-based inks.Type: ApplicationFiled: October 30, 2007Publication date: May 1, 2008Applicant: FEI COMPANYInventors: JEFF BLACKWOOD, Stacey Stone
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Publication number: 20080073587Abstract: A coating is applied to a work piece in a charged particle beam system without directing the beam to work piece. The coating is applied by sputtering, either within the charged particle beam vacuum chamber or outside the charged particle beam vacuum chamber. In one embodiment, the sputtering is performed by directing the charged particle beam to a sputter material source, such as a needle from a gas injection system. Material is sputtered from the sputter material source onto the work piece to form, for example, a protective or conductive coating, without requiring the beam to be directed to the work piece, thereby reducing or eliminating damage to the work piece.Type: ApplicationFiled: February 14, 2007Publication date: March 27, 2008Applicant: FEI CompanyInventors: Michael Schmidt, Jeff Blackwood
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Patent number: 6847123Abstract: A silicon device which includes a silicon substrate and a bond pad array on the silicon substrate which is configured to be conductively connected to bond wire. The bond pad array consists of a plurality of bond pads which are vertically staggered on the silicon substrate. The vertical staggering allows the bond pads to be packed closer together on the silicon substrate, thereby reducing the horizontal space which is consumed by the bond pads on the silicon substrate, and thereby resulting in a reduction in die size. Preferably, the bond pads are also horizontally staggered on the silicon substrate, thereby allowing the bond pads to be spaced even closer together.Type: GrantFiled: April 2, 2002Date of Patent: January 25, 2005Assignee: LSI Logic CorporationInventor: Jeff Blackwood
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Publication number: 20030183953Abstract: A silicon device which includes a silicon substrate and a bond pad array on the silicon substrate which is configured to be conductively connected to bond wire. The bond pad array consists of a plurality of bond pads which are vertically staggered on the silicon substrate. The vertical staggering allows the bond pads to be packed closer together on the silicon substrate, thereby reducing the horizontal space which is consumed by the bond pads on the silicon substrate, and thereby resulting in a reduction in die size. Preferably, the bond pads are also horizontally staggered on the silicon substrate, thereby allowing the bond pads to be spaced even closer together.Type: ApplicationFiled: April 2, 2002Publication date: October 2, 2003Inventor: Jeff Blackwood