Abstract: An electrical connector assembly (10) is mounted on a printed circuit board (18) and includes a flexible etched circuit (FEC) (15) with electrical traces thereon. The FEC (15) is part of an electrical circuit which includes electrical components (22,24), electrical contacts (23), a ground path (12, 12a), and an electrical connection (90). The FEC can include various electrical components (22,24), for example, in order to filter the electrical circuit.

Abstract: A system for automatically laying out and graphically displaying the topology of a computer network system. The layout system retrieves a list of the nodes within the network and their interconnections from a database which can be manually built by a network administrator or automatically constructed by other software. The system will provide any of three views that can be requested by the user. An internet view is the largest and shows the interconnection of different networks. A network view can be shown for any of the networks described in the internet view. A network is comprised of segments and the system will display a view of the nodes connected to any one of the segments. The system will automatically update the view as new nodes become available in the database. This aspect of the system and allows the system to dynamically update the graph when the list of nodes is being supplied by other software.

Abstract: Disclosed is a computer network node discovery system that provides a general way of discovering network elements, or nodes, connected to a computer network, and a specific algorithm for discovering nodes connected to a TCP/IP network, using the SNMP protocol available within the TCP/IP network software. Some nodes on a network, called discovery agents, can convey knowledge of the existence of other nodes on the network. The network discovery system queries these agents and obtains the information they have about other nodes on the network. It then queries each of the nodes obtained to determine if that node is also a discovery agent. In this manner, most of the nodes on a network can be discovered. The process of querying discovery agents to obtain a list of nodes known to the discovery agents is repeated at timed intervals to obtain information about nodes that are not always active.

Abstract: Invention is directed to a method of metallurgically bonding a layer of a first material, such as gold, to the surface of a second material, such as copper, by the use of the driving force of the energy from a pulsed laser. The method comprises the steps of selecting a thin polymeric film, where said polymer is characterized by a high optical coefficient of absorption at the wavelength of said laser, and applying to said polymeric film a thin layer of said first material for bonding to the second material. The second material is placed in close proximity to the thin layer of the first material. Intermediate the laser and the target a rotating optical scanner is provided to intercept the beam of the laser prior to directing the focused beam thereof toward the polymeric film. The repetition rate of the laser is synchronized with the rotating optical scanner to cause the focused beam of the laser to move across said polymeric film at a velocity less than the velocity of sound through the material.

Abstract: This invention is directed to a method for producing a smooth and continuous pressure bonded layer of a material such as gold or other precious metal, to a substrate, such as a metal substrate, through the driving force of a pulsed laser. The method comprises the steps of selecting a laser transparent substrate, applying thereto a thin polymeric film, where said polymer is characterized by a high optical coefficient of absorption to the wavelength of said laser. Preferably, such coefficient is at least 2.times.10.sup.4 cm.sup.-1. To the polymeric film, a thin layer or film of the material, such as gold is applied. Thereafter, the laser transparent substrate, containing the dual layers is placed in close proximity to the substrate or workpiece upon which such material is to be deposited.

Abstract: The present invention is directed to a beam allocation and delivery system for an excimer laser in which substantially the full energy from such laser is delivered to a precise area or areas of a workpiece. This efficient system is achieved by the use of one or more elongated light-guides to direct the laser beam. Included therewith are means to shape and focus said beam to a reduced image on the workpiece. Preferably, the shaping and focussing is achieved by changing the cross-section of the light-guide from a first configuration to a second configuration, and by an imaging lens.

Abstract: This invention relates to a method for controlling or limiting the formation of an oxide layer on a metallic substrate such as nickel or nickel alloy, over which a polymeric plating resist has been placed, then selectively removed by a focussed excimer laser beam applied thereto. The method comprises the steps of applying a carbon-containing polymeric plating resist to a metal substrate having an oxide layer thereon of a thickness between about 20 to 40.ANG.. Thereafter, a selected area of said resist coated metal substrate is subjected to a single shot from an excimer laser to ablate said resist from within said area, wherein the laser energy is absorbed primarily at the metallic substrate and the energy density of the said laser is in excess of that required to ablate so as to produce a thin uniform layer of oxide over said substrate, said oxide layer, principally nickel oxide, having a thickness no greater than about 7.ANG..

Abstract: A method of cleaning a metal surface by means of a laser to improve the surface characteristics, prior to plating thereover with a noble metal, such as gold. More particularly, the method hereof includes the steps of illuminating the desired areas of said metal surface with a laser beam; provided, however, the laser power density is controlled to vaporize surface contaminants and embedded foreign materials, without significantly altering the properties of the metal, in preparation for plating said cleaned areas with said noble metal.

Abstract: A method for the selective plating of a metal substrate on which a thin polymeric plating resist is first applied, followed by the selective removal of said resist to expose portions of said substrate to plating, and plating. More particularly, the method hereof includes the steps of selecting a laser wavelength which couples well to the metal substrate, choosing a polymer based plating resist having a low optical coefficient of absorption at said wavelength, curing said resist, subjecting selective areas of said resist to a single excimer laser shot, having a short wavelength, to cause ablative removal of the resist over the selective areas of said substrate, and subjecting said exposed portions of said substrate to metal plating.

Abstract: A method and apparatus for improving the integrity of metal plated composites is disclosed. Plating improvements are achieved by first irradiating a nickel plated substrate, prior to application of a noble metal plating layer, to smooth any surface discontinuities or irregularities. Excimer laser pulses, having a duration of less than 100 nanoseconds, are employed to partially liquefy the upper surface of the nickel plating on the substrate. This invention is compatible with conventional plating processes, such as electroplating.